CN102922071B - 一种采用纳米金属间化合物颗粒制备低温互连高温服役接头的方法 - Google Patents
一种采用纳米金属间化合物颗粒制备低温互连高温服役接头的方法 Download PDFInfo
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Abstract
一种采用纳米金属间化合物颗粒制备低温互连高温服役接头的方法,涉及一种电子器件的封装和组装互连方法。具体包括如下步骤:步骤一:将纳米金属间化合物焊膏放置于基板上,完成待焊部件对准过程,并施加压力;步骤二:将以上体系放入回流炉中,经历预热阶段、保温阶段、再流阶段、冷却阶段,完成有机物的挥发、纳米金属间化合物颗粒之间的均匀烧结以及与焊盘的润湿和界面反应。本发明应用了纳米级金属间化合物颗粒,纳米颗粒很大的表面活性能为其烧结过程提供了强大的驱动力,实现了远低于其块体熔点的与传统回流焊工艺兼容的低温连接,形成性能优良的接头,在成本低、与传统工艺兼容性好、生产效率高的前提下实现了低温键合高温服役。
Description
技术领域
本发明属于微连接技术领域,涉及一种电子器件的封装和组装互连方法,具体涉及一种采用纳米金属间化合物颗粒制备低温互连高温服役接头的方法。
背景技术
连接技术是电子器件封装、LED封装、微系统封装、功率组件封装中的核心技术之一。根据摩尔定律,封装组件功率不断攀升、引脚密度持续增加,使其需要在越来越高的温度下服役,并保证长时间可靠。然而,传统的钎料合金或导电银胶等均不能在高温环境下可靠工作,互连部位相对较差的高温服役性能已经成为制约高密度封装和高功率封装发展的主要瓶颈之一。
对钎焊接头而言,要求服役温度必须低于连接温度,例如SnAg3.0Cu0.5(SAC305)钎料熔点为217℃,其连接温度需达到250℃以上,而其服役温度仅在120℃以下。要想提高服役温度必须选择熔点更高的钎料,然而,过高的连接温度会造成元器件的损伤,此外,高温下连接界面的过度反应易导致过量金属间化合物的生成,进而导致连接界面可靠性的下降。
为解决以上问题,出现了低温连接高温服役的连接方法。现在较常见的技术有纳米银焊膏低温烧结、全金属间化合物互连等。根据纳米颗粒的热力学性质,纳米银颗粒的熔点可降至100℃以下,150℃即可实现连接,且其接头服役温度可达到300℃以上,即实现了低温连接高温服役;然而,其连接工艺时间较长(一般连接温度为150℃时,连接时间需在30min以上才可形成稳定连接)、接头为多孔结构(孔隙率约为15%,影响导电导热性能)、成本较高,制约了该材料的广泛应用。全金属间化合物互连是在正常钎焊温度下使界面充分反应,直至接头全部转化为金属间化合物,接头所能承受的服役温度由熔点较高的金属间化合物决定而非钎料,同样可以实现低温连接高温服役,然而其反应时间需要至少几十分钟,生产效率过低,且接头成分无法实现精确控制,很难实现大规模工业应用。
发明内容
本发明的目的是提供一种能够在较低连接温度下利用纳米金属间化合物颗粒快速形成连接接头,且该接头可实现高温下长时间高可靠性服役的互连方法。其较低的连接温度可避免对元器件的高温损伤、避免连接界面的过度反应、获得最佳的连接质量;其长效高温服役的功能不仅可以解决高密度封装、功率封装带来的高温条件下的可靠问题,还可有助于常规器件在现有工作温度下的寿命提高,此外,提高接头的服役温度还有助于减小散热系统体积,降低封装成本。
所述目的是通过如下方案实现的:
步骤一:通过机械粉碎法、气相合成法或液相合成法制备直径为1~100nm的纳米金属间化合物颗粒,包含Au、Ni、Cu、Ag与Sn、Bi、Zn的金属间化合物等材料体系;
步骤二:将以上纳米颗粒与用以均匀分散纳米粒子的分散剂如硬脂酸、十二胺、三乙基己基磷酸、甲基戊醇、聚丙烯酰胺、鱼油等,可保持聚合物稳定的粘结剂如α-松油醇等,用于改善焊膏印刷性和流动性的稀释剂酒精或萜品醇等,以及用于改善润湿性能和去除氧化膜的助焊剂适量混合;所述纳米金属间化合物焊膏按照质量百分比由纳米金属间化合物颗粒80~90、分散剂2~8、粘结剂2~8、稀释剂2~8和助焊剂2~8制成;
步骤三:利用超声波震荡、手动搅拌或机械搅拌等方法使纳米金属间化合物颗粒在有机溶剂中均匀一致的分散,制成纳米金属间化合物焊膏;
步骤四:采用丝网印刷或点胶方法将以上纳米金属间化合物焊膏放置于基板上,完成待焊部件对准过程,并施加5~15Mpa压力;
步骤五:将以上体系放入回流炉中,经历预热阶段(升温速率2~4℃/s)、保温阶段(升温速率1℃/s,时长30~60s)、再流阶段(峰值温度为熔点以上30~50℃)、冷却阶段(降温速率1~4℃/s),完成有机物的挥发、纳米金属间化合物颗粒之间的均匀烧结以及与焊盘的润湿和界面反应。
本发明应用了纳米级金属间化合物颗粒,纳米颗粒很大的表面活性能为其烧结过程提供强大的驱动力,实现了远低于其块体熔点的与传统回流焊工艺兼容的低温连接(峰值温度280℃以下),形成性能优良的接头,在成本低、与传统工艺兼容性好、生产效率高的前提下实现了低温键合高温服役。
附图说明
图1是纳米Cu6Sn5焊膏互连接头形成过程示意图,其中:(1)放置焊膏和被连接部件;(2)热风回流焊;(3)形成块体Cu6Sn5接头。
具体实施方式
下面结合附图和实施例详细阐述本发明的技术方案。
实施例1:
如图1所示,纳米Cu6Sn5焊膏互连接头形成方法包括如下步骤:
步骤一:准备直径为50nm左右的Cu6Su5颗粒;
步骤二:将以上纳米颗粒与分散剂鱼油、粘结剂α-松油醇、稀释剂酒精、助焊剂适量混合,混合质量比例为80:5:6:4:5;
步骤三:利用150W超声波震荡60min,使纳米Cu6Sn5颗粒在步骤二中配成的有机溶剂中均匀一致的分散,制成纳米Cu6Sn5焊膏;
步骤四:采用丝网印刷法将以上纳米Cu6Sn5焊膏放置于基板上,完成待焊部件焊盘与基板焊盘的对准,并施加5MPa压力;
步骤五:将以上体系放入回流炉中,持续进行以下动作:以2~4℃/s的速度加热至120~150℃完成预热阶段(需20~60s),以1℃/s的加热速率完成20~60s的保温阶段,以1~4℃/s的速率快速升温到峰值温度(熔点以上30~50℃)并保温实现再流阶段(需10~60s),最后以1~4℃/s的速率冷至100℃以下(需10~70s),总工艺时长在60~250s之间。
本实施例的Cu6Sn5金属间化合物,块体熔点为415℃,可以承受300℃以上的持续高温并保持优良的可靠性;电导率(0.57×105/Ω·cm)与SAC305相当;热膨胀系数为16.3×10-6/℃,仅为SAC305的73%,有助于缓解热失配;维氏硬度约为378,是SAC305(14.8)的25.5倍,抗蠕变性能强;杨氏模量为85.56GPa;各向异性不明显,不会造成接头内部热失配及其引起的可靠性问题。因此,Cu6Sn5接头与常用焊盘兼容性高,成本低,抗剪强度、抗温度循环、抗蠕变、抗冲击等可靠性指标都可满足相关要求,可以广泛应用于LED、功率组件、高温元件、超环境应用器件等的封装中。
实施例2:
纳米Cu3Sn焊膏互连接头形成方法包括如下步骤:
步骤一:准备直径为60nm左右的Cu3Sn颗粒;
步骤二:将以上纳米颗粒与分散剂聚醋酸乙烯酯、粘结剂α-松油醇、稀释剂萜品醇、松香适量混合,混合比例为82:5:4:4:5;
步骤三:利用150W超声波震荡50min,使纳米Cu3Sn颗粒在步骤二中配成的有机溶剂中均匀一致的分散,制成纳米Cu3Sn焊膏;
步骤四:采用点胶方法将以上纳米Cu3Sn焊膏放置于基板上,完成待焊部件焊盘与基板焊盘的对准,并施加10MPa压力;
步骤五:将以上体系放入回流炉中,持续进行以下动作:以2~4℃/s的速度加热至150℃完成预热阶段(需20~60s),以1℃/s的加热速率完成40s的保温阶段,以3℃/s的速率快速升温到峰值温度(熔点以上30~50℃)并保温实现再流阶段(需50s),最后以4℃/s的速率冷至100℃以下(需10~50s),总工艺时长小于250s。
实施例3:
纳米Ag3Sn焊膏互连接头形成方法包括如下步骤:
步骤一:准备直径为70nm左右的Ag3Sn颗粒;
步骤二:将以上纳米颗粒与分散剂聚乙二醇酯、粘结剂α-松油醇、稀释剂乙醇、松香适量混合,混合比例为82:5:4:4:5;
步骤三:利用160W超声波震荡45min,使纳米Ag3Sn颗粒在步骤二中配成的有机溶剂中均匀一致的分散,制成纳米Ag3Sn焊膏;
步骤四:采用丝网印刷方法将以上纳米Ag3Sn焊膏放置于基板上,完成待焊部件焊盘与基板焊盘的对准,并施加10MPa压力;
步骤五:将以上体系放入回流炉中,持续进行以下动作:以3℃/s的速度加热至150℃完成预热阶段,以1℃/s的加热速率完成40s的保温阶段,以3℃/s的速率快速升温到峰值温度(熔点以上30~50℃)并保温实现再流阶段(需60s左右),最后以4℃/s的速率冷至100℃以下(需10~50s),总工艺时长在250s以下。
上述实施例只是对本专利的示例性说明而并不限定它的保护范围,本领域人员还可以对其进行局部改变,只要没有超出本专利的精神实质,都视为对本专利的等同替换,都在本专利的保护范围之内。
Claims (7)
1.一种采用纳米金属间化合物颗粒制备低温互连高温服役接头的方法,其特征在于:
步骤一:采用丝网印刷或点胶方法将纳米金属间化合物焊膏放置于基板上,完成待焊部件对准过程,并施加5~15Mpa压力;
步骤二:将以上体系放入回流炉中,以2~4℃/s的速度加热至120~150℃完成预热阶段,以1℃/s的加热速率完成50~70s的保温阶段,以1~4℃/s的速率快速升温到峰值温度并保温实现再流阶段,最后以1~4℃/s的速率冷至100℃以下,完成有机物的挥发、纳米金属间化合物颗粒之间的均匀烧结以及与焊盘的润湿和界面反应,所述纳米金属间化合物颗粒为A与B之间的金属间化合物材料体系,其中A为:Au、Ni、Cu、Ag,B为:Sn、Bi、Zn。
2.根据权利要求1所述的一种采用纳米金属间化合物颗粒制备低温互连高温服役接头的方法,其特征在于所述峰值温度为纳米级金属间化合物熔点以上30~50℃。
3.根据权利要求1所述的一种采用纳米金属间化合物颗粒制备低温互连高温服役接头的方法,其特征在于所述预热阶段需要20~60s,保温阶段需要20~60s,再流阶段需要10~60s,降温阶段需要10~70s。
4.根据权利要求1所述的一种采用纳米金属间化合物颗粒制备低温互连高温服役接头的方法,其特征在于所述纳米金属间化合物焊膏按照质量百分比由纳米金属间化合物颗粒80~90、分散剂2~8、粘结剂2~8、稀释剂2~8和助焊剂2~8制成。
5.根据权利要求4所述的一种采用纳米金属间化合物颗粒制备低温互连高温服役接头的方法,其特征在于所述纳米金属间化合物焊膏按照如下方法制备:
步骤一:通过机械粉碎法、气相合成法或液相合成法制备直径为1~100nm的纳米金属间化合物颗粒;
步骤二:将以上纳米颗粒与分散剂、粘结剂、稀释剂以及助焊剂按照质量百分比为80~90:2~8:2~8:2~8:2~8的比例混合;
步骤三:利用超声波震荡、手动搅拌或机械搅拌方法使纳米金属间化合物颗粒在有机溶剂中均匀一致的分散,制成纳米金属间化合物焊膏。
6.根据权利要求1所述的一种采用纳米金属间化合物颗粒制备低温互连高温服役接头的方法,其特征在于所述纳米金属间化合物颗粒为Cu6Sn5、Cu3Sn或Ag3Sn。
7.根据权利要求4或5所述的一种采用纳米金属间化合物颗粒制备低温互连高温服役接头的方法,其特征在于所述分散剂为硬脂酸、十二胺、三乙基己基磷酸、甲基戊醇、聚丙烯酰胺或鱼油;所述粘结剂为α-松油醇;所述稀释剂酒精或萜品醇;所述助焊剂为松香。
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