CN100556269C - 支承销把持装置及基板支承装置 - Google Patents
支承销把持装置及基板支承装置 Download PDFInfo
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- CN100556269C CN100556269C CNB2005800053243A CN200580005324A CN100556269C CN 100556269 C CN100556269 C CN 100556269C CN B2005800053243 A CNB2005800053243 A CN B2005800053243A CN 200580005324 A CN200580005324 A CN 200580005324A CN 100556269 C CN100556269 C CN 100556269C
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- fulcrum post
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manipulator (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004044221 | 2004-02-20 | ||
JP044221/2004 | 2004-02-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1922949A CN1922949A (zh) | 2007-02-28 |
CN100556269C true CN100556269C (zh) | 2009-10-28 |
Family
ID=34879335
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005800053243A Active CN100556269C (zh) | 2004-02-20 | 2005-02-16 | 支承销把持装置及基板支承装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4499096B2 (ja) |
CN (1) | CN100556269C (ja) |
WO (1) | WO2005081611A1 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4851314B2 (ja) * | 2006-12-27 | 2012-01-11 | 富士機械製造株式会社 | プリント基板保持装置 |
DE102008023614B3 (de) * | 2008-05-15 | 2009-11-26 | Siemens Aktiengesellschaft | Verfahren zum automatischen Positionieren von Unterstützungsstiften und Bestückautomat |
DE102008023613B3 (de) * | 2008-05-15 | 2009-07-30 | Siemens Aktiengesellschaft | Vorrichtung und Verfahren zum Positionieren von Unterstützungsstiften und Bestückautomat |
JP5445534B2 (ja) | 2011-08-08 | 2014-03-19 | パナソニック株式会社 | 電子部品実装装置および電子部品実装方法ならびに下受けピンモジュールの配置変更方法 |
JP5494588B2 (ja) * | 2011-08-08 | 2014-05-14 | パナソニック株式会社 | 電子部品実装装置用の下受けピンモジュールおよび基板下受け装置ならびに基板下受け方法 |
JP5747167B2 (ja) | 2012-02-02 | 2015-07-08 | パナソニックIpマネジメント株式会社 | 下受けピンの配置方法および下受けピンの返戻方法 |
JP5984284B2 (ja) * | 2012-02-28 | 2016-09-06 | Jukiオートメーションシステムズ株式会社 | 部品実装装置及び基板の製造方法 |
CN105027697B (zh) * | 2013-03-05 | 2018-04-13 | 富士机械制造株式会社 | 支撑销及支撑销自动更换系统 |
US10117368B2 (en) | 2013-09-04 | 2018-10-30 | Fuji Corporation | Board work device |
CN107176450A (zh) * | 2016-03-09 | 2017-09-19 | 精工爱普生株式会社 | 电子部件运送装置、以及电子部件检查装置 |
JP7385534B2 (ja) | 2020-06-22 | 2023-11-22 | ヤマハ発動機株式会社 | 搬送装置、基板処理装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3752922B2 (ja) * | 1999-10-12 | 2006-03-08 | 松下電器産業株式会社 | 電子部品実装装置における基板下受けピンのクランプ機構 |
JP3430081B2 (ja) * | 1999-10-13 | 2003-07-28 | Necセミコンダクターズ九州株式会社 | 吸着ペン |
JP2003264397A (ja) * | 2002-03-08 | 2003-09-19 | Hitachi High-Tech Instruments Co Ltd | 電子部品実装装置の基板バックアップピン自動入替え機構及びそれを用いた基板バックアップ自動入替え方法 |
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2005
- 2005-02-16 JP JP2006510208A patent/JP4499096B2/ja active Active
- 2005-02-16 CN CNB2005800053243A patent/CN100556269C/zh active Active
- 2005-02-16 WO PCT/JP2005/002327 patent/WO2005081611A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
CN1922949A (zh) | 2007-02-28 |
JPWO2005081611A1 (ja) | 2008-01-17 |
JP4499096B2 (ja) | 2010-07-07 |
WO2005081611A1 (ja) | 2005-09-01 |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Aichi Patentee after: Fuji Corporation Address before: Aichi Patentee before: Fuji Machinery Manufacturing Co., Ltd. |