CN101008751B - 液晶显示装置及其制造方法 - Google Patents
液晶显示装置及其制造方法 Download PDFInfo
- Publication number
- CN101008751B CN101008751B CN2007100040920A CN200710004092A CN101008751B CN 101008751 B CN101008751 B CN 101008751B CN 2007100040920 A CN2007100040920 A CN 2007100040920A CN 200710004092 A CN200710004092 A CN 200710004092A CN 101008751 B CN101008751 B CN 101008751B
- Authority
- CN
- China
- Prior art keywords
- liquid crystal
- crystal panel
- flexible wiring
- conductive film
- anisotropic conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09154—Bevelled, chamferred or tapered edge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Liquid Crystal (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
Claims (11)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006-013822 | 2006-01-23 | ||
JP2006013822 | 2006-01-23 | ||
JP2006013822A JP5128773B2 (ja) | 2006-01-23 | 2006-01-23 | 液晶表示装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101008751A CN101008751A (zh) | 2007-08-01 |
CN101008751B true CN101008751B (zh) | 2011-12-07 |
Family
ID=38285146
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007100040920A Active CN101008751B (zh) | 2006-01-23 | 2007-01-23 | 液晶显示装置及其制造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7714973B2 (zh) |
JP (1) | JP5128773B2 (zh) |
CN (1) | CN101008751B (zh) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008235556A (ja) * | 2007-03-20 | 2008-10-02 | Sumitomo Electric Ind Ltd | 配線板モジュール及び該配線板モジュールの製造方法 |
CN101236313B (zh) * | 2008-02-28 | 2010-08-11 | 友达光电股份有限公司 | 显示器及其制造方法 |
US20110249417A1 (en) * | 2008-12-19 | 2011-10-13 | Panasonic Corporation | Anisotropic conductive resin, substrate connecting structure and electronic device |
JP5140816B2 (ja) | 2009-03-31 | 2013-02-13 | デクセリアルズ株式会社 | 接合体及びその製造方法 |
JP2011059149A (ja) * | 2009-09-07 | 2011-03-24 | Hitachi Displays Ltd | 電子機器 |
KR101697972B1 (ko) * | 2011-08-24 | 2017-01-20 | 엘지디스플레이 주식회사 | 플렉서블 디스플레이장치 |
CN103513448A (zh) * | 2012-06-25 | 2014-01-15 | 苏州工业园区赫光科技有限公司 | 一种液晶显示模组温度保护装置 |
CN103513452A (zh) * | 2012-06-29 | 2014-01-15 | 北京京东方光电科技有限公司 | 显示装置的组装方法 |
JP6171778B2 (ja) * | 2013-09-19 | 2017-08-02 | 三菱電機株式会社 | 表示装置 |
KR102067148B1 (ko) * | 2013-09-30 | 2020-01-17 | 삼성디스플레이 주식회사 | 표시 장치 |
GB2525605B (en) * | 2014-04-28 | 2018-10-24 | Flexenable Ltd | Method of bonding flexible printed circuits |
KR102323242B1 (ko) * | 2015-03-10 | 2021-11-08 | 삼성디스플레이 주식회사 | 가요성 표시 장치 |
JP6604035B2 (ja) * | 2015-05-27 | 2019-11-13 | ブラザー工業株式会社 | 液体吐出装置、及び液体吐出装置の製造方法 |
US9978674B2 (en) | 2016-04-05 | 2018-05-22 | Samsung Electronics Co., Ltd. | Chip-on-film semiconductor packages and display apparatus including the same |
WO2019234888A1 (ja) * | 2018-06-07 | 2019-12-12 | 堺ディスプレイプロダクト株式会社 | 表示パネルの製造方法および表示パネル |
KR20200135586A (ko) * | 2019-05-22 | 2020-12-03 | 삼성디스플레이 주식회사 | 연성 회로 필름 본딩 장치 및 이를 이용한 연성 회로 필름 부착 방법 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000002882A (ja) * | 1998-06-16 | 2000-01-07 | Toshiba Electronic Engineering Corp | 液晶表示装置及びその製造方法 |
JP2002099222A (ja) * | 2000-06-08 | 2002-04-05 | Semiconductor Energy Lab Co Ltd | 半導体装置の製造方法 |
US6806936B2 (en) * | 2001-03-26 | 2004-10-19 | Sharp Kabushiki Kaisha | Display module including a display panel connected to a flexible wire board with an insulating protective layer extended inside the display panel |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3186925B2 (ja) * | 1994-08-04 | 2001-07-11 | シャープ株式会社 | パネルの実装構造並びに集積回路搭載テープおよびその製造方法 |
JP3360445B2 (ja) * | 1994-11-14 | 2002-12-24 | カシオ計算機株式会社 | フレキシブル配線基板の接続構造 |
JP3039507B2 (ja) * | 1998-03-06 | 2000-05-08 | 日本電気株式会社 | 液晶表示装置及びその製造方法 |
JP3804269B2 (ja) * | 1998-03-31 | 2006-08-02 | カシオ計算機株式会社 | フレキシブル配線基板の接合構造 |
JP2001305568A (ja) * | 2000-04-21 | 2001-10-31 | Matsushita Electric Ind Co Ltd | 液晶モジュール |
JP2003297516A (ja) * | 2002-03-29 | 2003-10-17 | Optrex Corp | フレキシブル基板の接続方法 |
KR100512992B1 (ko) * | 2003-07-09 | 2005-09-05 | 엘지전자 주식회사 | 플라즈마 디스플레이 패널의 접속 구조 및 방법 |
US7139060B2 (en) * | 2004-01-27 | 2006-11-21 | Au Optronics Corporation | Method for mounting a driver IC chip and a FPC board/TCP/COF device using a single anisotropic conductive film |
TWI282007B (en) * | 2005-12-02 | 2007-06-01 | Innolux Display Corp | Equipment and method for fabricating a liquid crystal display |
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2006
- 2006-01-23 JP JP2006013822A patent/JP5128773B2/ja active Active
-
2007
- 2007-01-22 US US11/655,979 patent/US7714973B2/en active Active
- 2007-01-23 CN CN2007100040920A patent/CN101008751B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000002882A (ja) * | 1998-06-16 | 2000-01-07 | Toshiba Electronic Engineering Corp | 液晶表示装置及びその製造方法 |
JP2002099222A (ja) * | 2000-06-08 | 2002-04-05 | Semiconductor Energy Lab Co Ltd | 半導体装置の製造方法 |
US6806936B2 (en) * | 2001-03-26 | 2004-10-19 | Sharp Kabushiki Kaisha | Display module including a display panel connected to a flexible wire board with an insulating protective layer extended inside the display panel |
Also Published As
Publication number | Publication date |
---|---|
US20070171347A1 (en) | 2007-07-26 |
US7714973B2 (en) | 2010-05-11 |
CN101008751A (zh) | 2007-08-01 |
JP5128773B2 (ja) | 2013-01-23 |
JP2007193275A (ja) | 2007-08-02 |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: NIPPON ELECTRIC CO., LTD. Free format text: FORMER OWNER: NEC LCD TECHNOLOGY CO.,LTD Effective date: 20100613 |
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C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: KAWASAKI-SHI, KANAGAWA-KEN, JAPAN TO: TOKYO, JAPAN |
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TA01 | Transfer of patent application right |
Effective date of registration: 20100613 Address after: Tokyo, Japan Applicant after: NEC Corp. Address before: Kawasaki, Kanagawa, Japan Applicant before: NEC LCD Technologies, Ltd. |
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C14 | Grant of patent or utility model | ||
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Owner name: JINZHEN CO., LTD. Free format text: FORMER OWNER: NEC CORP. Effective date: 20130417 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20130417 Address after: Samoa Apia hiSoft Center No. 217 mailbox Patentee after: Jinzhen Co.,Ltd. Address before: Tokyo, Japan Patentee before: NEC Corp. |
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TR01 | Transfer of patent right |
Effective date of registration: 20230518 Address after: Floor 4, No. 15, Lane 168, Xingshan Road, Neihu District, Taipei City, Taiwan, China, 114762, China Patentee after: HANNSTAR DISPLAY Corp. Address before: Apia, hiSoft center, No. 217 mailbox Patentee before: Jinzhen Co.,Ltd. |
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TR01 | Transfer of patent right |