CN100539041C - 半导体器件及其制造方法 - Google Patents
半导体器件及其制造方法 Download PDFInfo
- Publication number
- CN100539041C CN100539041C CNB2004800441992A CN200480044199A CN100539041C CN 100539041 C CN100539041 C CN 100539041C CN B2004800441992 A CNB2004800441992 A CN B2004800441992A CN 200480044199 A CN200480044199 A CN 200480044199A CN 100539041 C CN100539041 C CN 100539041C
- Authority
- CN
- China
- Prior art keywords
- mentioned
- dot pattern
- semiconductor device
- tube
- carbon nano
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 142
- 238000000034 method Methods 0.000 title claims description 95
- 238000004519 manufacturing process Methods 0.000 title claims description 61
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 154
- 239000002041 carbon nanotube Substances 0.000 claims abstract description 152
- 229910021393 carbon nanotube Inorganic materials 0.000 claims abstract description 152
- 229910052751 metal Inorganic materials 0.000 claims abstract description 73
- 239000002184 metal Substances 0.000 claims abstract description 73
- 239000003054 catalyst Substances 0.000 claims abstract description 66
- 150000002739 metals Chemical class 0.000 claims abstract description 64
- 239000011229 interlayer Substances 0.000 claims abstract description 53
- 238000009826 distribution Methods 0.000 claims abstract description 40
- 239000000758 substrate Substances 0.000 claims abstract description 39
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 22
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 18
- 230000005669 field effect Effects 0.000 claims description 14
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 13
- 238000005530 etching Methods 0.000 claims description 13
- 229910052759 nickel Inorganic materials 0.000 claims description 10
- 229910052742 iron Inorganic materials 0.000 claims description 8
- 239000010936 titanium Substances 0.000 claims description 8
- 239000010941 cobalt Substances 0.000 claims description 6
- 229910017052 cobalt Inorganic materials 0.000 claims description 6
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 6
- 230000003647 oxidation Effects 0.000 claims description 6
- 238000007254 oxidation reaction Methods 0.000 claims description 6
- 230000005764 inhibitory process Effects 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 21
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 12
- 238000005229 chemical vapour deposition Methods 0.000 description 11
- 229910052760 oxygen Inorganic materials 0.000 description 11
- 239000001301 oxygen Substances 0.000 description 11
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 10
- 230000004888 barrier function Effects 0.000 description 7
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 239000002994 raw material Substances 0.000 description 5
- 238000000137 annealing Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- 150000004767 nitrides Chemical class 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical class F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- NJFMNPFATSYWHB-UHFFFAOYSA-N ac1l9hgr Chemical compound [Fe].[Fe] NJFMNPFATSYWHB-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 235000014347 soups Nutrition 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000009036 growth inhibition Effects 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 239000011943 nanocatalyst Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 150000002926 oxygen Chemical class 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000013139 quantization Methods 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76885—By forming conductive members before deposition of protective insulating material, e.g. pillars, studs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
- H01L21/76879—Filling of holes, grooves or trenches, e.g. vias, with conductive material by selective deposition of conductive material in the vias, e.g. selective C.V.D. on semiconductor material, plating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5226—Via connections in a multilevel interconnection structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/53204—Conductive materials
- H01L23/53276—Conductive materials containing carbon, e.g. fullerenes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0665—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0665—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
- H01L29/0669—Nanowires or nanotubes
- H01L29/0673—Nanowires or nanotubes oriented parallel to a substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0665—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
- H01L29/0669—Nanowires or nanotubes
- H01L29/0676—Nanowires or nanotubes oriented perpendicular or at an angle to a substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/10—Applying interconnections to be used for carrying current between separate components within a device
- H01L2221/1068—Formation and after-treatment of conductors
- H01L2221/1094—Conducting structures comprising nanotubes or nanowires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/20—Carbon compounds, e.g. carbon nanotubes or fullerenes
- H10K85/221—Carbon nanotubes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/60—Organic compounds having low molecular weight
- H10K85/615—Polycyclic condensed aromatic hydrocarbons, e.g. anthracene
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/70—Nanostructure
- Y10S977/734—Fullerenes, i.e. graphene-based structures, such as nanohorns, nanococoons, nanoscrolls or fullerene-like structures, e.g. WS2 or MoS2 chalcogenide nanotubes, planar C3N4, etc.
- Y10S977/742—Carbon nanotubes, CNTs
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/84—Manufacture, treatment, or detection of nanostructure
- Y10S977/842—Manufacture, treatment, or detection of nanostructure for carbon nanotubes or fullerenes
- Y10S977/843—Gas phase catalytic growth, i.e. chemical vapor deposition
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/84—Manufacture, treatment, or detection of nanostructure
- Y10S977/842—Manufacture, treatment, or detection of nanostructure for carbon nanotubes or fullerenes
- Y10S977/844—Growth by vaporization or dissociation of carbon source using a high-energy heat source, e.g. electric arc, laser, plasma, e-beam
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/902—Specified use of nanostructure
- Y10S977/932—Specified use of nanostructure for electronic or optoelectronic application
- Y10S977/936—Specified use of nanostructure for electronic or optoelectronic application in a transistor or 3-terminal device
- Y10S977/938—Field effect transistors, FETS, with nanowire- or nanotube-channel region
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electrodes Of Semiconductors (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Thin Film Transistor (AREA)
Abstract
Description
Claims (36)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2004/015732 WO2006043329A1 (ja) | 2004-10-22 | 2004-10-22 | 半導体装置及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101044605A CN101044605A (zh) | 2007-09-26 |
CN100539041C true CN100539041C (zh) | 2009-09-09 |
Family
ID=36202754
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004800441992A Expired - Fee Related CN100539041C (zh) | 2004-10-22 | 2004-10-22 | 半导体器件及其制造方法 |
Country Status (4)
Country | Link |
---|---|
US (2) | US7700978B2 (zh) |
JP (1) | JP5045103B2 (zh) |
CN (1) | CN100539041C (zh) |
WO (1) | WO2006043329A1 (zh) |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7989349B2 (en) * | 2005-04-15 | 2011-08-02 | Micron Technology, Inc. | Methods of manufacturing nanotubes having controlled characteristics |
US7884359B2 (en) * | 2006-06-09 | 2011-02-08 | The United States Of America As Represented By The Secretary Of The Navy | Integrally gated carbon nanotube ionizer device |
JP4899703B2 (ja) * | 2006-08-07 | 2012-03-21 | 富士通株式会社 | カーボン配線構造およびその製造方法、および半導体装置 |
JP5055929B2 (ja) * | 2006-09-29 | 2012-10-24 | 富士通株式会社 | 電子デバイスの製造方法 |
FR2910706B1 (fr) * | 2006-12-21 | 2009-03-20 | Commissariat Energie Atomique | Element d'interconnexion a base de nanotubes de carbone |
US8101529B2 (en) | 2007-02-15 | 2012-01-24 | Nec Corporation | Carbon nanotube resistor, semiconductor device, and manufacturing method thereof |
JP5194513B2 (ja) * | 2007-03-29 | 2013-05-08 | 富士通セミコンダクター株式会社 | 配線構造及びその形成方法 |
JP5233147B2 (ja) * | 2007-03-30 | 2013-07-10 | 富士通セミコンダクター株式会社 | 電子デバイス及びその製造方法 |
JP5181512B2 (ja) * | 2007-03-30 | 2013-04-10 | 富士通セミコンダクター株式会社 | 電子デバイスの製造方法 |
JP5168984B2 (ja) * | 2007-03-30 | 2013-03-27 | 富士通株式会社 | カーボンナノチューブ金属複合材料によるデバイス構造 |
WO2009023304A2 (en) * | 2007-05-02 | 2009-02-19 | Atomate Corporation | High density nanotube devices |
FR2917893B1 (fr) * | 2007-06-22 | 2009-08-28 | Commissariat Energie Atomique | Procede de fabrication d'une connexion electrique a base de nanotubes de carbone |
FR2920252A1 (fr) * | 2007-08-24 | 2009-02-27 | Commissariat Energie Atomique | Procede de realisation d'un transistor comportant une connexion electrique a base de nanotubes ou de nanofils. |
US8065634B1 (en) | 2007-09-28 | 2011-11-22 | The Board Of Trustees Of The Leland Stanford Junior University | System and method for analyzing a nanotube logic circuit |
FR2925761B1 (fr) * | 2007-12-20 | 2010-08-20 | Commissariat Energie Atomique | Procede de realisation d'une connexion electrique, a base de nanotubes, entre deux surfaces en regard et circuit integre la comportant |
FR2925764B1 (fr) * | 2007-12-20 | 2010-05-28 | Commissariat Energie Atomique | Procede de croissance horizontale de nanotubes/nanofibres. |
FR2928093B1 (fr) * | 2008-02-28 | 2010-12-31 | Commissariat Energie Atomique | Dispositif de separation de molecules et procede de fabrication. |
JP2009252798A (ja) * | 2008-04-01 | 2009-10-29 | Mitsumi Electric Co Ltd | カーボンナノチューブ電界効果トランジスタおよびその製造方法 |
US7867863B2 (en) * | 2008-06-12 | 2011-01-11 | Intel Corporation | Method for forming self-aligned source and drain contacts using a selectively passivated metal gate |
FR2933237B1 (fr) * | 2008-06-25 | 2010-10-29 | Commissariat Energie Atomique | Architecture d'interconnexions horizontales a base de nanotubes de carbone. |
KR101398634B1 (ko) * | 2008-07-11 | 2014-05-22 | 삼성전자주식회사 | 배선 구조체 및 이를 채택하는 전자 소자 |
FR2935538B1 (fr) * | 2008-09-01 | 2010-12-24 | Commissariat Energie Atomique | Substrat pour composant electronique ou electromecanique et nanoelements. |
KR20100119958A (ko) * | 2009-05-04 | 2010-11-12 | 엘지전자 주식회사 | 공기 조화기 |
JP2011044488A (ja) * | 2009-08-19 | 2011-03-03 | Elpida Memory Inc | 半導体装置およびその製造方法 |
CN102044524B (zh) * | 2009-10-13 | 2016-03-16 | 中芯国际集成电路制造(上海)有限公司 | 互连结构及其形成方法 |
US8796668B2 (en) | 2009-11-09 | 2014-08-05 | International Business Machines Corporation | Metal-free integrated circuits comprising graphene and carbon nanotubes |
CN102143652B (zh) * | 2010-01-30 | 2012-07-18 | 宏恒胜电子科技(淮安)有限公司 | 电路板 |
JP2011187901A (ja) | 2010-03-11 | 2011-09-22 | Canon Inc | 半導体デバイスの製造方法 |
CN101852763B (zh) * | 2010-05-07 | 2013-06-26 | 中国科学院苏州纳米技术与纳米仿生研究所 | 一种基于场效应晶体管的手性传感器及其制备方法 |
US8455297B1 (en) * | 2010-07-07 | 2013-06-04 | International Business Machines Corporation | Method to fabricate high performance carbon nanotube transistor integrated circuits by three-dimensional integration technology |
CN101923065B (zh) * | 2010-07-13 | 2013-05-01 | 中国科学院苏州纳米技术与纳米仿生研究所 | 场效应晶体管手性传感器及其制备方法 |
US8288759B2 (en) * | 2010-08-04 | 2012-10-16 | Zhihong Chen | Vertical stacking of carbon nanotube arrays for current enhancement and control |
US9406888B2 (en) | 2013-08-07 | 2016-08-02 | GlobalFoundries, Inc. | Carbon nanotube device |
JP2015050305A (ja) * | 2013-08-30 | 2015-03-16 | 株式会社東芝 | 半導体装置及びその製造方法 |
JP6077076B1 (ja) | 2015-09-11 | 2017-02-08 | 株式会社東芝 | グラフェン配線構造及びグラフェン配線構造の作製方法 |
CN108172625B (zh) * | 2016-12-07 | 2020-09-29 | 清华大学 | 一种逻辑电路 |
CN109494151B (zh) * | 2017-09-12 | 2021-03-30 | 联华电子股份有限公司 | 垂直金属氧化物半导体晶体管及其制作方法 |
CN112838050A (zh) * | 2021-02-05 | 2021-05-25 | 泉芯集成电路制造(济南)有限公司 | 一种半导体器件及其制备方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3740295B2 (ja) * | 1997-10-30 | 2006-02-01 | キヤノン株式会社 | カーボンナノチューブデバイス、その製造方法及び電子放出素子 |
US7335603B2 (en) * | 2000-02-07 | 2008-02-26 | Vladimir Mancevski | System and method for fabricating logic devices comprising carbon nanotube transistors |
JP2001339283A (ja) * | 2000-05-26 | 2001-12-07 | Mitsubishi Electric Corp | 遅延回路およびそのための半導体回路装置 |
JP3655175B2 (ja) * | 2000-06-30 | 2005-06-02 | 株式会社東芝 | 半導体記憶装置の製造方法 |
US6515339B2 (en) * | 2000-07-18 | 2003-02-04 | Lg Electronics Inc. | Method of horizontally growing carbon nanotubes and field effect transistor using the carbon nanotubes grown by the method |
JP4212258B2 (ja) * | 2001-05-02 | 2009-01-21 | 富士通株式会社 | 集積回路装置及び集積回路装置製造方法 |
US7084507B2 (en) * | 2001-05-02 | 2006-08-01 | Fujitsu Limited | Integrated circuit device and method of producing the same |
JP4608133B2 (ja) * | 2001-06-08 | 2011-01-05 | ルネサスエレクトロニクス株式会社 | 縦型mosfetを備えた半導体装置およびその製造方法 |
US20030109802A1 (en) * | 2001-12-12 | 2003-06-12 | Laeseke Paul F. | Cauterizing biopsy system |
JP4120918B2 (ja) * | 2002-03-18 | 2008-07-16 | 富士通株式会社 | 柱状カーボン構造物の選択成長方法及び電子デバイス |
JP2003309266A (ja) * | 2002-04-17 | 2003-10-31 | Konica Minolta Holdings Inc | 有機薄膜トランジスタ素子の製造方法 |
JP4416376B2 (ja) * | 2002-05-13 | 2010-02-17 | 富士通株式会社 | 半導体装置及びその製造方法 |
JP4974263B2 (ja) * | 2002-05-20 | 2012-07-11 | 富士通株式会社 | 半導体装置の製造方法 |
JP4774665B2 (ja) * | 2003-02-05 | 2011-09-14 | ソニー株式会社 | 半導体装置の製造方法 |
US20040182600A1 (en) * | 2003-03-20 | 2004-09-23 | Fujitsu Limited | Method for growing carbon nanotubes, and electronic device having structure of ohmic connection to carbon element cylindrical structure body and production method thereof |
JP4401094B2 (ja) * | 2003-03-20 | 2010-01-20 | 富士通株式会社 | 炭素元素円筒型構造体へのオーミック接続構造及びその作製方法 |
-
2004
- 2004-10-22 JP JP2006542146A patent/JP5045103B2/ja not_active Expired - Fee Related
- 2004-10-22 WO PCT/JP2004/015732 patent/WO2006043329A1/ja active Application Filing
- 2004-10-22 CN CNB2004800441992A patent/CN100539041C/zh not_active Expired - Fee Related
-
2007
- 2007-04-19 US US11/785,623 patent/US7700978B2/en not_active Expired - Fee Related
-
2010
- 2010-02-19 US US12/708,770 patent/US8034676B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20100144104A1 (en) | 2010-06-10 |
US20070205450A1 (en) | 2007-09-06 |
JP5045103B2 (ja) | 2012-10-10 |
CN101044605A (zh) | 2007-09-26 |
WO2006043329A1 (ja) | 2006-04-27 |
JPWO2006043329A1 (ja) | 2008-05-22 |
US7700978B2 (en) | 2010-04-20 |
US8034676B2 (en) | 2011-10-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN100539041C (zh) | 半导体器件及其制造方法 | |
JP4864307B2 (ja) | エアーギャップを選択的に形成する方法及び当該方法により得られる装置 | |
CN100429772C (zh) | 半导体装置及其制造方法 | |
CN100568573C (zh) | 垂直半导体器件结构及其形成方法 | |
US6815294B2 (en) | Vertical nano-size transistor using carbon nanotubes and manufacturing method thereof | |
US8581364B2 (en) | Resistance memory devices and methods of forming the same | |
CN100580971C (zh) | 垂直纳米管半导体器件结构及其形成方法 | |
CN1943055B (zh) | 半导体器件结构及制造包括该结构的阵列的电路的方法 | |
US7592248B2 (en) | Method of forming semiconductor device having nanotube structures | |
Li et al. | Integration and electrical characterization of carbon nanotube via interconnects | |
US20080142866A1 (en) | Integrated Circuit Memory Devices and Capacitors Having Carbon Nanotube Electrodes | |
US20200127047A1 (en) | Techniques for mram top electrode via connection | |
CN105206561A (zh) | 互连结构的形成方法和半导体结构 | |
US7989286B2 (en) | Electronic devices using carbon nanotubes having vertical structure and the manufacturing method thereof | |
US7897424B2 (en) | Method of manufacturing an electrical-mechanical memory device | |
US20050145838A1 (en) | Vertical Carbon Nanotube Field Effect Transistor | |
JP2008166756A (ja) | カーボンナノチューブに基づく層間配線要素 | |
KR101585210B1 (ko) | 콘택 구조체 형성방법 | |
KR20060114056A (ko) | 평판형 금속-절연체-금속 캐패시터의 제조방법 | |
US20070123019A1 (en) | Methods of forming carbon nanotubes in a wiring pattern and related devices | |
CN1331214C (zh) | 半导体器件的制造方法 | |
US8575669B2 (en) | Fabricating technique of a highly integrated semiconductor device in which a capacitor is formed between adjacent gate patterns by using a nanotube process | |
KR100882289B1 (ko) | 반도체 장치 및 그 제조 방법 | |
JP5181105B2 (ja) | 集積回路の修正配線形成方法 | |
US11482447B2 (en) | Method of forming an integrated chip having a cavity between metal features |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: FUJITSU MICROELECTRONICS CO., LTD. Free format text: FORMER OWNER: FUJITSU LIMITED Effective date: 20081107 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20081107 Address after: Tokyo, Japan Applicant after: FUJITSU MICROELECTRONICS Ltd. Address before: Kanagawa Applicant before: Fujitsu Ltd. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: FUJITSU SEMICONDUCTOR CO., LTD. Free format text: FORMER NAME: FUJITSU MICROELECTRON CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Japan's Kanagawa Prefecture Yokohama Patentee after: FUJITSU MICROELECTRONICS Ltd. Address before: Japan's Kanagawa Prefecture Yokohama Patentee before: Fujitsu Microelectronics Ltd. |
|
CP02 | Change in the address of a patent holder |
Address after: Japan's Kanagawa Prefecture Yokohama Patentee after: FUJITSU MICROELECTRONICS Ltd. Address before: Tokyo, Japan Patentee before: Fujitsu Microelectronics Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090909 Termination date: 20201022 |
|
CF01 | Termination of patent right due to non-payment of annual fee |