TWI268191B - Electronic devices and methods of forming electronic devices - Google Patents

Electronic devices and methods of forming electronic devices

Info

Publication number
TWI268191B
TWI268191B TW093138885A TW93138885A TWI268191B TW I268191 B TWI268191 B TW I268191B TW 093138885 A TW093138885 A TW 093138885A TW 93138885 A TW93138885 A TW 93138885A TW I268191 B TWI268191 B TW I268191B
Authority
TW
Taiwan
Prior art keywords
component
electronic devices
substrate
solder paste
methods
Prior art date
Application number
TW093138885A
Other languages
English (en)
Chinese (zh)
Other versions
TW200533456A (en
Inventor
Nathaniel E Brese
Michael P Toben
Original Assignee
Rohm And Haas Electronic Materials L L C
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm And Haas Electronic Materials L L C filed Critical Rohm And Haas Electronic Materials L L C
Publication of TW200533456A publication Critical patent/TW200533456A/zh
Application granted granted Critical
Publication of TWI268191B publication Critical patent/TWI268191B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams or slurries
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/52—Ceramics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/54—Glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
    • B23K35/3013—Au as the principal constituent

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Led Device Packages (AREA)
  • Light Receiving Elements (AREA)
  • Die Bonding (AREA)
TW093138885A 2003-12-22 2004-12-15 Electronic devices and methods of forming electronic devices TWI268191B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US53226503P 2003-12-22 2003-12-22

Publications (2)

Publication Number Publication Date
TW200533456A TW200533456A (en) 2005-10-16
TWI268191B true TWI268191B (en) 2006-12-11

Family

ID=34794224

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093138885A TWI268191B (en) 2003-12-22 2004-12-15 Electronic devices and methods of forming electronic devices

Country Status (5)

Country Link
US (1) US20050139644A1 (https=)
JP (1) JP2005183903A (https=)
KR (1) KR20050063690A (https=)
CN (1) CN100471364C (https=)
TW (1) TWI268191B (https=)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005033724A1 (de) * 2005-07-15 2007-01-18 Merck Patent Gmbh Druckfähige Ätzmedien für Siliziumdioxid-und Siliziumnitridschichten
WO2008114784A1 (ja) 2007-03-22 2008-09-25 Tanaka Kikinzoku Kogyo K. K. 封止用の金属ペースト及び圧電素子の気密封止方法並びに圧電デバイス
US7724359B2 (en) * 2008-05-27 2010-05-25 Agere Systems Inc. Method of making electronic entities
US8563192B2 (en) * 2008-12-23 2013-10-22 Encite Llc Gas storage system
US8263177B2 (en) * 2009-03-27 2012-09-11 Kesheng Feng Organic polymer coating for protection against creep corrosion
US9017446B2 (en) 2010-05-03 2015-04-28 Indium Corporation Mixed alloy solder paste
KR101046502B1 (ko) * 2010-11-12 2011-07-04 주식회사 케이엠더블유 통신용 함체
HUE028880T2 (en) * 2011-09-20 2017-01-30 Heraeus Deutschland Gmbh & Co Kg Paste and process for connecting electronic components with a carrier
US9046690B2 (en) * 2011-10-20 2015-06-02 Si-Ware Systems Integrated monolithic optical bench containing 3-D curved optical elements and methods of its fabrication
US9950393B2 (en) * 2011-12-23 2018-04-24 Intel Corporation Hybrid low metal loading flux
JP6167494B2 (ja) * 2012-09-26 2017-07-26 セイコーエプソン株式会社 電子デバイス用容器の製造方法、電子デバイスの製造方法、電子デバイス、電子機器及び移動体機器
CN102922071B (zh) * 2012-10-25 2014-10-08 哈尔滨工业大学 一种采用纳米金属间化合物颗粒制备低温互连高温服役接头的方法
JP6083217B2 (ja) * 2012-12-04 2017-02-22 三菱マテリアル株式会社 Ａｕ−Ｓｎ−Ｂｉ合金粉末ペースト及びＡｕ−Ｓｎ−Ｂｉ合金薄膜の成膜方法
WO2016144945A1 (en) * 2015-03-10 2016-09-15 Indium Corporation Mixed alloy solder paste
US9857541B2 (en) * 2015-07-23 2018-01-02 Finisar Corporation Component alignment
CN106132102B (zh) * 2016-07-12 2018-09-07 北京梦之墨科技有限公司 液态金属双层电路制作方法及复合电路制作方法
EP3385762A1 (en) * 2017-04-03 2018-10-10 Indigo Diabetes N.V. Optical assembly with hermetically sealed cover cap
GB2561234B (en) * 2017-04-07 2019-07-24 Ford Motor Co A housing assembly and method
US10209477B1 (en) * 2017-05-25 2019-02-19 Lockheed Martin Coherent Technologies, Inc. Systems and methods for reconfigurable micro-optic assemblies
DE102018201974A1 (de) * 2018-02-08 2019-08-08 Siemens Aktiengesellschaft Verfahren zum Herstellen einer Baueinheit sowie Verfahren zum Verbinden eines Bauteils mit einer solchen Baueinheit
JP6773093B2 (ja) * 2018-09-20 2020-10-21 信越化学工業株式会社 光学素子パッケージ用リッド、光学素子パッケージ及びそれらの製造方法
DE102019200775A1 (de) * 2019-01-23 2020-07-23 Robert Bosch Gmbh Sensoreinrichtung zur Detektion von Partikeln oder Aerosol in einem strömenden Fluid unter Verwendung des Prinzips der laserinduzierten Inkandeszenz
US11515281B2 (en) * 2019-04-22 2022-11-29 Panasonic Holdings Corporation Bonded structure and bonding material
WO2023282976A2 (en) * 2021-05-24 2023-01-12 Corning Research & Development Corporation Systems and methods of joining substrates using nano-particles

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4557767A (en) * 1983-10-31 1985-12-10 Scm Corporation Fusible powdered metal paste
US4661173A (en) * 1986-07-25 1987-04-28 Mcdonnell Douglas Corporation Alloy-enriched solder cream
JPS63238994A (ja) * 1987-03-25 1988-10-05 Tdk Corp 半田組成物
US4919729A (en) * 1988-06-08 1990-04-24 International Business Machines Corporation Solder paste for use in a reducing atmosphere
US5141568A (en) * 1990-05-15 1992-08-25 Hughes Aircraft Company Water-soluble soldering paste
US5294242A (en) * 1991-09-30 1994-03-15 Air Products And Chemicals Method for making metal powders
US5412748A (en) * 1992-12-04 1995-05-02 Kabushiki Kaisha Toshiba Optical semiconductor module
US5346118A (en) * 1993-09-28 1994-09-13 At&T Bell Laboratories Surface mount solder assembly of leadless integrated circuit packages to substrates
US5382300A (en) * 1994-03-22 1995-01-17 At&T Corp. Solder paste mixture
US5964963A (en) * 1994-08-25 1999-10-12 Turchan; Manuel C. Brazing paste
US5666643A (en) * 1995-02-23 1997-09-09 General Electric Company High temperature braze material
JP3215008B2 (ja) * 1995-04-21 2001-10-02 株式会社日立製作所 電子回路の製造方法
JPH08294792A (ja) * 1995-04-24 1996-11-12 Yoshida Tekkosho:Kk ろう接材料及びろう接方法
JPH09318849A (ja) * 1996-05-24 1997-12-12 Fujitsu Ltd 光伝送モジュールおよびその製造方法
JP3644205B2 (ja) * 1997-08-08 2005-04-27 株式会社デンソー 半導体装置及びその製造方法
US6205264B1 (en) * 1998-04-14 2001-03-20 Lucent Technologies Inc. Optical assembly with improved dimensional stability
US6136689A (en) * 1998-08-14 2000-10-24 Micron Technology, Inc. Method of forming a micro solder ball for use in C4 bonding process
GB9929521D0 (en) * 1999-12-15 2000-02-09 Secr Defence Bonded products and methods of fabrication therefor
JP3423930B2 (ja) * 1999-12-27 2003-07-07 富士通株式会社 バンプ形成方法、電子部品、および半田ペースト
CA2410636A1 (en) * 2000-05-24 2001-11-29 Stephen F. Corbin Variable melting point solders and brazes
US6932519B2 (en) * 2000-11-16 2005-08-23 Shipley Company, L.L.C. Optical device package
US6827503B2 (en) * 2000-12-01 2004-12-07 Shipley Company, L.L.C. Optical device package having a configured frame
US6883977B2 (en) * 2000-12-14 2005-04-26 Shipley Company, L.L.C. Optical device package for flip-chip mounting
US6740287B2 (en) * 2001-02-22 2004-05-25 Romain Louis Billiet Method for making articles from nanoparticulate materials
JP2003166007A (ja) * 2001-03-28 2003-06-13 Tamura Kaken Co Ltd 金属微粒子の製造方法、金属微粒子含有物及びソルダーペースト組成物
JP2002359426A (ja) * 2001-06-01 2002-12-13 Hitachi Ltd 光モジュール及び光通信システム
US20030146019A1 (en) * 2001-11-22 2003-08-07 Hiroyuki Hirai Board and ink used for forming conductive pattern, and method using thereof
US7416108B2 (en) * 2002-01-24 2008-08-26 Siemens Power Generation, Inc. High strength diffusion brazing utilizing nano-powders
CN1152769C (zh) * 2002-07-24 2004-06-09 北京工业大学 纳米颗粒增强的锡铅基复合钎料及其制备方法

Also Published As

Publication number Publication date
JP2005183903A (ja) 2005-07-07
KR20050063690A (ko) 2005-06-28
CN100471364C (zh) 2009-03-18
TW200533456A (en) 2005-10-16
US20050139644A1 (en) 2005-06-30
CN1642393A (zh) 2005-07-20

Similar Documents

Publication Publication Date Title
TWI268191B (en) Electronic devices and methods of forming electronic devices
WO2004112128A3 (en) Low profile stacking system and method
SG90219A1 (en) Semiconductor device and a process for forming the semiconductor device
TW200737432A (en) Hermetic sealing cap, electronic component storage package and method of manufacturing hermetic sealing cap
US20080293188A1 (en) Reactive solder material
TW200731431A (en) Semiconductor device and manufacturing method therefor
SG153627A1 (en) Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components
TW200633172A (en) Semiconductor package and method for manufacturing the same
US20200144785A1 (en) Cover for an optoelectronic component and optoelectronic device
EP1675259A3 (en) Electronic device and method of fabricating the same
CN108231603B (zh) 一种芯片封装体的制备方法以及芯片封装体
EP1058306A3 (en) Electronic component to be mounted on a circuit board having electronic circuit device sealed therein and method of manufacturing the same
SE9803350L (sv) Förfarande vid lödning av ett halvledarchip samt RF-power transistor för genomförande därav
TW200729371A (en) Semiconductor device and manufacturing method of the same, camera module
TW200610205A (en) Organic semiconductor device and manufacturing method thereof
EP2300195B1 (en) Gold-tin-indium solder for processing compatibility with lead-free tin-based solder
TW200717738A (en) MEMS package and method of forming the same
CN112654453A (zh) 接合结构体的制造方法
TW200616127A (en) Electronic device, semiconductor device employing the same, and semiconductor device production method
KR101962060B1 (ko) 전자 부품 밀봉용 캡
SG129252A1 (en) Method for producing a semiconductor device and corresponding semiconductor device
TW200627652A (en) Electronic package and method of manufacturing same
TW200504954A (en) Semiconductor device and manufacturing method therefor
WO2009044695A1 (ja) 電子部品の実装方法等
JP2009506565A (ja) ２つの要素を互いにシーリングまたは溶接する方法

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees