CN100559564C - 半导体集成电路器件及其制造方法 - Google Patents
半导体集成电路器件及其制造方法 Download PDFInfo
- Publication number
- CN100559564C CN100559564C CNB2004100369582A CN200410036958A CN100559564C CN 100559564 C CN100559564 C CN 100559564C CN B2004100369582 A CNB2004100369582 A CN B2004100369582A CN 200410036958 A CN200410036958 A CN 200410036958A CN 100559564 C CN100559564 C CN 100559564C
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- substrate
- oxide film
- silicon oxide
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- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title claims abstract description 142
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 59
- 239000004065 semiconductor Substances 0.000 title claims description 99
- 239000000758 substrate Substances 0.000 claims abstract description 184
- 230000003647 oxidation Effects 0.000 claims abstract description 72
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 72
- 125000006850 spacer group Chemical group 0.000 claims abstract description 49
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 147
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 147
- 230000008569 process Effects 0.000 claims description 28
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 abstract description 86
- 229910052581 Si3N4 Inorganic materials 0.000 abstract description 84
- 238000001312 dry etching Methods 0.000 abstract description 23
- 238000002955 isolation Methods 0.000 description 60
- 230000002093 peripheral effect Effects 0.000 description 42
- 238000005516 engineering process Methods 0.000 description 27
- 238000005229 chemical vapour deposition Methods 0.000 description 20
- 238000001039 wet etching Methods 0.000 description 19
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 18
- 238000000151 deposition Methods 0.000 description 17
- 230000008021 deposition Effects 0.000 description 17
- 238000001259 photo etching Methods 0.000 description 17
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 17
- 229920005591 polysilicon Polymers 0.000 description 17
- 229920002120 photoresistant polymer Polymers 0.000 description 16
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 14
- 239000012535 impurity Substances 0.000 description 14
- 229910052710 silicon Inorganic materials 0.000 description 14
- 239000010703 silicon Substances 0.000 description 14
- 208000005189 Embolism Diseases 0.000 description 11
- 150000002500 ions Chemical class 0.000 description 10
- 238000000280 densification Methods 0.000 description 8
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 7
- 229910052698 phosphorus Inorganic materials 0.000 description 7
- 239000011574 phosphorus Substances 0.000 description 7
- 238000005260 corrosion Methods 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 5
- 238000009826 distribution Methods 0.000 description 5
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 5
- 238000005498 polishing Methods 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 229910001936 tantalum oxide Inorganic materials 0.000 description 5
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 239000003518 caustics Substances 0.000 description 3
- 235000019994 cava Nutrition 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 230000003628 erosive effect Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229960002163 hydrogen peroxide Drugs 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonium chloride Substances [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 230000008485 antagonism Effects 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000010893 electron trap Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000005036 potential barrier Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- -1 tungsten nitride Chemical class 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
- H01L21/76229—Concurrent filling of a plurality of trenches having a different trench shape or dimension, e.g. rectangular and V-shaped trenches, wide and narrow trenches, shallow and deep trenches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
- H01L21/76232—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials of trenches having a shape other than rectangular or V-shape, e.g. rounded corners, oblique or rounded trench walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/60—Electrodes
- H01L28/82—Electrodes with an enlarged surface, e.g. formed by texturisation
- H01L28/90—Electrodes with an enlarged surface, e.g. formed by texturisation having vertical extensions
- H01L28/91—Electrodes with an enlarged surface, e.g. formed by texturisation having vertical extensions made by depositing layers, e.g. by depositing alternating conductive and insulating layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
- H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
- H10B12/03—Making the capacitor or connections thereto
- H10B12/033—Making the capacitor or connections thereto the capacitor extending over the transistor
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Semiconductor Memories (AREA)
- Element Separation (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Abstract
Description
Claims (12)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP055529/1999 | 1999-03-03 | ||
JP5552999 | 1999-03-03 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB998163945A Division CN1184682C (zh) | 1999-03-03 | 1999-12-10 | 半导体集成电路器件及其制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1540743A CN1540743A (zh) | 2004-10-27 |
CN100559564C true CN100559564C (zh) | 2009-11-11 |
Family
ID=13001269
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100369582A Expired - Lifetime CN100559564C (zh) | 1999-03-03 | 1999-12-10 | 半导体集成电路器件及其制造方法 |
CNB998163945A Expired - Lifetime CN1184682C (zh) | 1999-03-03 | 1999-12-10 | 半导体集成电路器件及其制造方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB998163945A Expired - Lifetime CN1184682C (zh) | 1999-03-03 | 1999-12-10 | 半导体集成电路器件及其制造方法 |
Country Status (5)
Country | Link |
---|---|
US (3) | US6562695B1 (zh) |
KR (1) | KR100761637B1 (zh) |
CN (2) | CN100559564C (zh) |
MY (1) | MY125313A (zh) |
TW (1) | TW471102B (zh) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020023715A1 (en) * | 2000-05-26 | 2002-02-28 | Norio Kimura | Substrate polishing apparatus and substrate polishing mehod |
KR100434959B1 (ko) * | 2001-12-31 | 2004-06-09 | 주식회사 하이닉스반도체 | 반도체소자의 레이아웃 방법 |
JP2003273206A (ja) * | 2002-03-18 | 2003-09-26 | Fujitsu Ltd | 半導体装置とその製造方法 |
US7399671B2 (en) | 2005-09-01 | 2008-07-15 | Micron Technology, Inc. | Disposable pillars for contact formation |
GB0517952D0 (en) * | 2005-09-02 | 2005-10-12 | Avx Ltd | Method of forming anode bodies for solid state capacitors |
CN100481375C (zh) * | 2005-09-29 | 2009-04-22 | 中芯国际集成电路制造(上海)有限公司 | 用于浅沟槽隔离的双制衬的方法与结构 |
CN101501835B (zh) * | 2006-08-18 | 2011-06-01 | 和舰科技(苏州)有限公司 | 一种用自对准氮化硅掩模形成浅沟槽隔离的方法 |
US7960797B2 (en) * | 2006-08-29 | 2011-06-14 | Micron Technology, Inc. | Semiconductor devices including fine pitch arrays with staggered contacts |
US7989336B2 (en) | 2009-05-06 | 2011-08-02 | Micron Technology, Inc. | Methods of forming a plurality of conductive lines in the fabrication of integrated circuitry, methods of forming an array of conductive lines, and integrated circuitry |
US8120140B2 (en) * | 2009-05-22 | 2012-02-21 | Macronix International Co., Ltd. | Isolation structure and formation method thereof |
CN102044421B (zh) * | 2009-10-13 | 2012-05-23 | 中芯国际集成电路制造(上海)有限公司 | 金属栅制作方法 |
US8304840B2 (en) * | 2010-07-29 | 2012-11-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Spacer structures of a semiconductor device |
US8697537B2 (en) * | 2012-02-01 | 2014-04-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of patterning for a semiconductor device |
US9950923B1 (en) * | 2017-04-11 | 2018-04-24 | Innovative Micro Technology | Method for making vias using a doped substrate |
WO2020000306A1 (en) | 2018-06-28 | 2020-01-02 | Yangtze Memory Technologies Co., Ltd. | Staircase structures for three-dimensional memory device double-sided routing |
WO2020000315A1 (en) * | 2018-06-28 | 2020-01-02 | Yangtze Memory Technologies Co., Ltd. | Method of forming staircase structures for three-dimensional memory device double-sided routing |
US10867840B2 (en) * | 2018-09-27 | 2020-12-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of forming a semiconductor device |
DE102019120765B4 (de) | 2018-09-27 | 2024-02-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Verfahren zum bilden eines halbleiterbauelements |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5753561A (en) * | 1996-09-30 | 1998-05-19 | Vlsi Technology, Inc. | Method for making shallow trench isolation structure having rounded corners |
Family Cites Families (30)
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US5258332A (en) * | 1987-08-28 | 1993-11-02 | Kabushiki Kaisha Toshiba | Method of manufacturing semiconductor devices including rounding of corner portions by etching |
JPH02260660A (ja) | 1989-03-31 | 1990-10-23 | Toshiba Corp | Mos型半導体装置の製造方法 |
JP2524863B2 (ja) * | 1990-05-02 | 1996-08-14 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
JP3003250B2 (ja) | 1991-04-01 | 2000-01-24 | 富士通株式会社 | 半導体装置の製造方法 |
JPH0774164A (ja) | 1993-07-02 | 1995-03-17 | Hitachi Ltd | 半導体メモリ装置及びその製造方法 |
JP2956455B2 (ja) * | 1993-11-17 | 1999-10-04 | 日本電気株式会社 | 半導体記憶装置の製造方法 |
JP3435786B2 (ja) * | 1994-03-31 | 2003-08-11 | 株式会社日立製作所 | 不揮発性半導体記憶装置の製造方法 |
JPH0897277A (ja) | 1994-09-29 | 1996-04-12 | Toshiba Corp | 半導体装置の製造方法 |
DE19519160C1 (de) | 1995-05-24 | 1996-09-12 | Siemens Ag | DRAM-Zellenanordnung und Verfahren zu deren Herstellung |
JP3362588B2 (ja) | 1995-12-18 | 2003-01-07 | 株式会社豊田中央研究所 | 半導体装置の製造方法 |
JP3238066B2 (ja) * | 1996-03-11 | 2001-12-10 | 株式会社東芝 | 半導体記憶装置およびその製造方法 |
JP4138035B2 (ja) * | 1996-08-23 | 2008-08-20 | 株式会社東芝 | 半導体装置 |
JPH10144886A (ja) | 1996-09-11 | 1998-05-29 | Toshiba Corp | 半導体装置及びその製造方法 |
JPH10144878A (ja) | 1996-11-06 | 1998-05-29 | Hitachi Ltd | 半導体集積回路装置およびその製造方法 |
US5882982A (en) * | 1997-01-16 | 1999-03-16 | Vlsi Technology, Inc. | Trench isolation method |
US5674775A (en) * | 1997-02-20 | 1997-10-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Isolation trench with a rounded top edge using an etch buffer layer |
US5910018A (en) * | 1997-02-24 | 1999-06-08 | Winbond Electronics Corporation | Trench edge rounding method and structure for trench isolation |
US6424011B1 (en) * | 1997-04-14 | 2002-07-23 | International Business Machines Corporation | Mixed memory integration with NVRAM, dram and sram cell structures on same substrate |
JPH1117139A (ja) | 1997-06-25 | 1999-01-22 | Hitachi Ltd | 半導体集積回路装置およびその製造方法 |
US5960297A (en) * | 1997-07-02 | 1999-09-28 | Kabushiki Kaisha Toshiba | Shallow trench isolation structure and method of forming the same |
JPH1174475A (ja) | 1997-08-28 | 1999-03-16 | Hitachi Ltd | 半導体集積回路装置およびその製造方法 |
JP3914618B2 (ja) | 1997-09-24 | 2007-05-16 | エルピーダメモリ株式会社 | 半導体集積回路装置 |
US6009023A (en) * | 1998-05-26 | 1999-12-28 | Etron Technology, Inc. | High performance DRAM structure employing multiple thickness gate oxide |
US6166417A (en) * | 1998-06-30 | 2000-12-26 | Intel Corporation | Complementary metal gates and a process for implementation |
JP2000031264A (ja) | 1998-07-08 | 2000-01-28 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
US6355540B2 (en) * | 1998-07-27 | 2002-03-12 | Acer Semicondutor Manufacturing Inc. | Stress-free shallow trench isolation |
JP2000068367A (ja) | 1998-08-19 | 2000-03-03 | Hitachi Ltd | 半導体集積回路装置の製造方法 |
US6372601B1 (en) * | 1998-09-03 | 2002-04-16 | Micron Technology, Inc. | Isolation region forming methods |
US6274498B1 (en) * | 1998-09-03 | 2001-08-14 | Micron Technology, Inc. | Methods of forming materials within openings, and method of forming isolation regions |
TW400615B (en) * | 1998-11-23 | 2000-08-01 | United Microelectronics Corp | The structure process of Shallow Trench Isolation(STI) |
-
1999
- 1999-12-10 KR KR1020017011108A patent/KR100761637B1/ko active IP Right Grant
- 1999-12-10 CN CNB2004100369582A patent/CN100559564C/zh not_active Expired - Lifetime
- 1999-12-10 CN CNB998163945A patent/CN1184682C/zh not_active Expired - Lifetime
- 1999-12-10 US US09/889,018 patent/US6562695B1/en not_active Expired - Lifetime
-
2000
- 2000-02-02 TW TW089101851A patent/TW471102B/zh not_active IP Right Cessation
- 2000-02-11 MY MYPI20000480 patent/MY125313A/en unknown
-
2003
- 2003-02-14 US US10/366,423 patent/US6720234B2/en not_active Expired - Lifetime
-
2004
- 2004-02-17 US US10/778,081 patent/US7397104B2/en not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5753561A (en) * | 1996-09-30 | 1998-05-19 | Vlsi Technology, Inc. | Method for making shallow trench isolation structure having rounded corners |
Also Published As
Publication number | Publication date |
---|---|
CN1338115A (zh) | 2002-02-27 |
US6720234B2 (en) | 2004-04-13 |
KR20010110456A (ko) | 2001-12-13 |
CN1540743A (zh) | 2004-10-27 |
MY125313A (en) | 2006-07-31 |
WO2000052754A1 (fr) | 2000-09-08 |
US6562695B1 (en) | 2003-05-13 |
TW471102B (en) | 2002-01-01 |
US20040159883A1 (en) | 2004-08-19 |
CN1184682C (zh) | 2005-01-12 |
US20030148587A1 (en) | 2003-08-07 |
KR100761637B1 (ko) | 2007-09-27 |
US7397104B2 (en) | 2008-07-08 |
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