CN100505979C - 布线电路基板保持板及其制造方法 - Google Patents
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Abstract
本发明提供一种能利用简易的结构、容易地判断切断沟是否形成合适的深度的布线电路基板保持板、及能简易地制造该布线电路基板保持板的布线电路基板保持板的制造方法,在由保持着能分离的多片布线电路基板3的板2组成的布线电路基板保持板1上,分别通过可切断的连接部4使各布线电路基板3保持在板2上,利用具有一体化的主冲头13和副冲头14的冲头15,同时在各连接部4的正反两面形成为了容易切断用的切断沟6、和表示切断沟6的深度为连接部4能切断的合适深度用的标记沟7。
Description
技术领域
本发明有关布线电路基板保持板及其制造方法,具体为有关由保持可分离的多片布线电路基板的板组成的布线电路基板保持板及其制造方法。
背景技术
在布线电路基板的制造过程中,通常是在1块板上形成多片布线电路基板,再装上电子元器件后,把一片片布线电路基板分开。
在这种由保持着可分离的多片布线电路基板的板组成的布线电路基板保持板上,各布线电路基板通过连接部保持在板上,在该连接部上为了能通过弯曲而容易地折断,通常靠冲压加工从连接部的正反两面切入V形沟槽。
但,如用冲压加工形成V形沟,则在V形沟的深度上会产生误差。于是,在V形沟不够深的情况下,有时例如尽管作了弯曲但还是不能折断。另外,如想强行弯曲折断,则有时会损伤布线电路基板、或电子元器件等。
又如在特开2000—323812号公报中曾提出一种方案,它是为了在多片基板上安装电路及电子电路元器件,能通过电气方法检测出沿断开形状部即V形沟分割成多片的基板上有无断开形状部的状态,能事先防止误安装。
但,特开2000—323812号公报所述的方法存在的问题是,由于通过电气方法检测有无断开形状部即V形沟的状态,所以需要导通检查装置,为了这项检查要增加成本又费时间。
另外,特开2000—323812号公报所述的方法存在的问题是,即使检测出有无V形沟,但因无法判断V形沟的深度合适与否,故上述的问题即在V形沟的深度不够的情况下,尽管弯曲仍不能折断,另外,如想强行弯曲折断,则会损伤布线电路基板或电子元器件等,这些问题依旧无法解决。
发明内容
本发明的目的在于提供一种利用简易的结构能容易地判断切断沟是否按合适的深度形成的布线电路基板保持板、及一种能简易地制造这种布线电路基板保持板的布线电路基板保持板的制造方法。
本申请的布线电路基板保持板是一种布线电路基板保持板,由保持着可分离的多片布线电路基板的板组成,
各所述布线电路基板分别通过可切断的连接部保持在所述板上,
在所述连接部形成为了容易切断用的切断沟、和表示所述切断沟的深度为规定深度用的标记沟,所述切断沟和所述标记沟互相隔开规定间隔,形成平行的形状,所述切断沟被形成为能切断所述连接部的深度,所述标记沟被形成为比所述切断沟的深度浅。
另外,本申请的布线电路基板保持板中,
所述布线电路基板具有增强层,
所述增强层和所述连接部及所述板做成一体。
另外,本申请是一种布线电路基板保持板的制造方法,包括:
准备布线电路基板保持板的工序,所述布线电路基板保持板由保持着可分离的多片布线电路基板的板组成,各所述布线电路基板分别通过能切断的连接部保持在所述板上;及
利用一体化地具有形成切断沟用的主冲头和形成标记沟用的副冲头的冲头、从而在所述连接部同时形成为了容易切断用的切断沟和表示所述切断沟的深度为规定深度用的标记沟,使得所述切断沟和所述标记沟互相隔开规定间隔,形成平行的形状,所述切断沟被形成为能切断所述连接部的深度,所述标记沟被形成为比所述切断沟的深度浅的工序。
另外,本申请的布线电路基板保持板的制造方法中,
在所述冲头上,所述主冲头的前端和所述副冲头的前端并排配置,在加工方向上,为了使得所述主冲头的前端到达离所述连接部的表面能形成所述切断沟的可切断的适当深度时,所述副冲头的前端在所述连接部的表面形成目视能识别的深度适当的所述标记沟,设定所述主冲头和所述副冲头的间隔,使所述副冲头的前端比所述主冲头的前端浅。
根据本发明的布线电路基板保持板,只要确认有无标记沟,就能判断切断沟的深度是否为规定深度。即能容易地判断,在有标记沟的情况下,切断沟达到规定深度;在无标记沟的情况下,切断沟不到规定深度。因而能恰到好处地切断连接部,防止因切断不良伤及布线电路基板或电子元器件等。
另外,本发明的布线电路基板保持板中,布线电路基板的增强层如和连接部及板形成一体,则能在力求增强布线电路基板之同时,还能更进一步简化结构。
另外,根据本发明的布线电路基板保持板的制造方法,利用具有形成切断沟用的主冲头和形成标记沟用的副冲头的冲头,能同时在连接部形成为了容易切断用的切断沟和表示切断沟的深度为规定深度用的标记沟。因此,用这种布线电路基板保持板的制造方法能通过一次加工,便简易、迅速而可靠地形成切断沟及标记沟,能实现高效地制造布线电路基板保持板。
另外,在本发明的布线电路基板保持板的制造方法中,冲头的主冲头的前端和副冲头的前端并排配置,在加工方向上,设定两者的间隔,若使得主冲头的前端到达离连接部表面形成切断沟的规定深度时,副冲头的前端在连接部的表面形成标记沟,则在冲压加工中,主冲头前端的切入到达离连接部的表面规定深度时,由副冲头的前端在连接部的表面形成标记沟,而另一方面,在主冲头前端的切入没有达到离连接部的表面规定深度时,不能利用副冲头前端在连接部表面形成标记沟。因此,只有在切断沟的切入到达规定深度时,才能确实地形成标记沟。
附图说明
图1为表示本发明布线电路基板保持板一实施形态的俯视图。
图2为图1示出的布线电路基板保持板主要部分放大图,(a)为俯视图、(b)为剖面图。
图3为说明图1示出的布线电路基板保持板的制造方法用的制造工序图。
(a)为准备板的工序、
(b)为在板上形成基底绝缘层的工序、
(c)为在各基底绝缘层上形成导体图形的工序、
(d)为在包括半导体图形的基底绝缘层上形成保护绝缘层的工序、
(e)为冲压板的工序,使其形成包围各布线电路基板的间隙及连接部的工序、
(f)为利用冲压加工在连接部形成切断沟及标记沟的工序。
图4为详细说明图3(f)示出的利用冲压加工在连接部形成切断沟及标记沟的工序用的工序图。
具体实施方式
图1为本发明的布线电路基板保持板一实施形态的俯视图,图2为其主要部分的放大图。
图1中,该布线电路基板保持板1包括平板状的板2、和保持在该板2内的能分离的多片布线电路基板3。
各布线电路基板3在板2内,互相隔开规定间隔以排列整齐的状态配置,分别通过可切断的连接部4保持在板2内。
具体为,各布线电路基板3配置在板2内,在各布线电路基板3的周边和包围各布线电路基板3的板2的周边之间形成包围各布线电路基板3的间隙5。该间隙5的宽度W1【参照图2(a)】通常设定在0.5~2mm。
接着,形成多个(3处)连接部4,使其横穿该间隙5。各连接部4形成为从板2的周边起相对于间隙5沿垂直方向通过直至布线电路基板3的周边。还有,连接部4的宽度W2【参照图2(a)】通常设定在0.5~2mm。另外,连接部4的形成位置及数量可根据布线电路基板3的大小及形态等适当选定。
另外,如图2(b)所示,在连接部4的正反两面形成为了容易切断用的切断沟6和表示该切断沟6的深度为能切断连接部4的适当深度用的标记沟7。
切断沟6及标记沟7沿着与从板2的周边开始延伸到布线电路基板3的周边的连接部4的长度方向垂直的宽度方向,遍及连接部4的整个宽度而形成。所述切断沟6及标记沟7互相隔开规定间隔I【参照图2(a),通常为0.5~2mm,最好为0.7~1.5mm】,形成平行的形状。
为了在弯曲切断时容易产生应力集中的连接部4的长度方向端部,即布线电路基板3的周边或板2的周边、最好在布线电路基板3一侧不残留连接部4的切断片(毛刺),沿布线电路基板3的周边从连接部4的正反两面相向对置形成切断沟6。该切断沟6将如以后所述,利用冲头15(参照图4)的主冲头13形成能切断的深度合适的V形沟。该切断沟6的深度D1【参照图2(b)】通常为连接部4的厚度的20%以上,最好为25~30%,更具体为0.1mm以上,最好设在0.1~0.3mm。另外,切断沟6的V形沟最深处的角度θ1通常设在40~60°。
标记沟7形成在连接部4的长度方向中,更具体为在连接部4的长度方向中央,从连接部4的正反两面相向对置形成。该标记沟7如以后所述,利用冲头15(参照图4)的副冲头14形成能目视识别的深度合适的V形沟。该标记沟7的深度D2【参照图2(b)】比切断沟6浅,通常设定为不足切断沟深度的30%,最好为10~20%,更具体为0.05mm以下,最好为0.01~0.05mm(最好切断沟6的深度和标记沟7的深度之差在切入方向上设定在0.08~0.1mm)。另外,标记沟7的V形沟最深处的角度θ2通常设在40~60°。
以下,参照图3说明该布线电路基板保持板1的制造方法。
该方法首先如图3(a)所示,准备一块板2。板2例如用铝、不锈钢、42合金等金属薄板构成,其厚度通常在0.1~1mm,最好为0.2~0.6mm。
然后,该方法如图3(b)~图3(d)所示,在板2上互相隔开规定间隔并以排列整齐的状态形成布线电路基板3。
各布线电路基板3的形成无特别的限制,例如如图3(b)所示,先在板2上按照规定形状(图1中为近似L形)互相隔开规定间隔以排列整齐的状态形成基底绝缘层8。基底绝缘层8的形成无特别的限制,例如通过将感光性树脂溶液(例如感光性聚酰胺酸树脂的溶液等)涂在板2的表面使其曝光、显影,从而形成互相隔着规定间隔的排列整齐的规定图形的薄膜。其后在干燥后再使该薄膜硬化。通过这样,例如形成由聚酰亚胺树脂等合成树脂膜组成的基底绝缘层8。另外,基底绝缘层8的厚度通常为12~25μm。还有,基底绝缘层8也能通过使粘接剂介于中间按照规定图形将树脂膜粘贴在板2上而形成。
然后,如图3(c)所示,在各基底绝缘层8上形成导体图形9。导体图形9例如由铜、镍、金、焊锡或它们的合金等组成,最好用铜。另外,导体图形9的形成无特别限制,例如在各基底绝缘层8的表面利用减去法、添加法等公知的制作布线图形的方法形成导体图形9,作为布线电路图形。
用减去法,例如先在各基底绝缘层8的整个表面上择需通过粘接剂层而层叠导体层,接着在该导体层上形成和布线电路图形相同图形的抗蚀剂层,将该抗蚀剂层作为保护膜,对导体层进行刻蚀,从而形成导体图形9,其后,除去抗蚀剂层。
另外,用添加法,先在各绝缘层8上利用溅射蒸镀法等形成由导体组成的种膜,接着在该种膜上形成和布线电路图形相反图形的抗镀层,在从抗镀层露出的种膜表面上通过电镀形成导体图形9,此后除去抗镀层及层叠该抗镀层的部分的种膜。
还有,导体图形9的厚度通常10~35μm。
然后,如图3(d)所示,在含导体图形9的基底绝缘层8上形成保护绝缘层10。保护绝缘层10的形成无特别限制,和基底绝缘层8的形成一样,例如在含导体图形9的基底绝缘层8的表面涂布感光性树脂溶液(例如感光性聚酰胺酸树脂的溶液等),再曝光、显影,例如形成端子部11开口的规定图形的薄膜。此后,干燥后再使该薄膜硬化。通过这样,例如形成由聚酰亚胺等合成树脂膜组成的保护绝缘层10。另外,保护绝缘层10的厚度通常为12~25μm。还有,保护绝缘层10也可以在板2上使粘接剂层介于中间通过按规定图形粘贴树脂膜而形成。
然后,用该方法,如图3(e)所示,冲压板2,使得形成包围各布线电路基板3的间隙5及连接部4。冲压没有特别限制,例如将板2放在冲模上,利用形状与间隙5对应的冲头进行冲压。
由此,板2上形成各布线电路基板3的部分变成各布线电路基板3的增强层12,该增强层12与连接部4及板2一体形成,准备好将各布线电路基板3分别通过能切断的连接部4保持在板2上的布线电路基板保持板1。
还有,只要各布线电路基板3的增强层12和连接部4及板2形成一体,则能力求实现增强布线电路基板3,并简化结构。
然后,用该方法如图3(f)所示,利用冲压加工,在连接部4的正反两面各形成切断沟6及标记沟7。
冲压加工中,例如如图4所示,利用具有一体化的主冲头13及副冲头14的冲头15,使主冲头13切入切断沟6,副冲头14切入标记沟7,一次形成切断沟6及标记沟7。
具体为,该冲头15的断面略呈倒三角形的主冲头13和断面略呈倒三角形的副冲头14,它们的前端平行地隔开0.5~2mm的间隔S1并排配置。另外,用该冲头15,在加工方向(切入方向)上,为了主冲头13的前端在到达离连接部4的表面(或反面)能形成切断沟6的可切断的适当深度时,副冲头14的前端在连接部4的表面(或反面)形成目视能识别的深度适当的标记沟7,故而例如设定间隔S2,使副冲头14的前端比主冲头13的前端浅0.08~0.1mm。
接着,将该冲头15在连接部4正面及反面相向对置,将它们分别对正面及反面按压,用各主冲头13切入各切断沟6之同时,用各副冲压14切入各标记沟7,从而在连接部4的正反两面同时形成切断沟6和标记沟7。
如这样地制造布线电路基板保持板1,则利用具有一体化的主冲头13及副冲头14的冲头15,能在连接部4同时形成切断线6及标记沟7。因此,用这一方法,通过一次加工,能简易、迅速而确实地形成切断沟6及标记沟7,能实现高效地制造布线电路基板保持板1。
还有,该冲头15其主冲头13的前端和副冲头14的前端并排配置,在加工方向上设置间隔,使得在主冲头13的前端到达离连接部4的正面(或反面)能形成切断沟6的可切断的适当深度时,副冲头14的前端在连接部4的正面(或反面)形成能目视识别的标记沟7。因此,在冲压加工中,在主冲头13前端的切入到达离连接部4的正面(或反面)能切断的合适的深度时,利用副冲头14的前端在连接部4的正面(或反面)形成目视能识别的标记沟7,另一方面,在主冲头13前端的切入未到达离连接部4的正面(或反面)能切断的合适的深度时,不能利用副冲头14的前端在连接部4的正面(或反面)形成目视能识别的标记沟7。因此,切断沟6的切入只有在到达能切断的合适的深度时,才能确实地形成目视看得到的标记沟7。
因此,根据用这种方法得到的布线电路基板保持板1,只要确认有无标记沟7,就能判断切断沟6的深度是否是能切断的合适的深度。即能容易地判断,在有标记沟7时,切断沟6到达能切断的合适的深度,在没有标记沟7时,切断沟6未到达能切断的合适的深度。由此,能恰到好处地切断连接部4,防止由于切断不良损伤布线电路基板3或其上的电子元器件等。
还有,上述的方法中,图3(e)示出的板2的冲压工序、和图3(f)示出的形成切断沟6和标记沟7的工序是依次实施的,但也可以同时实施。这时,在冲压间隙5用的冲头上,与形成切断沟6和标记沟7用的冲头15做成一体,利用这种冲头15同时形成间隙5、连接部4、切断沟6、及标记沟7。
另外,上述的方法中,是依次在板2上层叠基底绝缘层8、导体图形9、保护绝缘层10,但也可以另行制成由基底绝缘层8、导体图形9、保护绝缘层10组成的布线电路基板后,再在板2上用粘接剂粘贴布线电路基板。另外,这时,在粘贴前,也能预先将布线电路基板冲压加工成规定形状,即如上所述那样地在板2上加工连接部4、切断沟6及标记沟7。
实施例
以下,以实施例及比较例为例更具体说明本发明。
实施例1
首先,准备一块厚度0.4mm的铝薄板组成的板【参照图3(a)】,通过在该板的整个面上涂布感光性的聚酰胺酸树脂的溶液、曝光、及显影后,使其干燥与硬化,从而在一块板上的互相隔开规定间隔排列整齐的状态形成8个由聚酰亚胺树脂组成的厚度12μm的基底绝缘层[参照图3(b)]。
然后,在各基层绝缘层上用溅射蒸镀法依次层叠铬薄膜和铜薄膜,形成厚度150nm的种膜。此后,通过对干膜保护层曝光及显影形成和布线电路图形相反的图形的抗镀层。然后,利用电镀铜在从抗镀层露出的种膜表面上形成导体图形,此后,利用化学腐蚀分别除去抗镀层及层叠该抗镀层的部分的种膜,在各基底绝缘层上形成厚17μm的导体图形【参照图3(c)】。
然后,通过在含导体图形的基底绝缘层上涂布感光性聚酰胺酸树脂的溶液、并曝光、显影后,使其干燥、硬化,从而形成由聚酰亚胺树脂组成的厚12μm的保护绝缘膜,作为端子部开口的规定图形【参照图3(d)】。
然后,冲压板,使其形成包围各布线电路基板的间隙及连接部【参照图3(e)】。每一块板设置96个连接部,即每一片布线电路基板设置12个连接部。间隙的宽设定为1.5mm,连接部的宽设定为1mm。
然后,在各连接部的正反两面分别相向对置具有一体化的主冲头和副冲头的冲头,使各主冲头冲出各切断沟,各副冲头冲出各标记沟7,同时形成切断沟及标记沟【参照图3(f)】。
切断沟和标记沟间的间隙设在0.8mm。切断沟沿布线电路基板的周边,按照深0.15mm、V形沟最深处角度50±10°形成。另外,标记沟在连接部长度方向中央,按照深度0.05mm、V形沟最深处角度50±10°形成。
目视检查所得的布线电路基板保持板,确认在各连接部上均形成标记沟。此后,通过沿切断沟弯曲各布线电路基板,使所有的布线电路基板都能完好地从保持板上断开。
还有,上述的说明是提供作为本发明实施形态的示例的,但这只是示例而已,不应限于此而进行解释。从事这项技术的相关人员其了解本发明后的变形例也包括在以后阐述的权利要求的范围内。
Claims (4)
1.一种布线电路基板保持板,由保持着可分离的多片布线电路基板的板组成,其特征在于,
各所述布线电路基板分别通过可切断的连接部保持在所述板上,
在所述连接部形成为了容易切断用的切断沟、和表示所述切断沟的深度为规定深度用的标记沟,所述切断沟和所述标记沟互相隔开规定间隔,形成平行的形状,所述切断沟被形成为能切断所述连接部的深度,所述标记沟被形成为比所述切断沟的深度浅。
2.如权利要求1所述的布线电路基板保持板,其特征在于,
所述布线电路基板具有增强层,
所述增强层和所述连接部及所述板做成一体。
3.一种布线电路基板保持板的制造方法,其特征在于,包括
准备布线电路基板保持板的工序,所述布线电路基板保持板由保持着可分离的多片布线电路基板的板组成,各所述布线电路基板分别通过能切断的连接部保持在所述板上;及
利用一体化地具有形成切断沟用的主冲头和形成标记沟用的副冲头的冲头、从而在所述连接部同时形成为了容易切断用的切断沟和表示所述切断沟的深度为规定深度用的标记沟,使得所述切断沟和所述标记沟互相隔开规定间隔,形成平行的形状,所述切断沟被形成为能切断所述连接部的深度,所述标记沟被形成为比所述切断沟的深度浅的工序。
4.如权利要求3所述的布线电路基板保持板的制造方法,其特征在于,
在所述冲头上,所述主冲头的前端和所述副冲头的前端并排配置,在加工方向上,为了使得所述主冲头的前端到达离所述连接部的表面能形成所述切断沟的可切断的适当深度时,所述副冲头的前端在所述连接部的表面形成目视能识别的深度适当的所述标记沟,设定所述主冲头和所述副冲头的间隔,使所述副冲头的前端比所述主冲头的前端浅。
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JP2003416020A JP4394432B2 (ja) | 2003-12-15 | 2003-12-15 | 配線回路基板保持シートの製造方法 |
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JP5022576B2 (ja) * | 2005-07-08 | 2012-09-12 | 株式会社ジャパンディスプレイイースト | 表示パネルおよび表示装置 |
JP4640815B2 (ja) * | 2005-10-11 | 2011-03-02 | 日東電工株式会社 | 配線回路基板集合体シートおよびその製造方法 |
JP4929893B2 (ja) * | 2006-07-20 | 2012-05-09 | 株式会社デンソー | セラミック基板の製造方法 |
FR2913173B1 (fr) * | 2007-02-22 | 2009-05-15 | Airbus France Sa | Carte electronique et aeronef la comportant |
US8698004B2 (en) * | 2008-10-27 | 2014-04-15 | Ibiden Co., Ltd. | Multi-piece board and fabrication method thereof |
JP5387077B2 (ja) * | 2009-03-17 | 2014-01-15 | 三菱樹脂株式会社 | 温調マット用基板、温調マット及び温調マットの折り畳み方法 |
AT12722U1 (de) * | 2010-03-16 | 2012-10-15 | Austria Tech & System Tech | Verfahren und verbund zum bearbeiten bzw. behandeln einer mehrzahl von leiterplatten sowie verwendung hiefür |
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JP5637759B2 (ja) * | 2010-07-27 | 2014-12-10 | 日本発條株式会社 | 板材の引きちぎり方法、板材、及び装置 |
JP2012212851A (ja) | 2011-03-18 | 2012-11-01 | Ricoh Co Ltd | プリント基板、画像形成装置及びプリント基板の再利用回数の認識方法 |
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US20050139055A1 (en) | 2005-06-30 |
JP2005175342A (ja) | 2005-06-30 |
US7752745B2 (en) | 2010-07-13 |
CN1630455A (zh) | 2005-06-22 |
US7323641B2 (en) | 2008-01-29 |
US20080083116A1 (en) | 2008-04-10 |
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