DE602005000396D1 - Vorrichtung zum Transport von Substraten unter kontrollierter Atmosphäre - Google Patents

Vorrichtung zum Transport von Substraten unter kontrollierter Atmosphäre

Info

Publication number
DE602005000396D1
DE602005000396D1 DE602005000396T DE602005000396T DE602005000396D1 DE 602005000396 D1 DE602005000396 D1 DE 602005000396D1 DE 602005000396 T DE602005000396 T DE 602005000396T DE 602005000396 T DE602005000396 T DE 602005000396T DE 602005000396 D1 DE602005000396 D1 DE 602005000396D1
Authority
DE
Germany
Prior art keywords
controlled atmosphere
under controlled
chamber
substrates under
transporting substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005000396T
Other languages
English (en)
Other versions
DE602005000396T2 (de
Inventor
Roland Bernard
Hisanori Kambara
Jean-Luc Rival
Guet Catherine Le
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alcatel Lucent SAS
Original Assignee
Alcatel CIT SA
Alcatel SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel CIT SA, Alcatel SA filed Critical Alcatel CIT SA
Publication of DE602005000396D1 publication Critical patent/DE602005000396D1/de
Application granted granted Critical
Publication of DE602005000396T2 publication Critical patent/DE602005000396T2/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67353—Closed carriers specially adapted for a single substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
  • Physical Vapour Deposition (AREA)
DE602005000396T 2004-04-21 2005-04-13 Vorrichtung zum Transport von Substraten unter kontrollierter Atmosphäre Active DE602005000396T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0450751 2004-04-21
FR0450751A FR2869452B1 (fr) 2004-04-21 2004-04-21 Dispositif pour le transport de substrats sous atmosphere controlee

Publications (2)

Publication Number Publication Date
DE602005000396D1 true DE602005000396D1 (de) 2007-02-15
DE602005000396T2 DE602005000396T2 (de) 2007-11-29

Family

ID=34942117

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005000396T Active DE602005000396T2 (de) 2004-04-21 2005-04-13 Vorrichtung zum Transport von Substraten unter kontrollierter Atmosphäre

Country Status (7)

Country Link
US (1) US7694700B2 (de)
EP (1) EP1589565B1 (de)
JP (1) JP4712425B2 (de)
CN (1) CN100591588C (de)
AT (1) ATE350763T1 (de)
DE (1) DE602005000396T2 (de)
FR (1) FR2869452B1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
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WO2007107983A2 (en) * 2006-03-17 2007-09-27 Shlomo Shmuelov Storage and purge system for semiconductor wafers
US8297319B2 (en) * 2006-09-14 2012-10-30 Brooks Automation, Inc. Carrier gas system and coupling substrate carrier to a loadport
TWI387040B (zh) * 2006-12-19 2013-02-21 Applied Materials Inc 感測承載件中基板之設備
JP2008258477A (ja) * 2007-04-06 2008-10-23 Canon Inc 処理装置及び雰囲気置換方法
US9105673B2 (en) 2007-05-09 2015-08-11 Brooks Automation, Inc. Side opening unified pod
JP5521307B2 (ja) * 2008-10-24 2014-06-11 東京エレクトロン株式会社 パーティクル捕集装置及びパーティクル捕集方法
FR2963327B1 (fr) * 2010-07-27 2012-08-24 Air Liquide Dispositif de stockage d'articles sous atmosphere controlee
US9926626B2 (en) * 2012-07-09 2018-03-27 Bengbu Design & Research Institute For Glass Industry System and method for processing substrates
JP6257616B2 (ja) * 2012-07-09 2018-01-10 サン−ゴバン グラス フランスＳａｉｎｔ−Ｇｏｂａｉｎ Ｇｌａｓｓ Ｆｒａｎｃｅ コーティングされた基板を処理するための、プロセスボックス、装置及び方法
CN104919580B (zh) 2012-07-09 2017-09-29 法国圣戈班玻璃厂 用于对物体进行热处理的装置和方法
CN107505702B (zh) * 2017-09-06 2020-01-03 四川梓冠光电科技有限公司 一种微机电型可调光衰减器
US11794314B2 (en) 2021-08-30 2023-10-24 Kla Corporation Quick swap chuck with vacuum holding interchangeable top plate

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0710323B2 (ja) * 1987-05-12 1995-02-08 日本真空技術株式会社 真空排気系用微粒子トラツプ
JPH0377313A (ja) * 1989-08-19 1991-04-02 Mitsubishi Electric Corp 化学気相成長装置
US5137063A (en) * 1990-02-05 1992-08-11 Texas Instruments Incorporated Vented vacuum semiconductor wafer cassette
US5217053A (en) * 1990-02-05 1993-06-08 Texas Instruments Incorporated Vented vacuum semiconductor wafer cassette
JPH03270049A (ja) * 1990-03-19 1991-12-02 Fujitsu Ltd 基板収納容器
US5255783A (en) * 1991-12-20 1993-10-26 Fluoroware, Inc. Evacuated wafer container
FR2697000B1 (fr) * 1992-10-16 1994-11-25 Commissariat Energie Atomique Boîte plate de confinement d'un objet plat sous atmosphère spéciale.
US5346518A (en) * 1993-03-23 1994-09-13 International Business Machines Corporation Vapor drain system
US5575394A (en) * 1994-07-15 1996-11-19 Fluoroware, Inc. Wafer shipper and package
JPH0927542A (ja) * 1995-07-13 1997-01-28 Hitachi Ltd 搬送容器
CA2218185C (en) * 1995-10-13 2005-12-27 Empak, Inc. Vacuum actuated mechanical latch
FR2741328B1 (fr) * 1995-11-20 1997-12-19 Commissariat Energie Atomique Boite de stockage d'un objet destine a etre protege d'une contamination physico-chimique
US6026963A (en) * 1996-02-23 2000-02-22 Memc Electronic Materials, Inc. Moisture barrier bag having window
JP3783973B2 (ja) * 1996-03-22 2006-06-07 独立行政法人 日本原子力研究開発機構 減圧容器内におけるダスト回収方法
US5879458A (en) * 1996-09-13 1999-03-09 Semifab Incorporated Molecular contamination control system
JP3324731B2 (ja) * 1997-03-24 2002-09-17 株式会社ハイモールド 記憶ディスク収納ケース
JPH1165094A (ja) * 1997-08-22 1999-03-05 Nikon Corp 収納ケース、露光装置及びデバイス製造装置
JPH11168135A (ja) * 1997-12-03 1999-06-22 Toshiba Corp 基板保管装置および基板保管方法
US6153044A (en) * 1998-04-30 2000-11-28 Euv Llc Protection of lithographic components from particle contamination
US6168364B1 (en) * 1999-04-19 2001-01-02 Tdk Corporation Vacuum clean box, clean transfer method and apparatus therefor
JP3769417B2 (ja) * 1999-06-30 2006-04-26 株式会社東芝 基板収納容器
FR2802335B1 (fr) * 1999-12-09 2002-04-05 Cit Alcatel Systeme et procede de controle de minienvironnement
US6135168A (en) * 1999-12-22 2000-10-24 Industrial Technology Research Institute Standard mechanical interface wafer pod gas filling system
JP3939101B2 (ja) * 2000-12-04 2007-07-04 株式会社荏原製作所 基板搬送方法および基板搬送容器
US6792982B2 (en) * 2001-01-24 2004-09-21 Spectrx, Inc. Vacuum device for substance extraction
US6906783B2 (en) * 2002-02-22 2005-06-14 Asml Holding N.V. System for using a two part cover for protecting a reticle
TW587197B (en) * 2002-03-15 2004-05-11 Nikon Corp Mask safekeeping apparatus, exposure apparatus and manufacturing method of device
JP2004039986A (ja) * 2002-07-05 2004-02-05 Tokyo Seimitsu Co Ltd 露光マスク収容器、露光マスク入出力機構及び収容器内気圧調整装置
US6955197B2 (en) * 2002-08-31 2005-10-18 Applied Materials, Inc. Substrate carrier having door latching and substrate clamping mechanisms
US7159719B2 (en) * 2003-07-31 2007-01-09 Intel Corporation Thermophoretic protection of reticles

Also Published As

Publication number Publication date
US7694700B2 (en) 2010-04-13
FR2869452A1 (fr) 2005-10-28
CN100591588C (zh) 2010-02-24
CN1689929A (zh) 2005-11-02
EP1589565A1 (de) 2005-10-26
JP2005311361A (ja) 2005-11-04
EP1589565B1 (de) 2007-01-03
ATE350763T1 (de) 2007-01-15
DE602005000396T2 (de) 2007-11-29
FR2869452B1 (fr) 2006-09-08
US20050238476A1 (en) 2005-10-27
JP4712425B2 (ja) 2011-06-29

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Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: ALCATEL LUCENT, PARIS, FR

8364 No opposition during term of opposition