CN100549215C - 真空蒸镀用校准装置 - Google Patents

真空蒸镀用校准装置 Download PDF

Info

Publication number
CN100549215C
CN100549215C CNB2005800511097A CN200580051109A CN100549215C CN 100549215 C CN100549215 C CN 100549215C CN B2005800511097 A CNB2005800511097 A CN B2005800511097A CN 200580051109 A CN200580051109 A CN 200580051109A CN 100549215 C CN100549215 C CN 100549215C
Authority
CN
China
Prior art keywords
mentioned
mask
connecting board
substrate
vacuum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CNB2005800511097A
Other languages
English (en)
Chinese (zh)
Other versions
CN101228290A (zh
Inventor
冈田利幸
菊地昌弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Zosen Corp
Original Assignee
Hitachi Zosen Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Zosen Corp filed Critical Hitachi Zosen Corp
Publication of CN101228290A publication Critical patent/CN101228290A/zh
Application granted granted Critical
Publication of CN100549215C publication Critical patent/CN100549215C/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
CNB2005800511097A 2005-08-25 2005-08-25 真空蒸镀用校准装置 Active CN100549215C (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2005/015454 WO2007023553A1 (ja) 2005-08-25 2005-08-25 真空蒸着用アライメント装置

Publications (2)

Publication Number Publication Date
CN101228290A CN101228290A (zh) 2008-07-23
CN100549215C true CN100549215C (zh) 2009-10-14

Family

ID=37771311

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2005800511097A Active CN100549215C (zh) 2005-08-25 2005-08-25 真空蒸镀用校准装置

Country Status (4)

Country Link
JP (1) JP4785856B2 (ja)
KR (1) KR101173512B1 (ja)
CN (1) CN100549215C (ja)
WO (1) WO2007023553A1 (ja)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5167103B2 (ja) * 2008-12-15 2013-03-21 株式会社日立ハイテクノロジーズ 成膜装置
JP5277059B2 (ja) * 2009-04-16 2013-08-28 株式会社日立ハイテクノロジーズ 成膜装置及び成膜システム
JP5623786B2 (ja) 2009-05-22 2014-11-12 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． 薄膜蒸着装置
JP5620146B2 (ja) 2009-05-22 2014-11-05 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． 薄膜蒸着装置
US8882920B2 (en) 2009-06-05 2014-11-11 Samsung Display Co., Ltd. Thin film deposition apparatus
US8882921B2 (en) 2009-06-08 2014-11-11 Samsung Display Co., Ltd. Thin film deposition apparatus
KR101127575B1 (ko) 2009-08-10 2012-03-23 삼성모바일디스플레이주식회사 증착 가림막을 가지는 박막 증착 장치
JP5328726B2 (ja) 2009-08-25 2013-10-30 三星ディスプレイ株式會社 薄膜蒸着装置及びこれを利用した有機発光ディスプレイ装置の製造方法
JP5677785B2 (ja) 2009-08-27 2015-02-25 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． 薄膜蒸着装置及びこれを利用した有機発光表示装置の製造方法
US8696815B2 (en) 2009-09-01 2014-04-15 Samsung Display Co., Ltd. Thin film deposition apparatus
US8876975B2 (en) 2009-10-19 2014-11-04 Samsung Display Co., Ltd. Thin film deposition apparatus
JP5399207B2 (ja) * 2009-11-05 2014-01-29 日立造船株式会社 蒸着装置及び蒸着方法
WO2011081046A1 (ja) * 2009-12-28 2011-07-07 株式会社アルバック 成膜装置及び成膜方法
KR101084184B1 (ko) 2010-01-11 2011-11-17 삼성모바일디스플레이주식회사 박막 증착 장치
KR101174875B1 (ko) 2010-01-14 2012-08-17 삼성디스플레이 주식회사 박막 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조방법 및 이에 따라 제조된 유기 발광 디스플레이 장치
KR101193186B1 (ko) 2010-02-01 2012-10-19 삼성디스플레이 주식회사 박막 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조방법 및 이에 따라 제조된 유기 발광 디스플레이 장치
KR101156441B1 (ko) 2010-03-11 2012-06-18 삼성모바일디스플레이주식회사 박막 증착 장치
KR101202348B1 (ko) 2010-04-06 2012-11-16 삼성디스플레이 주식회사 박막 증착 장치 및 이를 이용한 유기 발광 표시 장치의 제조 방법
US8894458B2 (en) 2010-04-28 2014-11-25 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
JP2011231384A (ja) * 2010-04-28 2011-11-17 Ulvac Japan Ltd 成膜装置及びアライメント方法
JP5783811B2 (ja) * 2010-07-06 2015-09-24 キヤノン株式会社 成膜装置
KR101223723B1 (ko) 2010-07-07 2013-01-18 삼성디스플레이 주식회사 박막 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조방법 및 이에 따라 제조된 유기 발광 디스플레이 장치
KR101673017B1 (ko) 2010-07-30 2016-11-07 삼성디스플레이 주식회사 박막 증착 장치 및 이를 이용한 유기 발광 표시장치의 제조 방법
KR101738531B1 (ko) 2010-10-22 2017-05-23 삼성디스플레이 주식회사 유기 발광 디스플레이 장치의 제조 방법 및 이에 따라 제조된 유기 발광 디스플레이 장치
KR101723506B1 (ko) 2010-10-22 2017-04-19 삼성디스플레이 주식회사 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
KR20120045865A (ko) 2010-11-01 2012-05-09 삼성모바일디스플레이주식회사 유기층 증착 장치
KR20120065789A (ko) 2010-12-13 2012-06-21 삼성모바일디스플레이주식회사 유기층 증착 장치
KR101760897B1 (ko) 2011-01-12 2017-07-25 삼성디스플레이 주식회사 증착원 및 이를 구비하는 유기막 증착 장치
JP5693378B2 (ja) * 2011-05-25 2015-04-01 株式会社アルバック 移動装置
KR101852517B1 (ko) 2011-05-25 2018-04-27 삼성디스플레이 주식회사 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
KR101840654B1 (ko) 2011-05-25 2018-03-22 삼성디스플레이 주식회사 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
KR101857249B1 (ko) 2011-05-27 2018-05-14 삼성디스플레이 주식회사 패터닝 슬릿 시트 어셈블리, 유기막 증착 장치, 유기 발광 표시장치제조 방법 및 유기 발광 표시 장치
KR101826068B1 (ko) 2011-07-04 2018-02-07 삼성디스플레이 주식회사 유기층 증착 장치
KR102052069B1 (ko) 2012-11-09 2019-12-05 삼성디스플레이 주식회사 유기층 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조 방법 및 이에 따라 제조된 유기 발광 디스플레이 장치
KR102017744B1 (ko) 2012-12-12 2019-10-15 삼성디스플레이 주식회사 증착 장치, 이를 이용한 박막 형성 방법 및 유기 발광 표시 장치 제조 방법
KR102075525B1 (ko) 2013-03-20 2020-02-11 삼성디스플레이 주식회사 유기층 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조 방법 및 이에 따라 제조된 유기 발광 디스플레이 장치
KR102069189B1 (ko) 2013-06-17 2020-01-23 삼성디스플레이 주식회사 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
KR102107104B1 (ko) 2013-06-17 2020-05-07 삼성디스플레이 주식회사 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
JP2014056830A (ja) * 2013-10-30 2014-03-27 Hitachi High-Technologies Corp 有機ｅｌデバイス製造装置及びその製造方法
CN106059181B (zh) * 2016-06-08 2018-09-28 深圳斯玛尔特微电机有限公司 电动执行器
JP6262811B2 (ja) * 2016-07-08 2018-01-17 キヤノントッキ株式会社 真空成膜装置
CN112771688A (zh) * 2018-10-30 2021-05-07 应用材料公司 基板处理装置
CN109112489B (zh) * 2018-11-01 2021-01-15 京东方科技集团股份有限公司 一种蒸镀设备及蒸镀方法
JP7118864B2 (ja) * 2018-11-07 2022-08-16 キヤノントッキ株式会社 成膜装置、製造システム、有機ｅｌパネルの製造システム
KR102700370B1 (ko) 2019-08-10 2024-08-28 캐논 톡키 가부시키가이샤 마스크 얼라인먼트 방법, 성막 방법, 마스크 얼라인먼트 장치, 및 성막 장치
JP7361671B2 (ja) * 2020-09-30 2023-10-16 キヤノントッキ株式会社 成膜装置、調整装置、調整方法、及び電子デバイスの製造方法
KR102459945B1 (ko) * 2020-10-21 2022-11-01 아이엠에스(주) 기판처리장치
CN112501581B (zh) * 2020-11-12 2022-02-22 北京北方华创微电子装备有限公司 半导体加工设备中的遮蔽盘承载装置及半导体加工设备
CN114908329B (zh) * 2021-02-08 2024-03-08 台湾积体电路制造股份有限公司 校正方法及半导体制造设备

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1143797A (zh) * 1994-12-29 1997-02-26 索尼公司 控制跟踪带状记录介质的控制装置和方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3789857B2 (ja) * 2002-06-25 2006-06-28 トッキ株式会社 蒸着装置
JP4184771B2 (ja) * 2002-11-27 2008-11-19 株式会社アルバック アライメント装置、成膜装置
JP4596794B2 (ja) * 2004-02-27 2010-12-15 日立造船株式会社 真空蒸着用アライメント装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1143797A (zh) * 1994-12-29 1997-02-26 索尼公司 控制跟踪带状记录介质的控制装置和方法

Also Published As

Publication number Publication date
KR101173512B1 (ko) 2012-08-14
JP4785856B2 (ja) 2011-10-05
JPWO2007023553A1 (ja) 2009-02-26
WO2007023553A1 (ja) 2007-03-01
KR20080036983A (ko) 2008-04-29
CN101228290A (zh) 2008-07-23

Similar Documents

Publication Publication Date Title
CN100549215C (zh) 真空蒸镀用校准装置
CN103154304B (zh) 成膜装置
CN101863163B (zh) 可印刷的基底和喷嘴对准系统
JP4624236B2 (ja) 真空蒸着用アライメント装置
CN100587103C (zh) 真空蒸镀用校准装置
CN103339281A (zh) 成膜装置
CN101323396A (zh) 基板吸附装置和基板搬送装置以及外观检查装置
KR102454458B1 (ko) 기판 조립 장치와 그것을 이용한 기판 조립 방법
CN109839766B (zh) 基板装配装置以及基板装配装置的平台构造
JP2006235019A (ja) 露光装置、露光方法、及び表示用パネル基板の製造方法
KR102407628B1 (ko) 테이블 장치, 위치결정장치, 플랫 패널 디스플레이 제조장치, 및 정밀기계
JP4596794B2 (ja) 真空蒸着用アライメント装置
JP2013125795A (ja) 基板位置決め装置及び基板位置決め方法
JP7317520B2 (ja) 表示装置の製造装置及び表示装置の製造方法
JP5176631B2 (ja) 基板搬送装置及び基板検査装置
JP2007219537A (ja) ワークチャック及びその制御方法
JP5153813B2 (ja) 真空蒸着用アライメント装置
JP2006246263A (ja) 撮像素子取付け具
KR100897846B1 (ko) 기판 위치 정렬 장치
JP2007148462A (ja) ワークチャック及びその制御方法
CN216622123U (zh) 一种光源切换装置及光学检测设备
JP2007148414A (ja) ワークチャック及びその制御方法
CN117549267A (zh) 一种调节XYθ轴的运动平台装置
JP2008145762A (ja) 基板処理装置および基板処理方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant