TW200636207A - Method for examining land pattern and apparatus for examining the same - Google Patents

Method for examining land pattern and apparatus for examining the same

Info

Publication number
TW200636207A
TW200636207A TW094145474A TW94145474A TW200636207A TW 200636207 A TW200636207 A TW 200636207A TW 094145474 A TW094145474 A TW 094145474A TW 94145474 A TW94145474 A TW 94145474A TW 200636207 A TW200636207 A TW 200636207A
Authority
TW
Taiwan
Prior art keywords
land
coordinate
image
examining
circle
Prior art date
Application number
TW094145474A
Other languages
Chinese (zh)
Other versions
TWI271505B (en
Inventor
Yuji Akagi
Jun Onishi
Katsuji Kenno
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW200636207A publication Critical patent/TW200636207A/en
Application granted granted Critical
Publication of TWI271505B publication Critical patent/TWI271505B/en

Links

Classifications

    • E—FIXED CONSTRUCTIONS
    • E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
    • E01F—ADDITIONAL WORK, SUCH AS EQUIPPING ROADS OR THE CONSTRUCTION OF PLATFORMS, HELICOPTER LANDING STAGES, SIGNS, SNOW FENCES, OR THE LIKE
    • E01F8/00—Arrangements for absorbing or reflecting air-transmitted noise from road or railway traffic
    • E01F8/0005—Arrangements for absorbing or reflecting air-transmitted noise from road or railway traffic used in a wall type arrangement
    • E01F8/0023—Details, e.g. foundations

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

A controller (21) reads the land coordinate on printing substrate from a land coordinate file (30) as an examination object and the master image of said land. Then, take a picture of the land of the read land coordinate so as to generate a two-valued land image. Next, extract the coordinate of the land part on said land image and store in 1-pixel part coordinate file (31). Thereafter, read a predetermined circle image from a stopgap circle pattern table (29), and perform shrinking process against said circle image by only a predetermined time. At this time, if the coordinate of the pixel as a noticed point is in correspondence to the coordinate of said land part, the shrinking process with respect to said noticed point will not be conducted. Subsequently, the existence of fine defect of the land can be examined by comparing the circle image after shrinkage and the master image.
TW094145474A 2005-03-28 2005-12-21 Method for examining land pattern and apparatus for examining the same TWI271505B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005091990A JP4518494B2 (en) 2005-03-28 2005-03-28 Land pattern inspection method and inspection apparatus

Publications (2)

Publication Number Publication Date
TW200636207A true TW200636207A (en) 2006-10-16
TWI271505B TWI271505B (en) 2007-01-21

Family

ID=37030156

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094145474A TWI271505B (en) 2005-03-28 2005-12-21 Method for examining land pattern and apparatus for examining the same

Country Status (4)

Country Link
JP (1) JP4518494B2 (en)
KR (1) KR100660400B1 (en)
CN (1) CN100507530C (en)
TW (1) TWI271505B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5234639B2 (en) * 2009-01-31 2013-07-10 株式会社メガトレード Through-hole inspection equipment
CN101995223B (en) * 2009-08-25 2013-05-08 比亚迪股份有限公司 Chip appearance detection method and system
CN102595024B (en) * 2011-12-16 2014-10-22 飞狐信息技术（天津）有限公司 Method and device for restoring digital video images
CN104020222B (en) * 2014-06-18 2016-06-22 长春光华微电子设备工程中心有限公司 Fully-automatic supersonic aluminum wire press welder weld quality prediction system
CN104535587A (en) * 2014-12-23 2015-04-22 安徽科鸣三维科技有限公司 PCBA solder joint inspection method based on machine vision
JP6496159B2 (en) * 2015-02-23 2019-04-03 株式会社Ｓｃｒｅｅｎホールディングス Pattern inspection apparatus and pattern inspection method
TWI521476B (en) * 2015-04-17 2016-02-11 銘傳大學 Automatic optical inspection method of periodic patterns
CN106651989B (en) * 2016-12-21 2020-04-21 北京信息科技大学 Nested circle fitting method and device for micro-hole centering
CN109950165B (en) * 2019-02-19 2021-06-04 长江存储科技有限责任公司 Test structure and test method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01269035A (en) * 1988-04-21 1989-10-26 Ibiden Co Ltd Instrument for inspecting printed circuit board
JP2001267722A (en) * 2000-03-23 2001-09-28 Ngk Spark Plug Co Ltd Method for inspecting printed wiring board
JP3589424B1 (en) * 2003-12-22 2004-11-17 株式会社メガトレード Board inspection equipment

Also Published As

Publication number Publication date
CN1841049A (en) 2006-10-04
JP4518494B2 (en) 2010-08-04
CN100507530C (en) 2009-07-01
JP2006275612A (en) 2006-10-12
KR100660400B1 (en) 2006-12-22
TWI271505B (en) 2007-01-21
KR20060103823A (en) 2006-10-04

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees