WO2009054064A1 - 基板ロード装置 - Google Patents

基板ロード装置 Download PDF

Info

Publication number
WO2009054064A1
WO2009054064A1 PCT/JP2007/070898 JP2007070898W WO2009054064A1 WO 2009054064 A1 WO2009054064 A1 WO 2009054064A1 JP 2007070898 W JP2007070898 W JP 2007070898W WO 2009054064 A1 WO2009054064 A1 WO 2009054064A1
Authority
WO
WIPO (PCT)
Prior art keywords
container
state
substrates
chamber
separated
Prior art date
Application number
PCT/JP2007/070898
Other languages
English (en)
French (fr)
Inventor
Masayasu Suzuki
Original Assignee
Shimadzu Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shimadzu Corporation filed Critical Shimadzu Corporation
Priority to PCT/JP2007/070898 priority Critical patent/WO2009054064A1/ja
Publication of WO2009054064A1 publication Critical patent/WO2009054064A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

基板ロード装置は、大気側と真空雰囲気との間で基板を移動させる装置であり、基板の搬出入を行う密閉自在の容器は、容器内部にスラスト移動を自在とする基板ホルダーを有し、容器上部に開閉を自在とする蓋部を有する。基板ホルダーは、容器内においてスラスト移動することによって、容器内を上下の二室に分ける分離状態と一室とする連通状態との状態切り替えを自在とする。分離状態とすることによって、一方の室を真空状態に保持したままで他方の室を大気側に開放させることができ、この大気側に開放した室によって容器内外に対して基板を搬出入する。一方、蓋部を閉じて容器を密閉状態とした状態で、容器内を連通状態とすることによって、容器内において二室間で基板を移動させる。これによって、ゲートバルブを要することなく基板の搬出入を行う。
PCT/JP2007/070898 2007-10-26 2007-10-26 基板ロード装置 WO2009054064A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/070898 WO2009054064A1 (ja) 2007-10-26 2007-10-26 基板ロード装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/070898 WO2009054064A1 (ja) 2007-10-26 2007-10-26 基板ロード装置

Publications (1)

Publication Number Publication Date
WO2009054064A1 true WO2009054064A1 (ja) 2009-04-30

Family

ID=40579174

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/070898 WO2009054064A1 (ja) 2007-10-26 2007-10-26 基板ロード装置

Country Status (1)

Country Link
WO (1) WO2009054064A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011035103A (ja) * 2009-07-31 2011-02-17 Tokyo Electron Ltd 搬送装置及び処理システム
JP2012138551A (ja) * 2010-12-28 2012-07-19 Shibaura Mechatronics Corp ロードロック装置および真空処理装置
JP2013524445A (ja) * 2010-04-01 2013-06-17 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド レーザアブレーション誘導結合プラズマ質量分析のための改良された試料チャンバ
JP2013197312A (ja) * 2012-03-19 2013-09-30 Shibaura Mechatronics Corp 減圧装置および減圧方法
JP2015173282A (ja) * 2015-05-12 2015-10-01 芝浦メカトロニクス株式会社 ロードロック装置および真空処理装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10242234A (ja) * 1997-02-26 1998-09-11 Fujitsu Ltd 製造装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10242234A (ja) * 1997-02-26 1998-09-11 Fujitsu Ltd 製造装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011035103A (ja) * 2009-07-31 2011-02-17 Tokyo Electron Ltd 搬送装置及び処理システム
JP2013524445A (ja) * 2010-04-01 2013-06-17 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド レーザアブレーション誘導結合プラズマ質量分析のための改良された試料チャンバ
JP2012138551A (ja) * 2010-12-28 2012-07-19 Shibaura Mechatronics Corp ロードロック装置および真空処理装置
JP2013197312A (ja) * 2012-03-19 2013-09-30 Shibaura Mechatronics Corp 減圧装置および減圧方法
JP2015173282A (ja) * 2015-05-12 2015-10-01 芝浦メカトロニクス株式会社 ロードロック装置および真空処理装置

Similar Documents

Publication Publication Date Title
CN201900652U (zh) 真空手套箱
WO2009054064A1 (ja) 基板ロード装置
TW200629453A (en) Vacuum processing apparatus
CN1955336B (zh) 承载机构
WO2007050862A3 (en) Vacuum storage container
WO2008108329A1 (ja) ホッパ、ホッパユニットおよび組合せ計量装置
WO2006076393A3 (en) Method and apparatus for evacuating and sealing containers
WO2009031413A1 (ja) 天板及びこれを用いたプラズマ処理装置
WO2013035019A3 (en) Apparatus for treating surfaces of wafer-shaped articles
WO2007017761A3 (en) Container for consumer article
WO2012171529A8 (en) Container assembly and associated method
WO2013078065A8 (en) Chamber sealing member
TW200744145A (en) Cluster processing apparatus
WO2009034869A1 (ja) 真空処理システムおよび基板搬送方法
WO2011062512A9 (en) Pressure sealing method for headspace modification
WO2012003240A3 (en) Port door positioning apparatus and associated methods
EP1992569A3 (en) Sealing lid
ATE350763T1 (de) Vorrichtung zum transport von substraten unter kontrollierter atmosphäre
WO2008132871A1 (ja) 反応容器プレート及び反応処理方法
JP2012138542A5 (ja)
SG11201811129VA (en) Vacuum insulation panel manufacturing device
JP2008306223A5 (ja)
WO2008091360A3 (en) Electro-chemical processor
TW200517706A (en) Processing chamber of flat-panel display manufacturing apparatus having upper cover opening/closing device
WO2022001107A1 (zh) 自驱动型样品真空转移系统及方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 07830632

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

NENP Non-entry into the national phase

Ref country code: JP

122 Ep: pct application non-entry in european phase

Ref document number: 07830632

Country of ref document: EP

Kind code of ref document: A1