CN100481466C - 半导体器件 - Google Patents

半导体器件 Download PDF

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Publication number
CN100481466C
CN100481466C CNB2006100054399A CN200610005439A CN100481466C CN 100481466 C CN100481466 C CN 100481466C CN B2006100054399 A CNB2006100054399 A CN B2006100054399A CN 200610005439 A CN200610005439 A CN 200610005439A CN 100481466 C CN100481466 C CN 100481466C
Authority
CN
China
Prior art keywords
film
insulating film
substrate
semiconductor device
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2006100054399A
Other languages
English (en)
Chinese (zh)
Other versions
CN1825600A (zh
Inventor
山崎舜平
须泽英臣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
Original Assignee
Semiconductor Energy Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Publication of CN1825600A publication Critical patent/CN1825600A/zh
Application granted granted Critical
Publication of CN100481466C publication Critical patent/CN100481466C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0421—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/26—Dry etching; Plasma etching; Reactive-ion etching of conductive or resistive materials
    • H10P50/264—Dry etching; Plasma etching; Reactive-ion etching of conductive or resistive materials by chemical means
    • H10P50/266—Dry etching; Plasma etching; Reactive-ion etching of conductive or resistive materials by chemical means by vapour etching only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/238—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement

Landscapes

  • Thin Film Transistor (AREA)
  • Drying Of Semiconductors (AREA)
CNB2006100054399A 1994-11-26 1995-11-25 半导体器件 Expired - Fee Related CN100481466C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP6315473A JPH08153711A (ja) 1994-11-26 1994-11-26 エッチング装置
JP315473/1994 1994-11-26

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CNB991107772A Division CN1251331C (zh) 1994-11-26 1999-08-05 半导体器件

Publications (2)

Publication Number Publication Date
CN1825600A CN1825600A (zh) 2006-08-30
CN100481466C true CN100481466C (zh) 2009-04-22

Family

ID=18065785

Family Applications (4)

Application Number Title Priority Date Filing Date
CNB2006100054399A Expired - Fee Related CN100481466C (zh) 1994-11-26 1995-11-25 半导体器件
CN95121846A Expired - Fee Related CN1128893C (zh) 1994-11-26 1995-11-25 腐蚀设备
CN99117536A Pending CN1248787A (zh) 1994-11-26 1999-08-05 制造半导体器件的方法
CNB991107772A Expired - Lifetime CN1251331C (zh) 1994-11-26 1999-08-05 半导体器件

Family Applications After (3)

Application Number Title Priority Date Filing Date
CN95121846A Expired - Fee Related CN1128893C (zh) 1994-11-26 1995-11-25 腐蚀设备
CN99117536A Pending CN1248787A (zh) 1994-11-26 1999-08-05 制造半导体器件的方法
CNB991107772A Expired - Lifetime CN1251331C (zh) 1994-11-26 1999-08-05 半导体器件

Country Status (4)

Country Link
JP (1) JPH08153711A (https=)
KR (1) KR100313386B1 (https=)
CN (4) CN100481466C (https=)
TW (1) TW279249B (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3336975B2 (ja) * 1998-03-27 2002-10-21 日本電気株式会社 基板処理方法
DE10229037A1 (de) 2002-06-28 2004-01-29 Robert Bosch Gmbh Vorrichtung und Verfahren zur Erzeugung von Chlortrifluorid und Anlage zur Ätzung von Halbleitersubstraten mit dieser Vorrichtung
JP4134671B2 (ja) * 2002-10-17 2008-08-20 松下電器産業株式会社 プラズマ処理方法
KR101225312B1 (ko) * 2005-12-16 2013-01-22 엘지디스플레이 주식회사 프로세스 장치
US8207026B2 (en) * 2009-01-28 2012-06-26 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of thin film transistor and manufacturing method of display device
CN102074157B (zh) * 2011-01-07 2012-01-11 华南理工大学 一种敷铜板腐蚀设备
JP5924901B2 (ja) * 2011-10-17 2016-05-25 Hoya株式会社 転写用マスクの製造方法
KR102030797B1 (ko) 2012-03-30 2019-11-11 삼성디스플레이 주식회사 박막 트랜지스터 표시판 제조 방법
WO2016056300A1 (ja) * 2014-10-10 2016-04-14 関東電化工業株式会社 ケイ素化合物用エッチングガス組成物及びエッチング方法
JP7072440B2 (ja) 2018-05-16 2022-05-20 東京エレクトロン株式会社 シリコン含有膜のエッチング方法、コンピュータ記憶媒体、及びシリコン含有膜のエッチング装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4498953A (en) * 1983-07-27 1985-02-12 At&T Bell Laboratories Etching techniques
JPH0410621A (ja) * 1990-04-27 1992-01-14 Kawasaki Steel Corp 窒化シリコン膜のエッチング処理方法、及びその装置
JPH06103682B2 (ja) * 1990-08-09 1994-12-14 富士通株式会社 光励起ドライクリーニング方法および装置
JPH04196529A (ja) * 1990-11-28 1992-07-16 Toshiba Corp プラズマ処理装置
JPH04206822A (ja) * 1990-11-30 1992-07-28 Mitsubishi Electric Corp 半導体製造装置
JP3176118B2 (ja) * 1992-03-27 2001-06-11 株式会社東芝 多室型基板処理装置

Also Published As

Publication number Publication date
KR960019566A (ko) 1996-06-17
CN1128893C (zh) 2003-11-26
KR100313386B1 (ko) 2003-06-12
CN1251331C (zh) 2006-04-12
CN1245976A (zh) 2000-03-01
CN1248787A (zh) 2000-03-29
CN1136599A (zh) 1996-11-27
JPH08153711A (ja) 1996-06-11
TW279249B (https=) 1996-06-21
CN1825600A (zh) 2006-08-30

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C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090422

Termination date: 20131125