CN100541059C - 膨胀阀 - Google Patents

膨胀阀 Download PDF

Info

Publication number
CN100541059C
CN100541059C CNB2005100052952A CN200510005295A CN100541059C CN 100541059 C CN100541059 C CN 100541059C CN B2005100052952 A CNB2005100052952 A CN B2005100052952A CN 200510005295 A CN200510005295 A CN 200510005295A CN 100541059 C CN100541059 C CN 100541059C
Authority
CN
China
Prior art keywords
valve body
sealing parts
valve
valve chamber
peristome
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2005100052952A
Other languages
English (en)
Other versions
CN1654907A (zh
Inventor
小林和人
渡边和彦
须藤真
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikoki Corp
Original Assignee
Fujikoki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikoki Corp filed Critical Fujikoki Corp
Publication of CN1654907A publication Critical patent/CN1654907A/zh
Application granted granted Critical
Publication of CN100541059C publication Critical patent/CN100541059C/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B41/00—Fluid-circulation arrangements
    • F25B41/30—Expansion means; Dispositions thereof
    • F25B41/31—Expansion valves
    • F25B41/33—Expansion valves with the valve member being actuated by the fluid pressure, e.g. by the pressure of the refrigerant
    • F25B41/335—Expansion valves with the valve member being actuated by the fluid pressure, e.g. by the pressure of the refrigerant via diaphragms
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2341/00—Details of ejectors not being used as compression device; Details of flow restrictors or expansion valves
    • F25B2341/06—Details of flow restrictors or expansion valves
    • F25B2341/068—Expansion valves combined with a sensor
    • F25B2341/0683—Expansion valves combined with a sensor the sensor is disposed in the suction line and influenced by the temperature or the pressure of the suction gas
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2500/00—Problems to be solved
    • F25B2500/01—Geometry problems, e.g. for reducing size
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2500/00—Problems to be solved
    • F25B2500/21—Reduction of parts

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Fluid Mechanics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Temperature-Responsive Valves (AREA)
  • Air-Conditioning For Vehicles (AREA)

Abstract

本发明改进了使用在空调装置的膨胀阀的部件的安装结构。本发明的膨胀阀(30)具有从压缩机流入制冷剂的流入通路(32)和阀室(35)，通过阀体(32b)和节流孔(32a)的流路的制冷剂从通路(321)被送入到蒸发器。从蒸发器返回的制冷剂通过通路(34)返回到压缩机侧。执行元件(36)根据蒸发器的热负荷操作阀体(32b)，并控制制冷剂的流量。螺旋弹簧(32d)配置在阀室(35)内、对阀体(32b)施加朝向节流孔(32a)方向的弹力，螺旋弹簧(32d)的下端由封固部件(150)支承，封固部件(150)插入到阀室的开口部(35a)、通过凿紧加工部(K1)固定。

Description

膨胀阀
技术领域
本发明涉及一种安装在汽车空调器等空调装置上、根据制冷剂的温度控制向蒸发器(evaporator)供给的制冷剂流量的膨胀阀。
背景技术
这种膨胀阀在例如特许文献2000-304381号公报中被公开。对于现有的膨胀阀，具有阀支承构件、弹簧和调节螺栓等，所需要的构件数量多，因此膨胀阀的小型化和轻量化的实现是困难的。
而且会产生由阀室通过调节螺栓部分制冷剂泄漏等的不良情况的危险。
发明内容
鉴于以上缺点，本发明的目的是对应于要实现车辆空调的小型化和轻量化的要求，提供一种结构简单，减少组装工时的膨胀阀。
本发明的膨胀阀具有：阀本体；设置在所述阀本体的上端部、对应隔膜的变位而驱动阀体的执行元件部；在所述阀本体的下端部开口地设置在所述阀主体上的阀室；设置在所述阀室内、对所述阀体向闭阀方向施加作用力的弹簧；以及插入所述阀室的开口部、支撑所述弹簧，同时通过凿紧加工部被固定在所述阀本体上的封固部件。另外，所述阀室的开口部一侧的宽度增大，形成台阶部，所述封固部件通过所述凿紧加工部以按压在所述台阶部上的状态被固定，通过所述封固部件按压在所述台阶部上使抵接面互相挤压而形成密封部。
另外，封固部件可以在与所述阀体相对一侧的周围具有锥形面，或者在所述封固部件的外周部与所述阀室的开口部一侧的内周部之间设有密封部件。
附图说明
图1是本发明膨胀阀的剖视图；
图2是图1主要部分的放大图；
图3是示出本发明另一实施例的说明图；
图4是示出本发明再一实施例的说明图。
图中
10膨胀阀    30阀本体    32压缩机侧的制冷剂的通路
35阀室      321通向蒸发器的制冷剂通路
34从蒸发器返回的制冷剂通路    32b阀体        316工作棒
36执行元件  36a隔膜           312止动部件    150封固部件
具体实施方式
图1是本发明膨胀阀的剖视图。
用附图标记10表示整体的膨胀阀具有由铝合金制成的方柱形状的阀本体30，并具有从接收器流向蒸发器的制冷剂的流入通路32。通路32经由阀室35、节流孔32a而与向蒸发器侧的流出口321连通。
在阀室35内，球形的阀体32b由支承部件32c支承。在阀室35的开口部35a处插入有封固部件150，在由凿紧加工的凿紧部K1而固定的阀体的支承部件32c和封固部件150之间，配设有螺旋弹簧32d，对阀体32b施加朝向节流孔32a的弹力。
从蒸发器返回的制冷剂通过通路34而被送向到压缩机侧。
在阀本体30的上部安装有驱动阀体的执行元件部36。
执行元件部36具有上壳体36d和下壳体36h，在两个壳体之间夹持有隔膜36a。在隔膜36a和上壳体36d之间形成上部压力工作室36b，通过密封管36i封入工作气体。
隔膜36a的下部由止动部件312支承。止动部件312具有大直径部314和小直径部315，在两者间形成有下部压力工作室36c。
下壳体36h利用螺栓部361固定在阀本体30上。
下部压力工作室36c通过开口部36e与通路34连通。
插入到止动部件312的小径部315中工作棒316通过止动部件312兼具有将制冷剂的温度信息传递到上部压力工作室36b的感温棒的功能。
工作棒316贯通阀本体30的中央，并操作阀体32b。在连通通路34的孔38内插入有封固部件50，封密部件50安装在工作棒316上。
移动是利用卡环41’而限定的。
利用该封密结构完全地分离流向蒸发器的制冷剂和从蒸发器返回的制冷剂。
本发明的膨胀阀10按以上所述而构成，通过执行元件部36的作用控制阀体32b和节流孔32a之间的制冷剂通路的开口面积，从而控制制冷剂的流量。
图2是示出图1的阀室35的封固部件150的安装结构的放大图。
封固部件150其表面为平面。阀本体30的阀室35的开口部35a在和阀室35之间形成有台阶部。通过凿紧部K1将封固部件150压入到开口部35a内，在与台阶部之间形成牢固的密封部S1。
图3是示出本发明另一实施例的说明图。
封固部件250其表面为锥形面。阀本体30的阀室35的开口部35a在和阀室35之间形成有台阶部。通过凿紧部K1将封固部件250压入到开口部35a内，在与台阶部之间形成牢固的密封部S1。
图4是示出本发明再一实施例的说明图。
封固部件350在其外周部具有密封部件360。通过凿紧部K1将封固部件350固定在开口部35a上。通过具有密封部件360能够实现确实的密封。

Claims (3)

1.一种膨胀阀，其特征在于，具有：阀本体；设置在所述阀本体的上端部、对应隔膜的变位驱动阀体的执行元件部；在所述阀本体的下端部开口地设置在所述阀本体上的阀室；设置在所述阀室内、对所述阀体向闭阀方向施加作用力的弹簧；以及插入所述阀室的开口部、支承所述弹簧，同时通过凿紧加工部被固定在所述阀本体上的封固部件，
所述阀室的开口部一侧的宽度增大，形成台阶部，所述封固部件通过所述凿紧加工部以按压在所述台阶部上的状态被固定，通过所述封固部件按压在所述台阶部上使抵接面互相挤压而形成密封部。
2.如权利要求1所述的膨胀阀，其特征在于，所述封固部件在与所述阀体相对一侧的周围具有锥形面，在所述封固部件被固定在所述阀本体上的状态下，所述台阶部的角部与所述锥形面线接触。
3.如权利要求1所述的膨胀阀，其特征在于，在所述封固部件的外周部与所述阀室的开口部一侧的内周部之间设有密封部件。
CNB2005100052952A 2004-02-13 2005-02-04 膨胀阀 Expired - Fee Related CN100541059C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004036866 2004-02-13
JP2004036866A JP2005226940A (ja) 2004-02-13 2004-02-13 膨張弁

Publications (2)

Publication Number Publication Date
CN1654907A CN1654907A (zh) 2005-08-17
CN100541059C true CN100541059C (zh) 2009-09-16

Family

ID=34697926

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2005100052952A Expired - Fee Related CN100541059C (zh) 2004-02-13 2005-02-04 膨胀阀

Country Status (6)

Country Link
US (1) US7222502B2 (zh)
EP (1) EP1564509B1 (zh)
JP (1) JP2005226940A (zh)
KR (1) KR20060041893A (zh)
CN (1) CN100541059C (zh)
DE (1) DE602004017416D1 (zh)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100582534C (zh) * 2006-07-07 2010-01-20 浙江三花汽车控制系统有限公司 热力膨胀阀
JP2008076031A (ja) * 2006-09-25 2008-04-03 Denso Corp 膨張弁
US8267329B2 (en) * 2007-01-26 2012-09-18 Fujikoki Corporation Expansion valve with noise reduction means
US7983040B2 (en) 2008-10-23 2011-07-19 International Business Machines Corporation Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem
US7961475B2 (en) * 2008-10-23 2011-06-14 International Business Machines Corporation Apparatus and method for facilitating immersion-cooling of an electronic subsystem
US7944694B2 (en) * 2008-10-23 2011-05-17 International Business Machines Corporation Liquid cooling apparatus and method for cooling blades of an electronic system chassis
US7916483B2 (en) 2008-10-23 2011-03-29 International Business Machines Corporation Open flow cold plate for liquid cooled electronic packages
US7885070B2 (en) 2008-10-23 2011-02-08 International Business Machines Corporation Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow
US8322154B2 (en) * 2009-09-09 2012-12-04 International Business Machines Corporation Control of system coolant to facilitate two-phase heat transfer in a multi-evaporator cooling system
US8583290B2 (en) * 2009-09-09 2013-11-12 International Business Machines Corporation Cooling system and method minimizing power consumption in cooling liquid-cooled electronics racks
US20110056675A1 (en) 2009-09-09 2011-03-10 International Business Machines Corporation Apparatus and method for adjusting coolant flow resistance through liquid-cooled electronics rack(s)
US20110058637A1 (en) 2009-09-09 2011-03-10 International Business Machines Corporation Pressure control unit and method facilitating single-phase heat transfer in a cooling system
US8208258B2 (en) * 2009-09-09 2012-06-26 International Business Machines Corporation System and method for facilitating parallel cooling of liquid-cooled electronics racks
US8179677B2 (en) 2010-06-29 2012-05-15 International Business Machines Corporation Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack
US8345423B2 (en) 2010-06-29 2013-01-01 International Business Machines Corporation Interleaved, immersion-cooling apparatuses and methods for cooling electronic subsystems
US8351206B2 (en) 2010-06-29 2013-01-08 International Business Machines Corporation Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit
US8369091B2 (en) 2010-06-29 2013-02-05 International Business Machines Corporation Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack
US8184436B2 (en) 2010-06-29 2012-05-22 International Business Machines Corporation Liquid-cooled electronics rack with immersion-cooled electronic subsystems
CN101907197B (zh) * 2010-07-02 2012-01-25 浙江博威汽车空调有限公司 膨胀阀的阀口开度调节与设定装置及其使用方法
US8472182B2 (en) 2010-07-28 2013-06-25 International Business Machines Corporation Apparatus and method for facilitating dissipation of heat from a liquid-cooled electronics rack
US8248801B2 (en) 2010-07-28 2012-08-21 International Business Machines Corporation Thermoelectric-enhanced, liquid-cooling apparatus and method for facilitating dissipation of heat
JP2012184793A (ja) * 2011-03-04 2012-09-27 Tgk Co Ltd 膨張弁
JP6182363B2 (ja) * 2013-06-07 2017-08-16 株式会社不二工機 膨張弁
JP6596217B2 (ja) * 2015-04-03 2019-10-23 株式会社不二工機 カシメ固定型パワーエレメント及びこれを用いた膨張弁

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3219841B2 (ja) * 1992-05-15 2001-10-15 株式会社不二工機 温度膨脹弁の製造方法
US5596881A (en) * 1995-02-22 1997-01-28 Parker-Hannifin Corporation Pick-up tube attachment technique
JP3712827B2 (ja) * 1997-05-26 2005-11-02 株式会社鷺宮製作所 冷凍冷蔵装置、冷媒流量補正用バイパス弁および温度膨張弁
KR100205148B1 (ko) * 1997-06-12 1999-07-01 최성규 자동차용 에어컨 시스템의 팽창밸브
JPH11223425A (ja) * 1998-02-10 1999-08-17 Fujikoki Corp 膨張弁
JPH11325660A (ja) * 1998-03-18 1999-11-26 Fujikoki Corp 膨張弁
JPH11287536A (ja) * 1998-04-02 1999-10-19 Fujikoki Corp 膨張弁
US5996881A (en) * 1998-06-15 1999-12-07 Smith; Brenton L. Convertible folder
JP2000241048A (ja) * 1999-02-24 2000-09-08 Saginomiya Seisakusho Inc 感温膨張弁
JP2000304381A (ja) 1999-04-16 2000-11-02 Fuji Koki Corp 温度膨張弁
JP2001033123A (ja) * 1999-07-19 2001-02-09 Fuji Koki Corp 温度膨張弁
JP2002350010A (ja) * 2001-05-29 2002-12-04 Fuji Koki Corp 膨張弁
JP4156212B2 (ja) * 2001-05-29 2008-09-24 株式会社不二工機 膨張弁
JP2003130499A (ja) * 2001-10-30 2003-05-08 Tgk Co Ltd 膨張弁
JP4041334B2 (ja) * 2002-04-08 2008-01-30 株式会社不二工機 膨張弁及び冷凍サイクル
JP2004028261A (ja) * 2002-06-27 2004-01-29 Fuji Koki Corp 膨張弁
BR0315325A (pt) * 2002-10-18 2005-08-16 Parker Hannifin Corp Válvula de expansão de refrigeração com elemento de energia de massa térmica
US6868684B2 (en) * 2002-12-17 2005-03-22 Parker-Hannifin Corporation Block valve with integral refrigerant lines

Also Published As

Publication number Publication date
CN1654907A (zh) 2005-08-17
EP1564509A1 (en) 2005-08-17
US7222502B2 (en) 2007-05-29
US20050178152A1 (en) 2005-08-18
JP2005226940A (ja) 2005-08-25
KR20060041893A (ko) 2006-05-12
DE602004017416D1 (de) 2008-12-11
EP1564509B1 (en) 2008-10-29

Similar Documents

Publication Publication Date Title
CN100541059C (zh) 膨胀阀
CN1161577C (zh) 一种用于致冷剂的感温式膨胀阀及制造该感温式膨胀阀的方法
JP6085763B2 (ja) 電磁弁
US5005370A (en) Thermal expansion valve
US5547126A (en) Ring angle thermally responsive expansion valve
JP4848548B2 (ja) 電磁弁付き膨張弁
JPWO2006090826A1 (ja) 圧力制御弁
US6634567B2 (en) Expansion valve unit having pressure detecting function
JP2021101150A (ja) 膨張弁
CN1237316C (zh) 温度式膨胀阀
US6612503B2 (en) Expansion valve
US6712281B2 (en) Expansion valve
US6896190B2 (en) Expansion valve
JP6007369B2 (ja) 制御弁
KR20050011715A (ko) 팽창 밸브
JPH08152232A (ja) 膨張弁
CN106482403B (zh) 车辆空调系统的膨胀阀及包括该膨胀阀的车辆空调系统
US20030131883A1 (en) Valve combination for a fluid circuit with two pressure levels, particularly a combined cooling system/heat pump circuit
CN212109088U (zh) 贮液器、及具有该贮液器的空调系统
JP4364114B2 (ja) 圧力制御弁
JP2003185299A (ja) 複合弁
JP2006132881A (ja) 膨張弁
KR102316461B1 (ko) 전자식 팽창밸브용 포핏 밸브의 기밀 고정 구조 및 이를 포함하는 전자식 팽창밸브
JP2003090648A (ja) 膨張弁
JP2018004234A (ja) 膨張弁

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090916