CN101009160B - 叠层型固体电解电容器 - Google Patents
叠层型固体电解电容器 Download PDFInfo
- Publication number
- CN101009160B CN101009160B CN2007100043115A CN200710004311A CN101009160B CN 101009160 B CN101009160 B CN 101009160B CN 2007100043115 A CN2007100043115 A CN 2007100043115A CN 200710004311 A CN200710004311 A CN 200710004311A CN 101009160 B CN101009160 B CN 101009160B
- Authority
- CN
- China
- Prior art keywords
- solid electrolytic
- electrolytic condenser
- paillon foil
- substrate
- laminated solid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000007787 solid Substances 0.000 title claims abstract description 67
- 239000003990 capacitor Substances 0.000 claims abstract description 89
- 239000000758 substrate Substances 0.000 claims abstract description 50
- 229910052751 metal Inorganic materials 0.000 claims abstract description 48
- 239000002184 metal Substances 0.000 claims abstract description 48
- 239000011888 foil Substances 0.000 claims description 72
- 239000007784 solid electrolyte Substances 0.000 claims description 31
- 238000002955 isolation Methods 0.000 claims description 12
- 239000002245 particle Substances 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- 239000011521 glass Substances 0.000 claims description 8
- 230000004888 barrier function Effects 0.000 claims description 7
- 229910052799 carbon Inorganic materials 0.000 claims description 7
- 229910000831 Steel Inorganic materials 0.000 description 10
- 239000010959 steel Substances 0.000 description 10
- 239000000126 substance Substances 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 9
- 239000002904 solvent Substances 0.000 description 9
- 239000005030 aluminium foil Substances 0.000 description 8
- 239000003822 epoxy resin Substances 0.000 description 8
- 229920000647 polyepoxide Polymers 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 229910017052 cobalt Inorganic materials 0.000 description 6
- 239000010941 cobalt Substances 0.000 description 6
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000000178 monomer Substances 0.000 description 6
- 239000007800 oxidant agent Substances 0.000 description 6
- 230000001590 oxidative effect Effects 0.000 description 6
- 238000003466 welding Methods 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000005755 formation reaction Methods 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- FLDCSPABIQBYKP-UHFFFAOYSA-N 5-chloro-1,2-dimethylbenzimidazole Chemical compound ClC1=CC=C2N(C)C(C)=NC2=C1 FLDCSPABIQBYKP-UHFFFAOYSA-N 0.000 description 3
- 239000001741 Ammonium adipate Substances 0.000 description 3
- 235000019293 ammonium adipate Nutrition 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 3
- 238000006731 degradation reaction Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
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- 238000002156 mixing Methods 0.000 description 2
- 238000010023 transfer printing Methods 0.000 description 2
- 229920002972 Acrylic fiber Polymers 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000001722 carbon compounds Chemical class 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
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- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
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- 238000009413 insulation Methods 0.000 description 1
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- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/14—Structural combinations or circuits for modifying, or compensating for, electric characteristics of electrolytic capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/06—Mounting in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/15—Solid electrolytic capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Electric Double-Layer Capacitors Or The Like (AREA)
Abstract
Description
电容(μF) | tanδ(%) | 漏电流(μA/2分钟) | ESR(mΩ) | |
示例1 | 1084 | 2.7 | 165 | 2.3 |
示例2 | 1108 | 1.9 | 158 | 2.2 |
对比示例 | 987 | 3.5 | 213 | 4.3 |
Claims (11)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006-014467 | 2006-01-23 | ||
JP2006014467 | 2006-01-23 | ||
JP2006014467A JP2007200950A (ja) | 2006-01-23 | 2006-01-23 | 積層型固体電解コンデンサ |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101009160A CN101009160A (zh) | 2007-08-01 |
CN101009160B true CN101009160B (zh) | 2010-05-19 |
Family
ID=38285302
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007100043115A Expired - Fee Related CN101009160B (zh) | 2006-01-23 | 2007-01-22 | 叠层型固体电解电容器 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7312979B2 (zh) |
JP (1) | JP2007200950A (zh) |
KR (1) | KR100869440B1 (zh) |
CN (1) | CN101009160B (zh) |
TW (1) | TWI330853B (zh) |
Families Citing this family (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4803744B2 (ja) * | 2007-05-22 | 2011-10-26 | Necトーキン株式会社 | 薄型固体電解コンデンサ |
US8094434B2 (en) | 2008-04-01 | 2012-01-10 | Avx Corporation | Hermetically sealed capacitor assembly |
US7929274B2 (en) * | 2008-04-03 | 2011-04-19 | Kemet Electronics Corporation | Capacitor with sacrificial lead wire configuration and improved manufacturing method thereof |
CN102149294B (zh) * | 2008-09-09 | 2016-08-24 | 株式会社Ndc | 手套及其附件 |
TWI395244B (zh) * | 2009-07-10 | 2013-05-01 | 片狀堆疊式固態電解電容器 | |
TWI474353B (en) * | 2009-08-14 | 2015-02-21 | Capacitor package structure using smt | |
US8194395B2 (en) | 2009-10-08 | 2012-06-05 | Avx Corporation | Hermetically sealed capacitor assembly |
CN102074382B (zh) * | 2009-11-19 | 2014-04-23 | 钰邦电子(无锡)有限公司 | 一种具有多端引出脚的堆栈式固态电解电容器 |
CN102074354B (zh) * | 2009-11-20 | 2014-04-23 | 钰邦电子(无锡)有限公司 | 具有多端正极引出脚的堆栈电容 |
CN102142321B (zh) * | 2010-02-03 | 2014-08-13 | 钰邦电子(无锡)有限公司 | 一种堆栈式固态电解电容器 |
CN102142323B (zh) * | 2010-02-03 | 2014-04-23 | 钰邦电子(无锡)有限公司 | 堆栈式固态电解电容器 |
CN102142322B (zh) * | 2010-02-03 | 2014-04-23 | 钰邦电子(无锡)有限公司 | 片状堆栈式固态电解电容器 |
KR101079497B1 (ko) * | 2010-02-16 | 2011-11-03 | 삼성전기주식회사 | 전기 이중층 커패시터 셀과 전기 이중층 커패시터의 제조방법 및 전기 이중층 커패시터 셀의 제조장치 |
US8279584B2 (en) | 2010-08-12 | 2012-10-02 | Avx Corporation | Solid electrolytic capacitor assembly |
US8824122B2 (en) | 2010-11-01 | 2014-09-02 | Avx Corporation | Solid electrolytic capacitor for use in high voltage and high temperature applications |
US8379372B2 (en) | 2011-04-07 | 2013-02-19 | Avx Corporation | Housing configuration for a solid electrolytic capacitor |
US8300387B1 (en) | 2011-04-07 | 2012-10-30 | Avx Corporation | Hermetically sealed electrolytic capacitor with enhanced mechanical stability |
US8947857B2 (en) | 2011-04-07 | 2015-02-03 | Avx Corporation | Manganese oxide capacitor for use in extreme environments |
US9767964B2 (en) | 2011-04-07 | 2017-09-19 | Avx Corporation | Multi-anode solid electrolytic capacitor assembly |
DE102013101443A1 (de) | 2012-03-01 | 2013-09-05 | Avx Corporation | Ultrahigh voltage solid electrolytic capacitor |
JP2013219362A (ja) | 2012-04-11 | 2013-10-24 | Avx Corp | 過酷な条件下で強化された機械的安定性を有する固体電解コンデンサ |
JP5585618B2 (ja) * | 2012-07-03 | 2014-09-10 | 株式会社村田製作所 | 固体電解コンデンサおよびその製造方法 |
JP5933397B2 (ja) | 2012-08-30 | 2016-06-08 | エイヴィーエックス コーポレイション | 固体電解コンデンサの製造方法および固体電解コンデンサ |
WO2014050111A1 (ja) * | 2012-09-28 | 2014-04-03 | 三洋電機株式会社 | 固体電解コンデンサ |
US9324503B2 (en) | 2013-03-15 | 2016-04-26 | Avx Corporation | Solid electrolytic capacitor |
US9824826B2 (en) | 2013-05-13 | 2017-11-21 | Avx Corporation | Solid electrolytic capacitor containing conductive polymer particles |
US9472350B2 (en) | 2013-05-13 | 2016-10-18 | Avx Corporation | Solid electrolytic capacitor containing a multi-layered adhesion coating |
US9892862B2 (en) | 2013-05-13 | 2018-02-13 | Avx Corporation | Solid electrolytic capacitor containing a pre-coat layer |
US10014108B2 (en) | 2015-03-13 | 2018-07-03 | Avx Corporation | Low profile multi-anode assembly |
US9754730B2 (en) | 2015-03-13 | 2017-09-05 | Avx Corporation | Low profile multi-anode assembly in cylindrical housing |
US10297393B2 (en) | 2015-03-13 | 2019-05-21 | Avx Corporation | Ultrahigh voltage capacitor assembly |
US9928963B2 (en) | 2015-03-13 | 2018-03-27 | Avx Corporation | Thermally conductive encapsulant material for a capacitor assembly |
CN105140040A (zh) * | 2015-09-25 | 2015-12-09 | 株洲宏达电子有限公司 | 一种陶瓷封装结构片式固体钽电容器及其封装方法 |
US10431389B2 (en) | 2016-11-14 | 2019-10-01 | Avx Corporation | Solid electrolytic capacitor for high voltage environments |
US11232913B2 (en) | 2017-01-13 | 2022-01-25 | Panasonic Intellectual Property Management Co., Ltd. | Electrolytic capacitor |
US11081288B1 (en) | 2018-08-10 | 2021-08-03 | Avx Corporation | Solid electrolytic capacitor having a reduced anomalous charging characteristic |
US11380492B1 (en) | 2018-12-11 | 2022-07-05 | KYOCERA AVX Components Corporation | Solid electrolytic capacitor |
US11756742B1 (en) | 2019-12-10 | 2023-09-12 | KYOCERA AVX Components Corporation | Tantalum capacitor with improved leakage current stability at high temperatures |
US11763998B1 (en) | 2020-06-03 | 2023-09-19 | KYOCERA AVX Components Corporation | Solid electrolytic capacitor |
CN113658805A (zh) * | 2021-08-31 | 2021-11-16 | 湖南艾华集团股份有限公司 | 一种耐高湿叠层铝电解电容器及其制造方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5926362A (en) * | 1997-05-01 | 1999-07-20 | Wilson Greatbatch Ltd. | Hermetically sealed capacitor |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6052010A (ja) * | 1983-08-31 | 1985-03-23 | ニチコン株式会社 | 固体電解コンデンサの製造方法 |
JPH0262718U (zh) * | 1988-10-28 | 1990-05-10 | ||
JPH0537468Y2 (zh) * | 1989-01-12 | 1993-09-22 | ||
JPH02301116A (ja) * | 1989-05-15 | 1990-12-13 | Nec Corp | 固体電解コンデンサ |
JPH0453117A (ja) * | 1990-06-18 | 1992-02-20 | Matsushita Electric Ind Co Ltd | 固体電解コンデンサ及びその製造方法 |
JP2768061B2 (ja) * | 1991-07-10 | 1998-06-25 | 松下電器産業株式会社 | 積層型固体電解コンデンサの製造方法 |
JPH05166681A (ja) * | 1991-12-13 | 1993-07-02 | Elna Co Ltd | 固体電解コンデンサの製造方法 |
JP3929273B2 (ja) * | 2000-10-12 | 2007-06-13 | 松下電器産業株式会社 | コンデンサ素子とその製造方法、並びにそれを備えた固体電解コンデンサ |
KR100478303B1 (ko) * | 2001-03-30 | 2005-03-24 | 도시바 라이텍쿠 가부시키가이샤 | 전기기기 |
JP2003101311A (ja) | 2001-09-20 | 2003-04-04 | Nec Corp | シールドストリップ線路型素子 |
US7184257B2 (en) * | 2003-02-26 | 2007-02-27 | Tdk Corporation | Solid electrolytic capacitor |
JP4354227B2 (ja) * | 2003-07-23 | 2009-10-28 | Tdk株式会社 | 固体電解コンデンサ |
CN100557742C (zh) * | 2003-08-12 | 2009-11-04 | 罗姆股份有限公司 | 固体电解电容器、电路和固体电解电容器的安装结构 |
JP2005079463A (ja) * | 2003-09-02 | 2005-03-24 | Nec Tokin Corp | 積層型固体電解コンデンサおよび積層型伝送線路素子 |
JP4330128B2 (ja) | 2003-10-07 | 2009-09-16 | Necトーキン株式会社 | 固体電解コンデンサ |
JP4392237B2 (ja) * | 2003-12-26 | 2009-12-24 | ローム株式会社 | 固体電解コンデンサ |
JP2005217185A (ja) * | 2004-01-29 | 2005-08-11 | Tdk Corp | コンデンサ素子及び電解コンデンサ |
US6870728B1 (en) * | 2004-01-29 | 2005-03-22 | Tdk Corporation | Electrolytic capacitor |
US7450366B2 (en) * | 2004-02-27 | 2008-11-11 | Rohm Co., Ltd. | Solid electrolytic capacitor |
JP4450378B2 (ja) * | 2004-10-27 | 2010-04-14 | Necトーキン株式会社 | 表面実装型コンデンサ及びその製造方法 |
JP2007009610A (ja) * | 2005-07-01 | 2007-01-18 | Shimizu Corp | 矩形圧入ケーソンと矩形圧入ケーソンによる刃口排土方法 |
-
2006
- 2006-01-23 JP JP2006014467A patent/JP2007200950A/ja active Pending
- 2006-12-22 KR KR1020060132309A patent/KR100869440B1/ko not_active IP Right Cessation
-
2007
- 2007-01-19 TW TW096102073A patent/TWI330853B/zh not_active IP Right Cessation
- 2007-01-22 CN CN2007100043115A patent/CN101009160B/zh not_active Expired - Fee Related
- 2007-01-22 US US11/655,871 patent/US7312979B2/en not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5926362A (en) * | 1997-05-01 | 1999-07-20 | Wilson Greatbatch Ltd. | Hermetically sealed capacitor |
Non-Patent Citations (1)
Title |
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同上. |
Also Published As
Publication number | Publication date |
---|---|
TW200737247A (en) | 2007-10-01 |
KR100869440B1 (ko) | 2008-11-21 |
US7312979B2 (en) | 2007-12-25 |
JP2007200950A (ja) | 2007-08-09 |
TWI330853B (en) | 2010-09-21 |
CN101009160A (zh) | 2007-08-01 |
US20070171598A1 (en) | 2007-07-26 |
KR20070077437A (ko) | 2007-07-26 |
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Owner name: NICHICOM CO., LTD. Free format text: FORMER OWNER: FUJITSU MEDIA DEVICES LTD. Effective date: 20090515 |
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Effective date of registration: 20090515 Address after: Kyoto Japan Applicant after: Nichicon Corp. Address before: Kanagawa Applicant before: Fujitsu Media Devices Ltd |
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Assignee: Fpcap Electronics (suzhou) Co., Ltd. Assignor: Nichicon Corp. Contract record no.: 2012990000385 Denomination of invention: Laminated solid electrolytic condenser Granted publication date: 20100519 License type: Exclusive License Open date: 20070801 Record date: 20120605 |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100519 Termination date: 20180122 |