TWI268191B - Electronic devices and methods of forming electronic devices - Google Patents

Electronic devices and methods of forming electronic devices

Info

Publication number
TWI268191B
TWI268191B TW093138885A TW93138885A TWI268191B TW I268191 B TWI268191 B TW I268191B TW 093138885 A TW093138885 A TW 093138885A TW 93138885 A TW93138885 A TW 93138885A TW I268191 B TWI268191 B TW I268191B
Authority
TW
Taiwan
Prior art keywords
component
electronic devices
substrate
solder paste
methods
Prior art date
Application number
TW093138885A
Other languages
English (en)
Other versions
TW200533456A (en
Inventor
Nathaniel E Brese
Michael P Toben
Original Assignee
Rohm And Haas Electronic Materials L L C
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm And Haas Electronic Materials L L C filed Critical Rohm And Haas Electronic Materials L L C
Publication of TW200533456A publication Critical patent/TW200533456A/zh
Application granted granted Critical
Publication of TWI268191B publication Critical patent/TWI268191B/zh

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244Powders, particles or spheres; Preforms made therefrom
    • B23K35/025Pastes, creams, slurries
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52Mounting semiconductor bodies in containers
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4202Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/12Mountings, e.g. non-detachable insulating substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/52Ceramics
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54Glass
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244Powders, particles or spheres; Preforms made therefrom
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/26Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/30Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3013Au as the principal constituent

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Led Device Packages (AREA)
  • Light Receiving Elements (AREA)
  • Die Bonding (AREA)
TW093138885A 2003-12-22 2004-12-15 Electronic devices and methods of forming electronic devices TWI268191B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US53226503P 2003-12-22 2003-12-22

Publications (2)

Publication Number Publication Date
TW200533456A TW200533456A (en) 2005-10-16
TWI268191B true TWI268191B (en) 2006-12-11

Family

ID=34794224

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093138885A TWI268191B (en) 2003-12-22 2004-12-15 Electronic devices and methods of forming electronic devices

Country Status (5)

Country Link
US (1) US20050139644A1 (zh)
JP (1) JP2005183903A (zh)
KR (1) KR20050063690A (zh)
CN (1) CN100471364C (zh)
TW (1) TWI268191B (zh)

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US7724359B2 (en) * 2008-05-27 2010-05-25 Agere Systems Inc. Method of making electronic entities
US8563192B2 (en) * 2008-12-23 2013-10-22 Encite Llc Gas storage system
US8263177B2 (en) * 2009-03-27 2012-09-11 Kesheng Feng Organic polymer coating for protection against creep corrosion
US9017446B2 (en) 2010-05-03 2015-04-28 Indium Corporation Mixed alloy solder paste
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HUE028880T2 (en) * 2011-09-20 2017-01-30 Heraeus Deutschland Gmbh & Co Kg Paste and process for connecting electronic components with a carrier
US9046690B2 (en) * 2011-10-20 2015-06-02 Si-Ware Systems Integrated monolithic optical bench containing 3-D curved optical elements and methods of its fabrication
US9950393B2 (en) * 2011-12-23 2018-04-24 Intel Corporation Hybrid low metal loading flux
JP6167494B2 (ja) * 2012-09-26 2017-07-26 セイコーエプソン株式会社 電子デバイス用容器の製造方法、電子デバイスの製造方法、電子デバイス、電子機器及び移動体機器
CN102922071B (zh) * 2012-10-25 2014-10-08 哈尔滨工业大学 一种采用纳米金属间化合物颗粒制备低温互连高温服役接头的方法
JP6083217B2 (ja) * 2012-12-04 2017-02-22 三菱マテリアル株式会社 Au−Sn−Bi合金粉末ペースト及びAu−Sn−Bi合金薄膜の成膜方法
CN107530834A (zh) * 2015-03-10 2018-01-02 铟泰公司 混合合金焊料膏
WO2017015673A1 (en) * 2015-07-23 2017-01-26 Finisar Corporation Component alignment
CN106132102B (zh) * 2016-07-12 2018-09-07 北京梦之墨科技有限公司 液态金属双层电路制作方法及复合电路制作方法
EP3385762A1 (en) * 2017-04-03 2018-10-10 Indigo Diabetes N.V. Optical assembly with hermetically sealed cover cap
GB2561234B (en) 2017-04-07 2019-07-24 Ford Motor Co A housing assembly and method
US10209477B1 (en) * 2017-05-25 2019-02-19 Lockheed Martin Coherent Technologies, Inc. Systems and methods for reconfigurable micro-optic assemblies
DE102018201974A1 (de) * 2018-02-08 2019-08-08 Siemens Aktiengesellschaft Verfahren zum Herstellen einer Baueinheit sowie Verfahren zum Verbinden eines Bauteils mit einer solchen Baueinheit
JP6773093B2 (ja) * 2018-09-20 2020-10-21 信越化学工業株式会社 光学素子パッケージ用リッド、光学素子パッケージ及びそれらの製造方法
DE102019200775A1 (de) * 2019-01-23 2020-07-23 Robert Bosch Gmbh Sensoreinrichtung zur Detektion von Partikeln oder Aerosol in einem strömenden Fluid unter Verwendung des Prinzips der laserinduzierten Inkandeszenz
US11515281B2 (en) * 2019-04-22 2022-11-29 Panasonic Holdings Corporation Bonded structure and bonding material

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Also Published As

Publication number Publication date
CN100471364C (zh) 2009-03-18
CN1642393A (zh) 2005-07-20
JP2005183903A (ja) 2005-07-07
KR20050063690A (ko) 2005-06-28
TW200533456A (en) 2005-10-16
US20050139644A1 (en) 2005-06-30

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees