CN100576980C - 用于在绝缘树脂层上形成配线的方法 - Google Patents
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Abstract
本发明公开了一种用于形成配线的方法,该方法包括:在其上形成基层配线的绝缘基板上按顺序层压处于半固化状态的热固性树脂薄膜和金属箔,所述金属箔的毛面面向所述热固性树脂薄膜,并在加热的同时挤压所述热固性树脂薄膜和所述金属箔;在所述金属箔中形成开口,以便露出所述绝缘树脂层中将要形成导通孔的部分;通过使用其中形成有所述开口的金属箔作为掩模,将高能射束照射到所述绝缘树脂层上,以在所述绝缘树脂层中形成所述导通孔;通过所述金属箔的开口进行所述导通孔的去污处理;通过蚀刻去除所述金属箔;形成无电解镀层;以及通过半加成工艺在所述无电解镀层上形成包括电镀层的配线。
Description
技术领域
本发明涉及一种用于在绝缘树脂层上形成配线的方法,该绝缘树脂层用以构成多层印刷配线基板的层间绝缘层。
背景技术
构成印刷配线基板的多层印刷配线基板、半导体封装(增层基板、封装)、薄型部件内置基板、堆叠封装(POP)等的制造需要在作为层间绝缘层的绝缘树脂层上形成配线。
作为典型实例,在制造增层封装等的过程中,在通过电镀在绝缘树脂层上形成由例如铜等金属构成的配线层的情况下,通常进行去污处理,以通过将增层树脂浸入高锰酸水溶液中,粗化该增层树脂的表面层。进行去污处理原本是为了去除通过激光加工等形成的导通孔(via hole)内部的加工废屑(污物)。由于去污处理对树脂具有较强的腐蚀作用,所以此工艺适用于粗化树脂的表面。当在树脂的粗糙表面上形成包括无电解镀铜层(种晶层)和通过半加成工艺(semi-additive process)形成的电镀铜层的配线层时,该树脂的粗糙表面的不平度具有固着效果,这样确保了该树脂和该配线之间的接合强度。
然而,近年来,在使用多层印刷配线基板的半导体封装等中,为了改进某些特性,增加了绝缘树脂的二氧化硅含量,以便减小热膨胀系数。二氧化硅含量的增加引起树脂的去污性能的降低,这使得难以粗化树脂表面,导致树脂和配线之间的接合强度不足。
同样,通过用玻璃布浸渍树脂而形成的预浸渍材料较硬。这样,难以通过去污处理粗化预浸渍材料,并且不能够确保与利用半加成工艺形成的配线的接合强度。这样,主要采用通过使用附着铜箔的预浸渍体的减去法(subtractive method)进行配线形成。
利用减去法的配线形成不适合于微细化设计,并对下一代的微细化设计具有局限性。
另一方面,在现有技术中已经实行用于不通过利用去污处理而粗化树脂表面的方法,确保了树脂和通过半加成工艺形成的配线之间的接合强度(例如参见JP-A-2003-304068,特别是背景技术中的段落[0007])。将参照图1(1A~1G)说明此现有技术。为了方便起见,仅针对基板的一个表面说明以上方法,然而,可以同时在基板的两个表面上进行处理。
如图1A中所示,提供玻璃环氧树脂基板10,通过绝缘树脂层12在玻璃环氧树脂基板10的表面上形成由铜箔构成的基层配线层14。
接下来,如图1B中所示,在基板10上,将处于半固化状态的热固性树脂薄膜16和铜箔18一个叠加在另一个上,并在加热状态下进行加压(热压)。在此时,铜箔18的毛面(粗糙面)叠加在处于半固化状态的热固性树脂薄膜16的表面上。铜箔18的毛面的不平度传递(转印)到该毛面所挤压的处于半固化状态的树脂薄膜16的顶面,从而形成粗糙面R。因而,获得这样的一体结构,即包括绝缘树脂层12和基层配线层14的基板10、由热固性树脂薄膜构成的绝缘树脂层16及铜箔18层压在一起。
接下来,如图1C中所示,通过蚀刻去除铜箔18。从而露出绝缘树脂层16的粗糙面R。粗糙面R通常具有铜箔的毛面粗糙度Ra,该毛面粗糙度Ra约等于2.0至4.0微米。以上毛面在其与通过在铜箔上进行电镀而形成的配线层之间具有机械固着效果,以便确保较高的接合强度。
如图1D中所示,通过激光束加工等在绝缘树脂层16的预定部分形成导通孔20。
接下来,如图1E中所示,通过去污处理去除导通孔20中的污物。通过去污处理使粗糙面R的不平度光滑化,以形成小程度粗糙面R′,而不是通过去污处理粗化绝缘树脂层16的顶面。
接下来,如图1F中所示,在基板10上方的整个露出表面上形成作为连续层的无电解镀铜层22,该露出表面包括绝缘树脂层16的顶面(小程度粗糙面)R′、导通孔20的侧面和基层配线层14在导通孔20的底部露出的顶面。
接下来,如图1G中所示,将无电解镀铜层22用作供电层,以通过半加成工艺形成由电镀铜层构成的配线24。
由于配线24和作为底层的绝缘树脂层16之间的界面为小程度粗糙面R′,所以与原有粗糙面R相比较,这样得到的配线24具有较小的机械固着效果。这样,无法获得本应该通过铜箔毛面的不平度传递获得的较大的固着效果,从而导致树脂和配线之间的接合强度不足。
发明内容
鉴于以上情形作出本发明,并且本发明提供一种用于形成这样的配线的方法,即该配线确保其与作为底层的绝缘树脂层具有足够的接合强度。
在某些实施方案中,本发明的用于在绝缘树脂层上形成配线的方法包括:
在其上形成基层配线的绝缘基板上按顺序层压处于半固化状态的热固性树脂薄膜和金属箔,所述金属箔的毛面面向所述热固性树脂薄膜,并在加热的同时挤压所述热固性树脂薄膜和所述金属箔,使得金属箔的毛面的不平度传递到该毛面所挤压的处于半固化状态的树脂薄膜的顶面,从而形成粗糙面,以便形成这样的一体结构,即包括处于固化状态的所述热固性树脂薄膜的绝缘树脂层和所述金属箔层压在所述绝缘基板上;
在所述金属箔中形成开口,以便露出所述绝缘树脂层中将要形成导通孔的部分;
通过使用其中形成有所述开口的所述金属箔作为掩模,将光束照射到所述绝缘树脂层上,以在所述绝缘树脂层中形成所述导通孔;
通过所述金属箔的所述开口,进行所述导通孔的去污处理;
通过蚀刻去除所述金属箔,以便露出所述绝缘树脂层的顶面;
形成无电解镀层,所述无电解镀层连续覆盖所述绝缘树脂层的顶面、所述导通孔的侧面和所述基层配线中与所述导通孔的底部对应的顶面;以及
通过半加成工艺在所述无电解镀层上形成包括电镀层的配线。
根据本发明,通过毛面不平度的传递以粗化处于半固化状态的热固性薄膜的顶面。在绝缘树脂层中的导通孔上进行去污处理的时刻,金属箔进行覆盖以保护该绝缘树脂层中除该导通孔以外的顶面。在完成去污处理之后,去除金属箔。这样,绝缘树脂层的顶面成为完全保持从金属箔的毛面传递的不平度的粗糙面。因此,在通过电镀于粗糙面上形成的配线和绝缘树脂层之间的界面上,获得较高的机械固着效果,从而确保了较高的接合强度。
附图说明
图1A~1G为示出用于通过现有技术方法在绝缘树脂层上形成配线的工艺的横截面视图。
图2A~2H为示出用于在根据本发明实施例的绝缘树脂层上形成配线的工艺的横截面视图。
具体实施方式
将参照图2,说明用于在本发明实施例的绝缘树脂层上形成配线的方法。
如图2A中所示,提供绝缘树脂基板110,通过绝缘树脂层112,在绝缘树脂基板110的表面上形成由金属箔构成的基层配线层114。
接下来,如图2B中所示,在基板110上,将处于半固化状态的热固性树脂薄膜(绝缘树脂层)116和金属箔118一个叠加在另一个上,并在加热状态下进行加压(热压)。在此时,金属箔118的毛面(粗糙面)叠加在处于半固化状态的热固性树脂薄膜116的表面上。金属箔118的毛面的不平度传递到该毛面所挤压的处于半固化状态的树脂薄膜116的顶面,从而形成粗糙面R。因而,获得这样的一体结构,即包括绝缘树脂层112和基层配线层114的基板110、由热固性树脂薄膜构成的绝缘树脂层116及金属箔118层压在一起。
热固性绝缘树脂薄膜116可以是用于多层印刷配线基板的层间绝缘层的任何热固性绝缘树脂薄膜,不需要进行特别限制。用以获得本发明的优点的热固性绝缘树脂薄膜116的有利材料包括:(1)环氧基绝缘树脂(增层树脂);(2)玻璃环氧树脂(包括用玻璃布浸渍的预浸渍材料);(3)工程塑料(液晶聚合物(LCP)、聚醚醚酮(PEEK))。
金属箔118可以是通常用于多层印刷配线基板的任何金属材料(作为在压制过程中的脱模剂以及配线材料),不需要进行特别限制。典型金属箔包括铜箔和镍箔。这种金属箔具有一个光滑面,即所谓的光面,并具有一个为增强与树脂的粘附力而粗化的毛面。对于光面,典型铜箔的表面粗糙度Ra约为0.15至0.25微米;对于毛面,典型铜箔的表面粗糙度Ra约为2.0至4.0微米。
用于热压的条件根据所用的材料而变化。典型条件包括:对于以上情况(1)和(2)的材料,采用的条件是真空层压(110℃,0.1MPa,真空40秒,挤压20秒)+平压(100至150℃,0.3至1.0MPa);以及对于以上情况(3)的材料,采用的条件是通过用压力挤压来实施层压(150至230℃,1.0至5.0MPa)。
如图2C中所示,在金属箔118上形成抗蚀图案126,抗蚀图案126在这样的位置处具有开口125,即该位置与后面将要在绝缘树脂层116中形成的导通孔的位置对应。
如图2D中所示,使用抗蚀图案126作为掩模进行蚀刻。接着,去除在抗蚀图案126的开口125处露出的部分金属箔118,以形成开口128,然后去除抗蚀图案126。这样,使得绝缘树脂层116在开口128处露出。
接下来,如图2E中所示,照射高能射束,以在金属箔118的开口128的内部露出的绝缘树脂层116中形成导通孔120。接下来进行去污处理,以去除导通孔120中的污物。
接下来,如图2F中所示,通过蚀刻去除金属箔118。这就露出了绝缘树脂层116的粗糙面R。在去污过程中,由金属箔118保护粗糙面R,因此从金属箔118的毛面传递的不平度仍然保持不变。
在接下来的说明中,形成无电解镀层,并通过半加成工艺在其上形成电镀层。
也就是说,如图2G中所示,在基板110上方的整个露出表面上形成作为连续层的无电解镀层122,该露出表面包括绝缘树脂层116的顶面(小程度粗糙面)R、导通孔120的侧面和基层配线层114在导通孔120的底部露出的顶面。
最后,如图2H中所示,将无电解镀层122用作供电层,以通过半加成工艺形成由电镀层构成的配线124。无电解镀层122和电镀层通常为无电解镀铜层和电镀铜层。
通常按照下述步骤(A)至(D)进行半加成工艺:
(A)在无电解镀层122上形成抗蚀图案,该抗蚀图案具有限定配线图案的开口;
(B)在抗蚀图案的开口处露出的无电解镀层122上形成电镀层124;
(C)去除抗蚀图案,以便在未形成电镀层的部分露出无电解镀层;以及
(D)通过快速蚀刻(flash etching)去除露出的无电解镀层,以便确定由电镀层构成的配线124。
通过图2中的步骤(1)至(8)(即,图2A-2H中所示的步骤)获得的配线124具有作为其本身和作为底层的绝缘树脂层116之间界面的粗糙面R。因此,获得较高的机械固着效果,从而确保树脂和配线之间较高的接合强度。
对通过本发明实施例的方法形成的配线的剥离强度进行测试,并与通过现有技术方法形成的配线进行比较。剥离试验是使用根据JIS Z2201制成的试件,并通过根据JIS Z2241的拉伸试验方法而进行的。
[试样]
制备与图2H相同状态下的试样。然而,未形成导通孔120。配线124具有宽度为5至10mm的矩形形状,而不是实际的配线图案形状。薄膜厚度为15至25微米。
[试验方法]
拉伸试验仪器用于沿试样的纵向拉矩形配线124(包括无电解镀层122(种晶层))。在此时,配线在垂直上升的同时,以约30mm/min的速度移动,并且每隔五秒钟测量抗拉强度值。采用这些测量值的平均值作为绝缘树脂层116的剥离强度。
[试验结果]
根据试验结果,相对于未粗化绝缘树脂层表面的情况的剥离强度提高量,根据本发明实施例的试样的剥离强度提高量的最大值为7N/cm。目前所要求的剥离强度提高量等于或大于5N/cm。这样,根据本发明的方法基本上满足以上要求。
另一方面,根据现有技术方法所实现的剥离强度提高量的最大值为3N/cm,这不能满足以上要求。
根据本发明,提供一种用于形成这样的配线的方法,即该配线确保其与作为底层的绝缘树脂层之间具有足够的接合强度。
显然,对于所属领域的技术人员来说,在未背离本发明的要旨或保护范围的情况下,可以对本发明的所述优选实施例做出各种修改和变型。因而,本发明旨在涵盖与所附的权利要求书及其等同内容所限定的保护范围一致的本发明的所有修改和变型。
本申请基于2005年9月8日提交的日本专利申请No.2005-260844,并要求该申请的外国优先权,该申请的全部内容在此通过引用的方式并入本文。
Claims (2)
1.一种用于在绝缘树脂层上形成配线的方法,所述方法包括:
在其上形成基层配线的绝缘基板上按顺序层压处于半固化状态的热固性树脂薄膜和金属箔,所述金属箔的毛面面向所述热固性树脂薄膜,并在加热的同时挤压所述热固性树脂薄膜和所述金属箔,使得金属箔的毛面的不平度传递到该毛面所挤压的处于半固化状态的树脂薄膜的顶面,从而形成粗糙面,以便形成这样的一体结构,即,包括处于固化状态的所述热固性树脂薄膜的绝缘树脂层和所述金属箔层压在所述绝缘基板上;
在所述金属箔中形成开口,以便露出所述绝缘树脂层中将要形成导通孔的部分;
通过使用其中形成有所述开口的所述金属箔作为掩模,将光束照射到所述绝缘树脂层上,以在所述绝缘树脂层中形成所述导通孔;
通过所述金属箔的所述开口,进行所述导通孔的去污处理;
通过蚀刻去除所述金属箔,以便露出所述绝缘树脂层的顶面;
形成无电解镀层,所述无电解镀层连续覆盖所述绝缘树脂层的顶面、所述导通孔的侧面和所述基层配线中与所述导通孔的底部对应的顶面;以及
通过半加成工艺在所述无电解镀层上形成包括电镀层的配线。
2.根据权利要求1所述的用于形成配线的方法,其中,
所述半加成工艺包括:
在所述无电解镀层上形成抗蚀图案,所述抗蚀图案具有限定配线图案的开口;
在所述抗蚀图案的所述开口处露出的所述无电解镀层上形成所述电镀层;
去除所述抗蚀图案,以便露出所述无电解镀层中未形成有所述电镀层的部分;以及
通过快速蚀刻去除所述露出的无电解镀层,以便确定包括所述电镀层的配线。
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CN103929890A (zh) * | 2013-12-31 | 2014-07-16 | 中国科学院微电子研究所 | 一种电路板内层电路的制造方法 |
CN103929890B (zh) * | 2013-12-31 | 2017-08-29 | 中国科学院微电子研究所 | 一种电路板内层电路的制造方法 |
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