CN100471364C - 电子器件和形成电子器件的方法 - Google Patents

电子器件和形成电子器件的方法 Download PDF

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Publication number
CN100471364C
CN100471364C CNB2004100821419A CN200410082141A CN100471364C CN 100471364 C CN100471364 C CN 100471364C CN B2004100821419 A CNB2004100821419 A CN B2004100821419A CN 200410082141 A CN200410082141 A CN 200410082141A CN 100471364 C CN100471364 C CN 100471364C
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CN
China
Prior art keywords
solder paste
substrate
electronic device
metal particles
solidus temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2004100821419A
Other languages
English (en)
Chinese (zh)
Other versions
CN1642393A (zh
Inventor
N·E·布雷斯
M·P·托本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials International LLC
Original Assignee
Rohm and Haas Electronic Materials LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials LLC filed Critical Rohm and Haas Electronic Materials LLC
Publication of CN1642393A publication Critical patent/CN1642393A/zh
Application granted granted Critical
Publication of CN100471364C publication Critical patent/CN100471364C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams or slurries
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/52—Ceramics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/54—Glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
    • B23K35/3013—Au as the principal constituent

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Led Device Packages (AREA)
  • Light Receiving Elements (AREA)
  • Die Bonding (AREA)
CNB2004100821419A 2003-12-22 2004-12-21 电子器件和形成电子器件的方法 Expired - Fee Related CN100471364C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US53226503P 2003-12-22 2003-12-22
US60/532,265 2003-12-22

Publications (2)

Publication Number Publication Date
CN1642393A CN1642393A (zh) 2005-07-20
CN100471364C true CN100471364C (zh) 2009-03-18

Family

ID=34794224

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2004100821419A Expired - Fee Related CN100471364C (zh) 2003-12-22 2004-12-21 电子器件和形成电子器件的方法

Country Status (5)

Country Link
US (1) US20050139644A1 (https=)
JP (1) JP2005183903A (https=)
KR (1) KR20050063690A (https=)
CN (1) CN100471364C (https=)
TW (1) TWI268191B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
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US20240085635A1 (en) * 2021-05-24 2024-03-14 Corning Research & Development Corporation Systems and methods of joining substrates using nano-particles

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WO2008114784A1 (ja) 2007-03-22 2008-09-25 Tanaka Kikinzoku Kogyo K. K. 封止用の金属ペースト及び圧電素子の気密封止方法並びに圧電デバイス
US7724359B2 (en) * 2008-05-27 2010-05-25 Agere Systems Inc. Method of making electronic entities
US8563192B2 (en) * 2008-12-23 2013-10-22 Encite Llc Gas storage system
US8263177B2 (en) * 2009-03-27 2012-09-11 Kesheng Feng Organic polymer coating for protection against creep corrosion
US9017446B2 (en) 2010-05-03 2015-04-28 Indium Corporation Mixed alloy solder paste
KR101046502B1 (ko) * 2010-11-12 2011-07-04 주식회사 케이엠더블유 통신용 함체
HUE028880T2 (en) * 2011-09-20 2017-01-30 Heraeus Deutschland Gmbh & Co Kg Paste and process for connecting electronic components with a carrier
US9046690B2 (en) * 2011-10-20 2015-06-02 Si-Ware Systems Integrated monolithic optical bench containing 3-D curved optical elements and methods of its fabrication
US9950393B2 (en) * 2011-12-23 2018-04-24 Intel Corporation Hybrid low metal loading flux
JP6167494B2 (ja) * 2012-09-26 2017-07-26 セイコーエプソン株式会社 電子デバイス用容器の製造方法、電子デバイスの製造方法、電子デバイス、電子機器及び移動体機器
CN102922071B (zh) * 2012-10-25 2014-10-08 哈尔滨工业大学 一种采用纳米金属间化合物颗粒制备低温互连高温服役接头的方法
JP6083217B2 (ja) * 2012-12-04 2017-02-22 三菱マテリアル株式会社 Ａｕ−Ｓｎ−Ｂｉ合金粉末ペースト及びＡｕ−Ｓｎ−Ｂｉ合金薄膜の成膜方法
WO2016144945A1 (en) * 2015-03-10 2016-09-15 Indium Corporation Mixed alloy solder paste
US9857541B2 (en) * 2015-07-23 2018-01-02 Finisar Corporation Component alignment
CN106132102B (zh) * 2016-07-12 2018-09-07 北京梦之墨科技有限公司 液态金属双层电路制作方法及复合电路制作方法
EP3385762A1 (en) * 2017-04-03 2018-10-10 Indigo Diabetes N.V. Optical assembly with hermetically sealed cover cap
GB2561234B (en) * 2017-04-07 2019-07-24 Ford Motor Co A housing assembly and method
US10209477B1 (en) * 2017-05-25 2019-02-19 Lockheed Martin Coherent Technologies, Inc. Systems and methods for reconfigurable micro-optic assemblies
DE102018201974A1 (de) * 2018-02-08 2019-08-08 Siemens Aktiengesellschaft Verfahren zum Herstellen einer Baueinheit sowie Verfahren zum Verbinden eines Bauteils mit einer solchen Baueinheit
JP6773093B2 (ja) * 2018-09-20 2020-10-21 信越化学工業株式会社 光学素子パッケージ用リッド、光学素子パッケージ及びそれらの製造方法
DE102019200775A1 (de) * 2019-01-23 2020-07-23 Robert Bosch Gmbh Sensoreinrichtung zur Detektion von Partikeln oder Aerosol in einem strömenden Fluid unter Verwendung des Prinzips der laserinduzierten Inkandeszenz
US11515281B2 (en) * 2019-04-22 2022-11-29 Panasonic Holdings Corporation Bonded structure and bonding material

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US5666643A (en) * 1995-02-23 1997-09-09 General Electric Company High temperature braze material
CN1389326A (zh) * 2002-07-24 2003-01-08 北京工业大学 纳米颗粒增强的锡铅基复合钎料及其制备方法
US20030123816A1 (en) * 2000-12-01 2003-07-03 Steinberg Dan A. Optical device package having a configured frame

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US5666643A (en) * 1995-02-23 1997-09-09 General Electric Company High temperature braze material
US20030123816A1 (en) * 2000-12-01 2003-07-03 Steinberg Dan A. Optical device package having a configured frame
CN1389326A (zh) * 2002-07-24 2003-01-08 北京工业大学 纳米颗粒增强的锡铅基复合钎料及其制备方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240085635A1 (en) * 2021-05-24 2024-03-14 Corning Research & Development Corporation Systems and methods of joining substrates using nano-particles

Also Published As

Publication number Publication date
JP2005183903A (ja) 2005-07-07
KR20050063690A (ko) 2005-06-28
TW200533456A (en) 2005-10-16
TWI268191B (en) 2006-12-11
US20050139644A1 (en) 2005-06-30
CN1642393A (zh) 2005-07-20

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PB01 Publication
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SE01 Entry into force of request for substantive examination
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GR01 Patent grant
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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090318

Termination date: 20131221