CN100507530C - 焊盘图案检查方法以及检查装置 - Google Patents
焊盘图案检查方法以及检查装置 Download PDFInfo
- Publication number
- CN100507530C CN100507530C CNB200610005927XA CN200610005927A CN100507530C CN 100507530 C CN100507530 C CN 100507530C CN B200610005927X A CNB200610005927X A CN B200610005927XA CN 200610005927 A CN200610005927 A CN 200610005927A CN 100507530 C CN100507530 C CN 100507530C
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- 238000000034 method Methods 0.000 title claims abstract description 116
- 238000007689 inspection Methods 0.000 title claims abstract description 95
- 230000008602 contraction Effects 0.000 claims abstract description 50
- 239000002131 composite material Substances 0.000 claims description 24
- 238000003384 imaging method Methods 0.000 claims description 13
- 230000002194 synthesizing effect Effects 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 claims 3
- 230000007547 defect Effects 0.000 abstract description 36
- 238000010586 diagram Methods 0.000 description 28
- 230000003287 optical effect Effects 0.000 description 17
- 230000015572 biosynthetic process Effects 0.000 description 8
- 238000003786 synthesis reaction Methods 0.000 description 8
- 238000011179 visual inspection Methods 0.000 description 8
- 238000001514 detection method Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 230000002950 deficient Effects 0.000 description 4
- 230000010339 dilation Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000284 extract Substances 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
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- E—FIXED CONSTRUCTIONS
- E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
- E01F—ADDITIONAL WORK, SUCH AS EQUIPPING ROADS OR THE CONSTRUCTION OF PLATFORMS, HELICOPTER LANDING STAGES, SIGNS, SNOW FENCES, OR THE LIKE
- E01F8/00—Arrangements for absorbing or reflecting air-transmitted noise from road or railway traffic
- E01F8/0005—Arrangements for absorbing or reflecting air-transmitted noise from road or railway traffic used in a wall type arrangement
- E01F8/0023—Details, e.g. foundations
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- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Image Processing (AREA)
- Image Analysis (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005091990 | 2005-03-28 | ||
| JP2005091990A JP4518494B2 (ja) | 2005-03-28 | 2005-03-28 | ランドパターン検査方法及び検査装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1841049A CN1841049A (zh) | 2006-10-04 |
| CN100507530C true CN100507530C (zh) | 2009-07-01 |
Family
ID=37030156
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB200610005927XA Expired - Fee Related CN100507530C (zh) | 2005-03-28 | 2006-01-19 | 焊盘图案检查方法以及检查装置 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4518494B2 (enExample) |
| KR (1) | KR100660400B1 (enExample) |
| CN (1) | CN100507530C (enExample) |
| TW (1) | TWI271505B (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5234639B2 (ja) * | 2009-01-31 | 2013-07-10 | 株式会社メガトレード | スルーホールの検査装置 |
| CN101995223B (zh) * | 2009-08-25 | 2013-05-08 | 比亚迪股份有限公司 | 一种芯片外观检测方法及系统 |
| CN102595024B (zh) * | 2011-12-16 | 2014-10-22 | 飞狐信息技术(天津)有限公司 | 一种数字视频图像修复方法与装置 |
| CN104020222B (zh) * | 2014-06-18 | 2016-06-22 | 长春光华微电子设备工程中心有限公司 | 全自动超声波铝丝压焊机焊接质量检测系统 |
| CN104535587A (zh) * | 2014-12-23 | 2015-04-22 | 安徽科鸣三维科技有限公司 | 一种基于机器视觉的pcba焊点检测方法 |
| JP6496159B2 (ja) * | 2015-02-23 | 2019-04-03 | 株式会社Screenホールディングス | パターン検査装置およびパターン検査方法 |
| TWI521476B (zh) * | 2015-04-17 | 2016-02-11 | 銘傳大學 | 週期性圖案之自動光學檢測方法 |
| CN106651989B (zh) * | 2016-12-21 | 2020-04-21 | 北京信息科技大学 | 用于微小孔对中的嵌套圆拟合方法及装置 |
| CN109950165B (zh) * | 2019-02-19 | 2021-06-04 | 长江存储科技有限责任公司 | 测试结构和测试方法 |
| CN118070749B (zh) * | 2024-04-17 | 2024-07-23 | 淄博芯材集成电路有限责任公司 | 一种基板收缩方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3589424B1 (ja) * | 2003-12-22 | 2004-11-17 | 株式会社メガトレード | 基板検査装置 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01269035A (ja) * | 1988-04-21 | 1989-10-26 | Ibiden Co Ltd | プリント回路基板の検査装置 |
| JP2001267722A (ja) * | 2000-03-23 | 2001-09-28 | Ngk Spark Plug Co Ltd | プリント配線板の検査方法 |
-
2005
- 2005-03-28 JP JP2005091990A patent/JP4518494B2/ja not_active Expired - Fee Related
- 2005-12-21 TW TW094145474A patent/TWI271505B/zh not_active IP Right Cessation
-
2006
- 2006-01-19 CN CNB200610005927XA patent/CN100507530C/zh not_active Expired - Fee Related
- 2006-01-23 KR KR1020060006935A patent/KR100660400B1/ko not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3589424B1 (ja) * | 2003-12-22 | 2004-11-17 | 株式会社メガトレード | 基板検査装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100660400B1 (ko) | 2006-12-22 |
| CN1841049A (zh) | 2006-10-04 |
| JP4518494B2 (ja) | 2010-08-04 |
| JP2006275612A (ja) | 2006-10-12 |
| KR20060103823A (ko) | 2006-10-04 |
| TWI271505B (en) | 2007-01-21 |
| TW200636207A (en) | 2006-10-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: DAINIPPON SCREEN MFG. CO., LTD. Free format text: FORMER NAME: DAINIPPON MESH PLATE MFR. CO., LTD. Owner name: SCREEN GROUP CO., LTD. Free format text: FORMER NAME: DAINIPPON SCREEN MFG. CO., LTD. |
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| CP01 | Change in the name or title of a patent holder |
Address after: Kyoto Japan Patentee after: Skilling Group Address before: Kyoto Japan Patentee before: DAINIPPON SCREEN MFG Co.,Ltd. Address after: Kyoto Japan Patentee after: DAINIPPON SCREEN MFG Co.,Ltd. Address before: Kyoto Japan Patentee before: Dainippon Screen Mfg. Co.,Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090701 Termination date: 20170119 |