CN100591588C - 在受控空气中传输衬底的设备 - Google Patents
在受控空气中传输衬底的设备 Download PDFInfo
- Publication number
- CN100591588C CN100591588C CN200510066155A CN200510066155A CN100591588C CN 100591588 C CN100591588 C CN 100591588C CN 200510066155 A CN200510066155 A CN 200510066155A CN 200510066155 A CN200510066155 A CN 200510066155A CN 100591588 C CN100591588 C CN 100591588C
- Authority
- CN
- China
- Prior art keywords
- microenvironment
- chamber
- confined chamber
- equipment according
- micropump
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67353—Closed carriers specially adapted for a single substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/14—Wafer cassette transporting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0450751 | 2004-04-21 | ||
FR0450751A FR2869452B1 (fr) | 2004-04-21 | 2004-04-21 | Dispositif pour le transport de substrats sous atmosphere controlee |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1689929A CN1689929A (zh) | 2005-11-02 |
CN100591588C true CN100591588C (zh) | 2010-02-24 |
Family
ID=34942117
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200510066155A Expired - Fee Related CN100591588C (zh) | 2004-04-21 | 2005-04-21 | 在受控空气中传输衬底的设备 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7694700B2 (fr) |
EP (1) | EP1589565B1 (fr) |
JP (1) | JP4712425B2 (fr) |
CN (1) | CN100591588C (fr) |
AT (1) | ATE350763T1 (fr) |
DE (1) | DE602005000396T2 (fr) |
FR (1) | FR2869452B1 (fr) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007107983A2 (fr) * | 2006-03-17 | 2007-09-27 | Shlomo Shmuelov | Système de stockage et de purge pour tranches semi-conductrices |
US8297319B2 (en) * | 2006-09-14 | 2012-10-30 | Brooks Automation, Inc. | Carrier gas system and coupling substrate carrier to a loadport |
TWI387040B (zh) * | 2006-12-19 | 2013-02-21 | Applied Materials Inc | 感測承載件中基板之設備 |
JP2008258477A (ja) * | 2007-04-06 | 2008-10-23 | Canon Inc | 処理装置及び雰囲気置換方法 |
US9105673B2 (en) | 2007-05-09 | 2015-08-11 | Brooks Automation, Inc. | Side opening unified pod |
JP5521307B2 (ja) * | 2008-10-24 | 2014-06-11 | 東京エレクトロン株式会社 | パーティクル捕集装置及びパーティクル捕集方法 |
FR2963327B1 (fr) * | 2010-07-27 | 2012-08-24 | Air Liquide | Dispositif de stockage d'articles sous atmosphere controlee |
US9926626B2 (en) * | 2012-07-09 | 2018-03-27 | Bengbu Design & Research Institute For Glass Industry | System and method for processing substrates |
JP6257616B2 (ja) * | 2012-07-09 | 2018-01-10 | サン−ゴバン グラス フランスSaint−Gobain Glass France | コーティングされた基板を処理するための、プロセスボックス、装置及び方法 |
CN104919580B (zh) | 2012-07-09 | 2017-09-29 | 法国圣戈班玻璃厂 | 用于对物体进行热处理的装置和方法 |
CN107505702B (zh) * | 2017-09-06 | 2020-01-03 | 四川梓冠光电科技有限公司 | 一种微机电型可调光衰减器 |
US11794314B2 (en) | 2021-08-30 | 2023-10-24 | Kla Corporation | Quick swap chuck with vacuum holding interchangeable top plate |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0710323B2 (ja) * | 1987-05-12 | 1995-02-08 | 日本真空技術株式会社 | 真空排気系用微粒子トラツプ |
JPH0377313A (ja) * | 1989-08-19 | 1991-04-02 | Mitsubishi Electric Corp | 化学気相成長装置 |
US5137063A (en) * | 1990-02-05 | 1992-08-11 | Texas Instruments Incorporated | Vented vacuum semiconductor wafer cassette |
US5217053A (en) * | 1990-02-05 | 1993-06-08 | Texas Instruments Incorporated | Vented vacuum semiconductor wafer cassette |
JPH03270049A (ja) * | 1990-03-19 | 1991-12-02 | Fujitsu Ltd | 基板収納容器 |
US5255783A (en) * | 1991-12-20 | 1993-10-26 | Fluoroware, Inc. | Evacuated wafer container |
FR2697000B1 (fr) * | 1992-10-16 | 1994-11-25 | Commissariat Energie Atomique | Boîte plate de confinement d'un objet plat sous atmosphère spéciale. |
US5346518A (en) * | 1993-03-23 | 1994-09-13 | International Business Machines Corporation | Vapor drain system |
US5575394A (en) * | 1994-07-15 | 1996-11-19 | Fluoroware, Inc. | Wafer shipper and package |
JPH0927542A (ja) * | 1995-07-13 | 1997-01-28 | Hitachi Ltd | 搬送容器 |
CA2218185C (fr) * | 1995-10-13 | 2005-12-27 | Empak, Inc. | Pene mecanique actionne par le vide |
FR2741328B1 (fr) * | 1995-11-20 | 1997-12-19 | Commissariat Energie Atomique | Boite de stockage d'un objet destine a etre protege d'une contamination physico-chimique |
US6026963A (en) * | 1996-02-23 | 2000-02-22 | Memc Electronic Materials, Inc. | Moisture barrier bag having window |
JP3783973B2 (ja) * | 1996-03-22 | 2006-06-07 | 独立行政法人 日本原子力研究開発機構 | 減圧容器内におけるダスト回収方法 |
US5879458A (en) * | 1996-09-13 | 1999-03-09 | Semifab Incorporated | Molecular contamination control system |
JP3324731B2 (ja) * | 1997-03-24 | 2002-09-17 | 株式会社ハイモールド | 記憶ディスク収納ケース |
JPH1165094A (ja) * | 1997-08-22 | 1999-03-05 | Nikon Corp | 収納ケース、露光装置及びデバイス製造装置 |
JPH11168135A (ja) * | 1997-12-03 | 1999-06-22 | Toshiba Corp | 基板保管装置および基板保管方法 |
US6153044A (en) * | 1998-04-30 | 2000-11-28 | Euv Llc | Protection of lithographic components from particle contamination |
US6168364B1 (en) * | 1999-04-19 | 2001-01-02 | Tdk Corporation | Vacuum clean box, clean transfer method and apparatus therefor |
JP3769417B2 (ja) * | 1999-06-30 | 2006-04-26 | 株式会社東芝 | 基板収納容器 |
FR2802335B1 (fr) * | 1999-12-09 | 2002-04-05 | Cit Alcatel | Systeme et procede de controle de minienvironnement |
US6135168A (en) * | 1999-12-22 | 2000-10-24 | Industrial Technology Research Institute | Standard mechanical interface wafer pod gas filling system |
JP3939101B2 (ja) * | 2000-12-04 | 2007-07-04 | 株式会社荏原製作所 | 基板搬送方法および基板搬送容器 |
US6792982B2 (en) * | 2001-01-24 | 2004-09-21 | Spectrx, Inc. | Vacuum device for substance extraction |
US6906783B2 (en) * | 2002-02-22 | 2005-06-14 | Asml Holding N.V. | System for using a two part cover for protecting a reticle |
TW587197B (en) * | 2002-03-15 | 2004-05-11 | Nikon Corp | Mask safekeeping apparatus, exposure apparatus and manufacturing method of device |
JP2004039986A (ja) * | 2002-07-05 | 2004-02-05 | Tokyo Seimitsu Co Ltd | 露光マスク収容器、露光マスク入出力機構及び収容器内気圧調整装置 |
US6955197B2 (en) * | 2002-08-31 | 2005-10-18 | Applied Materials, Inc. | Substrate carrier having door latching and substrate clamping mechanisms |
US7159719B2 (en) * | 2003-07-31 | 2007-01-09 | Intel Corporation | Thermophoretic protection of reticles |
-
2004
- 2004-04-21 FR FR0450751A patent/FR2869452B1/fr not_active Expired - Fee Related
-
2005
- 2005-04-13 AT AT05290812T patent/ATE350763T1/de not_active IP Right Cessation
- 2005-04-13 DE DE602005000396T patent/DE602005000396T2/de active Active
- 2005-04-13 EP EP05290812A patent/EP1589565B1/fr not_active Not-in-force
- 2005-04-15 JP JP2005117818A patent/JP4712425B2/ja not_active Expired - Fee Related
- 2005-04-20 US US11/109,853 patent/US7694700B2/en not_active Expired - Fee Related
- 2005-04-21 CN CN200510066155A patent/CN100591588C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US7694700B2 (en) | 2010-04-13 |
FR2869452A1 (fr) | 2005-10-28 |
CN1689929A (zh) | 2005-11-02 |
EP1589565A1 (fr) | 2005-10-26 |
JP2005311361A (ja) | 2005-11-04 |
DE602005000396D1 (de) | 2007-02-15 |
EP1589565B1 (fr) | 2007-01-03 |
ATE350763T1 (de) | 2007-01-15 |
DE602005000396T2 (de) | 2007-11-29 |
FR2869452B1 (fr) | 2006-09-08 |
US20050238476A1 (en) | 2005-10-27 |
JP4712425B2 (ja) | 2011-06-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100224 Termination date: 20130421 |