JP4557715B2 - 円板状物体を液体処理するための装置 - Google Patents
円板状物体を液体処理するための装置 Download PDFInfo
- Publication number
- JP4557715B2 JP4557715B2 JP2004514771A JP2004514771A JP4557715B2 JP 4557715 B2 JP4557715 B2 JP 4557715B2 JP 2004514771 A JP2004514771 A JP 2004514771A JP 2004514771 A JP2004514771 A JP 2004514771A JP 4557715 B2 JP4557715 B2 JP 4557715B2
- Authority
- JP
- Japan
- Prior art keywords
- liquid
- carrier
- ring
- catching ring
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
Description
Claims (11)
- 円板状物体を受け入れるためのキャリヤー(1)と、キャリヤー上に置かれた円板状物体の上に液体を適用するための液体供給装置(17)と、キャリヤー(1)と実質的に同軸に位置決めされて液体捕捉用リングの軸線まわりに回転可能であり且つキャリヤーに関して動き得る液体捕捉用リング(2)とを備える装置において、
内向きに開口し、液体捕捉用リング(2)から振り飛ばされた液体を集め得て液体捕捉用リング(2)のまわりに位置決めされ、内向きの開口が互いに上下に位置決めされる少なくとも2個の環状室(4、4’)、及び
該環状室(4、4’)と液体捕捉用リング(2)との相互の軸方向変位のために設けられる装置(25)
を具備することを特徴とする、液体を使用して円板状物体を処理するための装置。 - 液体捕捉用リングがキャリヤーに関して回転可能である請求項1記載の装置。
- キャリヤー(1)と液体捕捉用リング(2)との相互の軸方向変位のための装置(25)を備える請求項1記載の装置。
- キャリヤー(1)が回転可能である請求項1記載の装置。
- 液体捕捉用リング(2)の内面(6)の直径(D)が軸方向で変化する請求項1記載の装置。
- 液体捕捉用リング(2)が半径方向の通路(5)を有し、これを通って、液体を半径方向外向きに送ることができる請求項1記載の装置。
- 半径方向通路(5)が、液体捕捉用リング(2)の、内面(6)の直径(D)が少なくも局所的に最大(Dmax)である点に置かれる請求項4記載の装置。
- 液体捕捉用リング(2)の内面(6)が円錐状に実施される請求項5記載の装置。
- 液体捕捉用リング(2)の底端部上に半径方向内向きに高くなる床(7)が形成される請求項5記載の装置。
- 液体捕捉用リング(2)の外面(7)の少なくも一部分が円筒状スリーブの形状を有する請求項1記載の装置。
- 少なくも1個の環状室(4)とキャリヤー(1)とが軸方向で互いに変位可能でない請求項1記載の装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT0095402A AT500984B1 (de) | 2002-06-25 | 2002-06-25 | Vorrichtung zur flüssigkeitsbehandlung von scheibenförmigen gegenständen |
PCT/EP2003/006441 WO2004001812A1 (en) | 2002-06-25 | 2003-06-18 | Device for liquid treatment of disk-shaped objects |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005530605A JP2005530605A (ja) | 2005-10-13 |
JP4557715B2 true JP4557715B2 (ja) | 2010-10-06 |
Family
ID=29783642
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004514771A Expired - Fee Related JP4557715B2 (ja) | 2002-06-25 | 2003-06-18 | 円板状物体を液体処理するための装置 |
Country Status (10)
Country | Link |
---|---|
US (1) | US7122084B2 (ja) |
EP (1) | EP1532661B1 (ja) |
JP (1) | JP4557715B2 (ja) |
KR (1) | KR100958364B1 (ja) |
CN (1) | CN100375228C (ja) |
AT (2) | AT500984B1 (ja) |
AU (1) | AU2003242729A1 (ja) |
DE (1) | DE60327777D1 (ja) |
TW (1) | TW594873B (ja) |
WO (1) | WO2004001812A1 (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004019731A1 (de) * | 2004-04-20 | 2005-11-10 | Sse Sister Semiconductor Equipment Gmbh | Vorrichtung zum Drehbelacken von Substraten |
US20070254098A1 (en) * | 2006-04-28 | 2007-11-01 | Applied Materials, Inc. | Apparatus for single-substrate processing with multiple chemicals and method of use |
TWI359456B (en) * | 2006-12-15 | 2012-03-01 | Lam Res Ag | Device and method for wet treating plate-like arti |
US7849865B2 (en) * | 2007-01-05 | 2010-12-14 | Semitool, Inc. | System for processing a workpiece |
CN101992165B (zh) * | 2009-08-27 | 2012-10-24 | 沈阳芯源微电子设备有限公司 | 一种用于圆形薄片状物体进行化学液喷洒处理的装置 |
TWI421928B (zh) * | 2010-06-10 | 2014-01-01 | Grand Plastic Technology Co Ltd | 清洗蝕刻機台之自動清洗方法 |
DE202010015018U1 (de) * | 2010-11-07 | 2011-04-14 | Bohnet, Hans | Anordnung zur Herstellung von strukturierten Substraten |
JP5309118B2 (ja) * | 2010-12-17 | 2013-10-09 | 東京エレクトロン株式会社 | 基板液処理装置 |
US20150017805A1 (en) * | 2013-07-09 | 2015-01-15 | Raymon F. Thompson | Wafer processing apparatus having independently rotatable wafer support and processing dish |
US9768041B2 (en) | 2013-08-12 | 2017-09-19 | Veeco Precision Surface Processing Llc | Collection chamber apparatus to separate multiple fluids during the semiconductor wafer processing cycle |
US10707099B2 (en) | 2013-08-12 | 2020-07-07 | Veeco Instruments Inc. | Collection chamber apparatus to separate multiple fluids during the semiconductor wafer processing cycle |
US11342215B2 (en) | 2017-04-25 | 2022-05-24 | Veeco Instruments Inc. | Semiconductor wafer processing chamber |
FR3079443B1 (fr) | 2018-03-29 | 2021-05-14 | Association Pour Les Transferts De Tech Du Mans | Procede de fabrication additive d'une piece en elastomere, installation de fabrication et piece associees |
JP7096112B2 (ja) | 2018-09-13 | 2022-07-05 | キオクシア株式会社 | 半導体製造装置および半導体装置の製造方法 |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AT389959B (de) * | 1987-11-09 | 1990-02-26 | Sez Semiconduct Equip Zubehoer | Vorrichtung zum aetzen von scheibenfoermigen gegenstaenden, insbesondere von siliziumscheiben |
JPH0669545B2 (ja) * | 1987-11-23 | 1994-09-07 | タツモ株式会社 | 塗布装置 |
FR2636546B1 (fr) * | 1988-09-15 | 1991-03-15 | Sulzer Electro Tech | Procede et dispositif pour l'application uniformement reguliere d'une couche de resine sur un substrat |
JPH04119524A (ja) * | 1990-09-10 | 1992-04-21 | Fuji Electric Co Ltd | 回転表面処理装置 |
JP3241058B2 (ja) * | 1991-03-28 | 2001-12-25 | 大日本スクリーン製造株式会社 | 回転式塗布装置及び回転式塗布方法 |
JP2591555B2 (ja) * | 1991-12-20 | 1997-03-19 | 東京応化工業株式会社 | 塗布装置 |
US5439519A (en) * | 1992-04-28 | 1995-08-08 | Tokyo Ohka Kogyo Co., Ltd. | Solution applying apparatus |
US5211753A (en) * | 1992-06-15 | 1993-05-18 | Swain Danny C | Spin coating apparatus with an independently spinning enclosure |
JP3395264B2 (ja) * | 1993-07-26 | 2003-04-07 | 東京応化工業株式会社 | 回転カップ式塗布装置 |
US5489341A (en) * | 1993-08-23 | 1996-02-06 | Semitool, Inc. | Semiconductor processing with non-jetting fluid stream discharge array |
US5656082A (en) * | 1994-04-04 | 1997-08-12 | Tatsumo Kabushiki Kaisha | Liquid applying apparatus utilizing centrifugal force |
JP3250090B2 (ja) * | 1995-06-27 | 2002-01-28 | 東京エレクトロン株式会社 | 洗浄処理装置及び洗浄処理方法 |
JPH0945611A (ja) * | 1995-07-27 | 1997-02-14 | Dainippon Screen Mfg Co Ltd | 回転式基板塗布装置 |
TW344097B (en) * | 1996-04-09 | 1998-11-01 | Tokyo Electron Co Ltd | Photoresist treating device of substrate and photoresist treating method |
JP3396377B2 (ja) * | 1996-07-22 | 2003-04-14 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP3390313B2 (ja) * | 1996-12-05 | 2003-03-24 | 大日本スクリーン製造株式会社 | 基板処理装置 |
US6027602A (en) | 1997-08-29 | 2000-02-22 | Techpoint Pacific Singapore Pte. Ltd. | Wet processing apparatus |
JP3555724B2 (ja) * | 1997-09-04 | 2004-08-18 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP2000343046A (ja) * | 1999-06-02 | 2000-12-12 | Kurita Water Ind Ltd | 枚葉式洗浄装置 |
JP2001077082A (ja) * | 1999-09-06 | 2001-03-23 | Takata Corp | 処理液回収用チャンバー構造 |
TW399743U (en) * | 1999-09-15 | 2000-07-21 | Ind Tech Res Inst | Wafer back protection device |
JP4426036B2 (ja) * | 1999-12-02 | 2010-03-03 | 東京エレクトロン株式会社 | 基板処理装置 |
EP1202326B1 (de) * | 2000-10-31 | 2004-01-02 | Sez Ag | Vorrichtung zur Flüssigkeitsbehandlung von scheibenförmigen Gegenständen |
JP3740377B2 (ja) | 2001-03-05 | 2006-02-01 | 東京エレクトロン株式会社 | 液供給装置 |
JP2003007664A (ja) * | 2001-06-22 | 2003-01-10 | Ses Co Ltd | 枚葉式基板洗浄方法および枚葉式基板洗浄装置 |
-
2002
- 2002-06-25 AT AT0095402A patent/AT500984B1/de not_active IP Right Cessation
-
2003
- 2003-06-18 JP JP2004514771A patent/JP4557715B2/ja not_active Expired - Fee Related
- 2003-06-18 AT AT03760646T patent/ATE432530T1/de not_active IP Right Cessation
- 2003-06-18 CN CNB038146991A patent/CN100375228C/zh not_active Expired - Fee Related
- 2003-06-18 US US10/518,517 patent/US7122084B2/en not_active Expired - Fee Related
- 2003-06-18 KR KR1020047019593A patent/KR100958364B1/ko not_active IP Right Cessation
- 2003-06-18 AU AU2003242729A patent/AU2003242729A1/en not_active Abandoned
- 2003-06-18 WO PCT/EP2003/006441 patent/WO2004001812A1/en active Application Filing
- 2003-06-18 DE DE60327777T patent/DE60327777D1/de not_active Expired - Lifetime
- 2003-06-18 EP EP03760646A patent/EP1532661B1/en not_active Expired - Lifetime
- 2003-06-20 TW TW092116803A patent/TW594873B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN100375228C (zh) | 2008-03-12 |
US20050223975A1 (en) | 2005-10-13 |
AT500984B1 (de) | 2007-05-15 |
AT500984A1 (de) | 2006-05-15 |
KR100958364B1 (ko) | 2010-05-17 |
EP1532661A1 (en) | 2005-05-25 |
DE60327777D1 (de) | 2009-07-09 |
US7122084B2 (en) | 2006-10-17 |
EP1532661B1 (en) | 2009-05-27 |
TW594873B (en) | 2004-06-21 |
ATE432530T1 (de) | 2009-06-15 |
KR20050013119A (ko) | 2005-02-02 |
AU2003242729A1 (en) | 2004-01-06 |
WO2004001812A1 (en) | 2003-12-31 |
JP2005530605A (ja) | 2005-10-13 |
CN1663023A (zh) | 2005-08-31 |
TW200400557A (en) | 2004-01-01 |
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