CN1008659B - 旋转干燥设备 - Google Patents

旋转干燥设备

Info

Publication number
CN1008659B
CN1008659B CN87103644A CN87103644A CN1008659B CN 1008659 B CN1008659 B CN 1008659B CN 87103644 A CN87103644 A CN 87103644A CN 87103644 A CN87103644 A CN 87103644A CN 1008659 B CN1008659 B CN 1008659B
Authority
CN
China
Prior art keywords
engaging
disc
arm
top assembly
arms
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CN87103644A
Other languages
English (en)
Chinese (zh)
Other versions
CN87103644A (zh
Inventor
杰拉尔德·马丁·卡尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eastman Kodak Co
Original Assignee
Eastman Kodak Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eastman Kodak Co filed Critical Eastman Kodak Co
Publication of CN87103644A publication Critical patent/CN87103644A/zh
Publication of CN1008659B publication Critical patent/CN1008659B/zh
Expired legal-status Critical Current

Links

Classifications

    • H10P72/0408—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B11/00—Machines or apparatus for drying solid materials or objects with movement which is non-progressive
    • F26B11/18—Machines or apparatus for drying solid materials or objects with movement which is non-progressive on or in moving dishes, trays, pans, or other mainly-open receptacles
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
    • F26B21/14—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects using gases or vapours other than air or steam, e.g. inert gases
    • F26B21/40—
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • F26B5/08—Drying solid materials or objects by processes not involving the application of heat by centrifugal treatment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Molecular Biology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Solid Materials (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Centrifugal Separators (AREA)
CN87103644A 1986-05-16 1987-05-16 旋转干燥设备 Expired CN1008659B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US86463486A 1986-05-16 1986-05-16
US864,634 1986-05-16

Publications (2)

Publication Number Publication Date
CN87103644A CN87103644A (zh) 1987-12-02
CN1008659B true CN1008659B (zh) 1990-07-04

Family

ID=25343719

Family Applications (1)

Application Number Title Priority Date Filing Date
CN87103644A Expired CN1008659B (zh) 1986-05-16 1987-05-16 旋转干燥设备

Country Status (8)

Country Link
US (1) US4651440A (enExample)
EP (1) EP0305402B1 (enExample)
JP (1) JPH0528761Y2 (enExample)
KR (1) KR880701357A (enExample)
CN (1) CN1008659B (enExample)
CA (1) CA1293488C (enExample)
DE (1) DE3768274D1 (enExample)
WO (1) WO1987007002A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1782646B (zh) * 2004-10-19 2011-03-09 卡拉工业公司 自洁式离心颗粒干燥器及其方法

Families Citing this family (50)

* Cited by examiner, † Cited by third party
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US5168887A (en) * 1990-05-18 1992-12-08 Semitool, Inc. Single wafer processor apparatus
US5168886A (en) * 1988-05-25 1992-12-08 Semitool, Inc. Single wafer processor
US5431421A (en) * 1988-05-25 1995-07-11 Semitool, Inc. Semiconductor processor wafer holder
US5357991A (en) * 1989-03-27 1994-10-25 Semitool, Inc. Gas phase semiconductor processor with liquid phase mixing
US5238500A (en) * 1990-05-15 1993-08-24 Semitool, Inc. Aqueous hydrofluoric and hydrochloric acid vapor processing of semiconductor wafers
US4989345A (en) * 1989-12-18 1991-02-05 Gill Jr Gerald L Centrifugal spin dryer for semiconductor wafer
JPH03238819A (ja) * 1990-02-15 1991-10-24 Seiichiro Sogo 半導体材料の乾燥方法および装置
US5222310A (en) * 1990-05-18 1993-06-29 Semitool, Inc. Single wafer processor with a frame
US6375741B2 (en) * 1991-03-06 2002-04-23 Timothy J. Reardon Semiconductor processing spray coating apparatus
US5174045A (en) * 1991-05-17 1992-12-29 Semitool, Inc. Semiconductor processor with extendible receiver for handling multiple discrete wafers without wafer carriers
JP3277404B2 (ja) * 1993-03-31 2002-04-22 ソニー株式会社 基板洗浄方法及び基板洗浄装置
US5863348A (en) * 1993-12-22 1999-01-26 International Business Machines Corporation Programmable method for cleaning semiconductor elements
US5784797A (en) * 1994-04-28 1998-07-28 Semitool, Inc. Carrierless centrifugal semiconductor processing system
US5664337A (en) * 1996-03-26 1997-09-09 Semitool, Inc. Automated semiconductor processing systems
US5566466A (en) * 1994-07-01 1996-10-22 Ontrak Systems, Inc. Spindle assembly with improved wafer holder
US5954911A (en) * 1995-10-12 1999-09-21 Semitool, Inc. Semiconductor processing using vapor mixtures
US6273483B1 (en) * 1996-03-28 2001-08-14 Mcmaster University Three orthogonal directions movable fingers for holding and/or manipulating a three-dimensional object
US5775000A (en) * 1996-05-13 1998-07-07 Ebara Corporation Substrate gripper device for spin drying
US5851041A (en) * 1996-06-26 1998-12-22 Ontrak Systems, Inc. Wafer holder with spindle assembly and wafer holder actuator
US5980706A (en) * 1996-07-15 1999-11-09 Semitool, Inc. Electrode semiconductor workpiece holder
US6645355B2 (en) 1996-07-15 2003-11-11 Semitool, Inc. Semiconductor processing apparatus having lift and tilt mechanism
US6091498A (en) * 1996-07-15 2000-07-18 Semitool, Inc. Semiconductor processing apparatus having lift and tilt mechanism
US5778554A (en) * 1996-07-15 1998-07-14 Oliver Design, Inc. Wafer spin dryer and method of drying a wafer
US6358388B1 (en) * 1996-07-15 2002-03-19 Semitool, Inc. Plating system workpiece support having workpiece-engaging electrodes with distal contact-part and dielectric cover
US5960555A (en) * 1996-07-24 1999-10-05 Applied Materials, Inc. Method and apparatus for purging the back side of a substrate during chemical vapor processing
US5884412A (en) * 1996-07-24 1999-03-23 Applied Materials, Inc. Method and apparatus for purging the back side of a substrate during chemical vapor processing
US5857475A (en) * 1997-03-03 1999-01-12 Volk Optical, Inc. Optical component cleaning apparatus
US5974681A (en) * 1997-09-10 1999-11-02 Speedfam-Ipec Corp. Apparatus for spin drying a workpiece
US5953827A (en) * 1997-11-05 1999-09-21 Applied Materials, Inc. Magnetron with cooling system for process chamber of processing system
US6013316A (en) * 1998-02-07 2000-01-11 Odme Disc master drying cover assembly
US6207026B1 (en) 1999-10-13 2001-03-27 Applied Materials, Inc. Magnetron with cooling system for substrate processing system
TW452917B (en) * 1999-10-29 2001-09-01 Winbond Electronics Corp Holder
US6415804B1 (en) * 1999-12-23 2002-07-09 Lam Research Corporation Bowl for processing semiconductor wafers
US6363623B1 (en) 2000-06-02 2002-04-02 Speedfam-Ipec Corporation Apparatus and method for spinning a work piece
US6481447B1 (en) 2000-09-27 2002-11-19 Lam Research Corporation Fluid delivery ring and methods for making and implementing the same
US6578853B1 (en) 2000-12-22 2003-06-17 Lam Research Corporation Chuck assembly for use in a spin, rinse, and dry module and methods for making and implementing the same
US6827092B1 (en) * 2000-12-22 2004-12-07 Lam Research Corporation Wafer backside plate for use in a spin, rinse, and dry module and methods for making and implementing the same
US6742279B2 (en) * 2002-01-16 2004-06-01 Applied Materials Inc. Apparatus and method for rinsing substrates
US6665951B1 (en) 2002-08-22 2003-12-23 Jeffrey B. Kuhl Method and apparatus for drying a stack of flats
US6892472B2 (en) * 2003-03-18 2005-05-17 Novellus Systems, Inc. Method and apparatus for cleaning and drying a workpiece
US7644512B1 (en) * 2006-01-18 2010-01-12 Akrion, Inc. Systems and methods for drying a rotating substrate
CN102062524B (zh) * 2010-11-22 2012-11-21 烟台睿创微纳技术有限公司 一种用于mems器件圆片的自动干燥设备
US9421617B2 (en) 2011-06-22 2016-08-23 Tel Nexx, Inc. Substrate holder
US8967935B2 (en) 2011-07-06 2015-03-03 Tel Nexx, Inc. Substrate loader and unloader
CN105466172B (zh) * 2015-12-31 2018-06-19 上饶市中科云健康科技有限公司 一种磁力驱动的真空滚筒玻态干燥机
JP7041011B2 (ja) * 2018-06-22 2022-03-23 株式会社スギノマシン 乾燥機
CN108895772B (zh) * 2018-07-19 2021-07-27 南京溧水高新产业股权投资有限公司 一种基于离心甩水和空气流动的韭菜甩水设备
KR102634455B1 (ko) * 2020-12-02 2024-02-06 세메스 주식회사 클리닝 유닛 및 이를 포함하는 기판 처리 장치
CN113606881A (zh) * 2021-08-31 2021-11-05 青岛大厨四宝餐料有限公司 一种调味料加工用干燥装置
CN115096063B (zh) * 2022-05-25 2023-06-02 广州市通四海生物科技有限公司 一种酒厂废弃物资源再利用流水生产线及控制方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3152875A (en) * 1962-06-15 1964-10-13 Jr William L Davis Football drier
US4064635A (en) * 1976-06-17 1977-12-27 Kuhl Henry Y Apparatus for drying plastic trays
JPS5691431A (en) * 1979-12-25 1981-07-24 Toshiba Corp Automatic drying device
JPS56118347A (en) * 1980-02-22 1981-09-17 Hitachi Ltd Drying device
US4313266A (en) * 1980-05-01 1982-02-02 The Silicon Valley Group, Inc. Method and apparatus for drying wafers
US4517752A (en) * 1983-06-27 1985-05-21 Machine Technology, Inc. Splash retarder
US4559718A (en) * 1983-08-02 1985-12-24 Oki Electric Industry Co., Ltd. Method and apparatus for drying semiconductor wafers

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1782646B (zh) * 2004-10-19 2011-03-09 卡拉工业公司 自洁式离心颗粒干燥器及其方法

Also Published As

Publication number Publication date
EP0305402A1 (en) 1989-03-08
EP0305402B1 (en) 1991-02-27
CN87103644A (zh) 1987-12-02
JPH01500008U (enExample) 1989-11-02
WO1987007002A1 (en) 1987-11-19
DE3768274D1 (de) 1991-04-04
KR880701357A (ko) 1988-07-26
JPH0528761Y2 (enExample) 1993-07-23
CA1293488C (en) 1991-12-24
US4651440A (en) 1987-03-24

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Legal Events

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C13 Decision
GR02 Examined patent application
C14 Grant of patent or utility model
GR01 Patent grant
C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee