CN100556269C - 支承销把持装置及基板支承装置 - Google Patents

支承销把持装置及基板支承装置 Download PDF

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Publication number
CN100556269C
CN100556269C CNB2005800053243A CN200580005324A CN100556269C CN 100556269 C CN100556269 C CN 100556269C CN B2005800053243 A CNB2005800053243 A CN B2005800053243A CN 200580005324 A CN200580005324 A CN 200580005324A CN 100556269 C CN100556269 C CN 100556269C
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fulcrum post
support pin
pin holding
advance
retreat
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Chinese (zh)
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CN1922949A (zh
Inventor
近藤毅
伊藤明伸
须原信介
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Fuji Corp
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Fuji Machine Manufacturing Co Ltd
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Publication of CN1922949A publication Critical patent/CN1922949A/zh
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manipulator (AREA)
CNB2005800053243A 2004-02-20 2005-02-16 支承销把持装置及基板支承装置 Active CN100556269C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004044221 2004-02-20
JP044221/2004 2004-02-20

Publications (2)

Publication Number Publication Date
CN1922949A CN1922949A (zh) 2007-02-28
CN100556269C true CN100556269C (zh) 2009-10-28

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CNB2005800053243A Active CN100556269C (zh) 2004-02-20 2005-02-16 支承销把持装置及基板支承装置

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JP (1) JP4499096B2 (ja)
CN (1) CN100556269C (ja)
WO (1) WO2005081611A1 (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4851314B2 (ja) * 2006-12-27 2012-01-11 富士機械製造株式会社 プリント基板保持装置
DE102008023614B3 (de) * 2008-05-15 2009-11-26 Siemens Aktiengesellschaft Verfahren zum automatischen Positionieren von Unterstützungsstiften und Bestückautomat
DE102008023613B3 (de) * 2008-05-15 2009-07-30 Siemens Aktiengesellschaft Vorrichtung und Verfahren zum Positionieren von Unterstützungsstiften und Bestückautomat
JP5445534B2 (ja) 2011-08-08 2014-03-19 パナソニック株式会社 電子部品実装装置および電子部品実装方法ならびに下受けピンモジュールの配置変更方法
JP5494588B2 (ja) * 2011-08-08 2014-05-14 パナソニック株式会社 電子部品実装装置用の下受けピンモジュールおよび基板下受け装置ならびに基板下受け方法
JP5747167B2 (ja) 2012-02-02 2015-07-08 パナソニックIpマネジメント株式会社 下受けピンの配置方法および下受けピンの返戻方法
JP5984284B2 (ja) * 2012-02-28 2016-09-06 Jukiオートメーションシステムズ株式会社 部品実装装置及び基板の製造方法
CN105027697B (zh) * 2013-03-05 2018-04-13 富士机械制造株式会社 支撑销及支撑销自动更换系统
US10117368B2 (en) 2013-09-04 2018-10-30 Fuji Corporation Board work device
CN107176450A (zh) * 2016-03-09 2017-09-19 精工爱普生株式会社 电子部件运送装置、以及电子部件检查装置
JP7385534B2 (ja) 2020-06-22 2023-11-22 ヤマハ発動機株式会社 搬送装置、基板処理装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3752922B2 (ja) * 1999-10-12 2006-03-08 松下電器産業株式会社 電子部品実装装置における基板下受けピンのクランプ機構
JP3430081B2 (ja) * 1999-10-13 2003-07-28 Necセミコンダクターズ九州株式会社 吸着ペン
JP2003264397A (ja) * 2002-03-08 2003-09-19 Hitachi High-Tech Instruments Co Ltd 電子部品実装装置の基板バックアップピン自動入替え機構及びそれを用いた基板バックアップ自動入替え方法

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Publication number Publication date
CN1922949A (zh) 2007-02-28
JPWO2005081611A1 (ja) 2008-01-17
JP4499096B2 (ja) 2010-07-07
WO2005081611A1 (ja) 2005-09-01

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Address after: Aichi

Patentee after: Fuji Corporation

Address before: Aichi

Patentee before: Fuji Machinery Manufacturing Co., Ltd.