CN100461475C - 形成低温生长缓冲层的方法、以及制造发光元件的方法 - Google Patents

形成低温生长缓冲层的方法、以及制造发光元件的方法 Download PDF

Info

Publication number
CN100461475C
CN100461475C CNB2006100670051A CN200610067005A CN100461475C CN 100461475 C CN100461475 C CN 100461475C CN B2006100670051 A CNB2006100670051 A CN B2006100670051A CN 200610067005 A CN200610067005 A CN 200610067005A CN 100461475 C CN100461475 C CN 100461475C
Authority
CN
China
Prior art keywords
buffer layer
substrate
temperature
low
atmosphere
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2006100670051A
Other languages
English (en)
Chinese (zh)
Other versions
CN1841800A (zh
Inventor
牛田泰久
筱田大辅
山崎大辅
平田宏治
池本由平
柴田直树
青木和夫
恩卡纳西翁·安东尼亚·加西亚·比略拉
岛村清史
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koha Co Ltd
Original Assignee
Toyoda Gosei Co Ltd
Koha Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyoda Gosei Co Ltd, Koha Co Ltd filed Critical Toyoda Gosei Co Ltd
Publication of CN1841800A publication Critical patent/CN1841800A/zh
Application granted granted Critical
Publication of CN100461475C publication Critical patent/CN100461475C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • AHUMAN NECESSITIES
    • A01AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01KANIMAL HUSBANDRY; AVICULTURE; APICULTURE; PISCICULTURE; FISHING; REARING OR BREEDING ANIMALS, NOT OTHERWISE PROVIDED FOR; NEW BREEDS OF ANIMALS
    • A01K63/00Receptacles for live fish, e.g. aquaria; Terraria
    • A01K63/06Arrangements for heating or lighting in, or attached to, receptacles for live fish
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • C30B25/18Epitaxial-layer growth characterised by the substrate
    • C30B25/183Epitaxial-layer growth characterised by the substrate being provided with a buffer layer, e.g. a lattice matching layer
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/40AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C30B29/403AIII-nitrides
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/011Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/013Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
    • H10H20/0133Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials
    • H10H20/01335Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials the light-emitting regions comprising nitride materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/24Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2901Materials
    • H10P14/2918Materials being semiconductor metal oxides
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/32Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
    • H10P14/3202Materials thereof
    • H10P14/3214Materials thereof being Group IIIA-VA semiconductors
    • H10P14/3216Nitrides
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34Deposited materials, e.g. layers
    • H10P14/3402Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3414Deposited materials, e.g. layers characterised by the chemical composition being group IIIA-VIA materials
    • H10P14/3416Nitrides
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34Deposited materials, e.g. layers
    • H10P14/3438Doping during depositing
    • H10P14/3441Conductivity type
    • H10P14/3442N-type
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34Deposited materials, e.g. layers
    • H10P14/3438Doping during depositing
    • H10P14/3441Conductivity type
    • H10P14/3444P-type
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/36Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by treatments done before the formation of the materials
    • H10P14/3602In-situ cleaning
    • AHUMAN NECESSITIES
    • A01AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01KANIMAL HUSBANDRY; AVICULTURE; APICULTURE; PISCICULTURE; FISHING; REARING OR BREEDING ANIMALS, NOT OTHERWISE PROVIDED FOR; NEW BREEDS OF ANIMALS
    • A01K63/00Receptacles for live fish, e.g. aquaria; Terraria
    • A01K63/003Aquaria; Terraria
    • A01K63/006Accessories for aquaria or terraria
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/551Materials of bond wires
    • H10W72/552Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Environmental Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Animal Husbandry (AREA)
  • Marine Sciences & Fisheries (AREA)
  • Biodiversity & Conservation Biology (AREA)
  • Led Devices (AREA)
  • Led Device Packages (AREA)
CNB2006100670051A 2005-03-31 2006-03-31 形成低温生长缓冲层的方法、以及制造发光元件的方法 Expired - Fee Related CN100461475C (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2005101603 2005-03-31
JP2005101603 2005-03-31
JP2006016988 2006-01-25
JP2006016988A JP5159040B2 (ja) 2005-03-31 2006-01-25 低温成長バッファ層の形成方法および発光素子の製造方法

Publications (2)

Publication Number Publication Date
CN1841800A CN1841800A (zh) 2006-10-04
CN100461475C true CN100461475C (zh) 2009-02-11

Family

ID=37071111

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2006100670051A Expired - Fee Related CN100461475C (zh) 2005-03-31 2006-03-31 形成低温生长缓冲层的方法、以及制造发光元件的方法

Country Status (6)

Country Link
US (1) US7524741B2 (https=)
JP (1) JP5159040B2 (https=)
KR (1) KR100887470B1 (https=)
CN (1) CN100461475C (https=)
DE (1) DE102006000150B4 (https=)
TW (1) TWI317178B (https=)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101689585A (zh) * 2007-06-15 2010-03-31 罗姆股份有限公司 半导体发光装置及其制造方法
CN100546058C (zh) * 2007-10-15 2009-09-30 佛山市国星光电股份有限公司 功率发光二极管封装结构
TWI431669B (zh) * 2007-11-21 2014-03-21 三菱化學股份有限公司 Crystallization Growth of Nitride Semiconductor and Nitride Semiconductor
JP2009227545A (ja) * 2008-03-25 2009-10-08 Nippon Light Metal Co Ltd 光デバイス用基板及びその製造方法
KR101020958B1 (ko) * 2008-11-17 2011-03-09 엘지이노텍 주식회사 산화갈륨기판 제조방법, 발광소자 및 발광소자 제조방법
JP5529420B2 (ja) * 2009-02-09 2014-06-25 住友電気工業株式会社 エピタキシャルウエハ、窒化ガリウム系半導体デバイスを作製する方法、窒化ガリウム系半導体デバイス、及び酸化ガリウムウエハ
JP5378829B2 (ja) * 2009-02-19 2013-12-25 住友電気工業株式会社 エピタキシャルウエハを形成する方法、及び半導体素子を作製する方法
KR101047652B1 (ko) * 2009-12-18 2011-07-07 엘지이노텍 주식회사 발광소자 및 그 제조방법
KR100969127B1 (ko) * 2010-02-18 2010-07-09 엘지이노텍 주식회사 발광 소자, 발광 소자 제조방법 및 발광 소자 패키지
JP5706696B2 (ja) * 2011-01-06 2015-04-22 株式会社タムラ製作所 発光素子の製造方法及び発光素子
WO2012137783A1 (ja) * 2011-04-08 2012-10-11 株式会社タムラ製作所 半導体積層体及びその製造方法、並びに半導体素子
US9153648B2 (en) 2011-04-08 2015-10-06 Tamura Corporation Semiconductor stacked body, method for manufacturing same, and semiconductor element
EP2768013A4 (en) * 2011-10-13 2015-05-20 Tamura Seisakusho Kk CRYSTAL SHIELD STRUCTURE AND METHOD FOR THE PRODUCTION THEREOF AND SEMICONDUCTOR COMPONENT
JP2013089616A (ja) * 2011-10-13 2013-05-13 Tamura Seisakusho Co Ltd 結晶積層構造体及びその製造方法
JP5777479B2 (ja) * 2011-10-14 2015-09-09 株式会社タムラ製作所 β−Ga2O3系基板の製造方法、及び結晶積層構造体の製造方法
CN103173738A (zh) * 2013-03-22 2013-06-26 新疆大学 一种Ga空位可调的GaN纳米结构的制备方法
JP5734362B2 (ja) * 2013-07-12 2015-06-17 株式会社タムラ製作所 半導体積層構造体及び半導体素子
CN105261683B (zh) * 2015-11-03 2017-10-10 湘能华磊光电股份有限公司 一种提高led外延晶体质量的外延生长方法
US10731274B2 (en) * 2016-06-24 2020-08-04 Stanley Electric Co., Ltd. Group III nitride laminate and vertical semiconductor device having the laminate
CN109378371B (zh) * 2018-10-17 2020-10-09 湘能华磊光电股份有限公司 Led外延片生长方法
CN109378377B (zh) * 2018-10-17 2020-06-23 湘能华磊光电股份有限公司 Led外延生长方法
WO2020194763A1 (ja) * 2019-03-28 2020-10-01 日本碍子株式会社 半導体膜
UA124713C2 (uk) * 2019-10-03 2021-11-03 Юрій Юрійович Синиця Акваріум з підсвічуванням
JP7549322B2 (ja) * 2020-04-01 2024-09-11 株式会社ノベルクリスタルテクノロジー 半導体基板及びその製造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07249796A (ja) * 1994-03-09 1995-09-26 Toshiba Corp 半導体発光素子
US5930656A (en) * 1996-10-21 1999-07-27 Kabushiki Kaisha Toshiba Method of fabricating a compound semiconductor device
CN2386534Y (zh) * 1999-07-23 2000-07-05 亿光电子工业股份有限公司 发光二极管封装装置
CN1460300A (zh) * 2001-02-21 2003-12-03 索尼公司 半导体发光器件及其制造方法、以及电极层连接结构
CN1461060A (zh) * 2003-04-16 2003-12-10 方大集团股份有限公司 复合量子阱结构高亮度GaN基蓝光LED外延片
JP2005064153A (ja) * 2003-08-08 2005-03-10 Koha Co Ltd 半導体層

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03203388A (ja) * 1989-12-29 1991-09-05 Matsushita Electric Ind Co Ltd 半導体発光素子およびその製造方法
JPH088217B2 (ja) * 1991-01-31 1996-01-29 日亜化学工業株式会社 窒化ガリウム系化合物半導体の結晶成長方法
JP3147316B2 (ja) * 1991-08-05 2001-03-19 日本電信電話株式会社 半導体発光素子の作製方法
JPH07235692A (ja) * 1993-12-30 1995-09-05 Sony Corp 化合物半導体装置及びその形成方法
JP3239622B2 (ja) * 1994-08-12 2001-12-17 松下電器産業株式会社 半導体薄膜の形成方法
US6159834A (en) * 1998-02-12 2000-12-12 Motorola, Inc. Method of forming a gate quality oxide-compound semiconductor structure
US6078064A (en) * 1998-05-04 2000-06-20 Epistar Co. Indium gallium nitride light emitting diode
TW398084B (en) 1998-06-05 2000-07-11 Hewlett Packard Co Multilayered indium-containing nitride buffer layer for nitride epitaxy
US6423984B1 (en) * 1998-09-10 2002-07-23 Toyoda Gosei Co., Ltd. Light-emitting semiconductor device using gallium nitride compound semiconductor
DE19856245A1 (de) * 1998-12-07 2000-06-15 Deutsche Telekom Ag Verfahren zur Herstellung von mehrschichtigen Halbleiterstrukturen
JP3470054B2 (ja) * 1998-12-28 2003-11-25 シャープ株式会社 窒化物系iii−v族化合物半導体装置
US6852161B2 (en) * 2000-08-18 2005-02-08 Showa Denko K.K. Method of fabricating group-iii nitride semiconductor crystal, method of fabricating gallium nitride-based compound semiconductor, gallium nitride-based compound semiconductor, gallium nitride-based compound semiconductor light-emitting device, and light source using the semiconductor light-emitting device
JP2002314203A (ja) * 2001-04-12 2002-10-25 Pioneer Electronic Corp 3族窒化物半導体レーザ及びその製造方法
KR100419611B1 (ko) * 2001-05-24 2004-02-25 삼성전기주식회사 발광다이오드 및 이를 이용한 발광장치와 그 제조방법
JP3679097B2 (ja) * 2002-05-31 2005-08-03 株式会社光波 発光素子
KR20040044701A (ko) * 2002-11-21 2004-05-31 삼성전기주식회사 발광소자 패키지 및 그 제조방법
JP4565062B2 (ja) * 2003-03-12 2010-10-20 学校法人早稲田大学 薄膜単結晶の成長方法
JP4020314B2 (ja) * 2003-05-15 2007-12-12 学校法人早稲田大学 Ga2O3系発光素子およびその製造方法
FR2853141A1 (fr) * 2003-03-26 2004-10-01 Kyocera Corp Appareil a semi-conducteur, procede pour faire croitre un semi-conducteur a nitrure et procede de production d'un appareil a semi-conducteur

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07249796A (ja) * 1994-03-09 1995-09-26 Toshiba Corp 半導体発光素子
US5930656A (en) * 1996-10-21 1999-07-27 Kabushiki Kaisha Toshiba Method of fabricating a compound semiconductor device
CN2386534Y (zh) * 1999-07-23 2000-07-05 亿光电子工业股份有限公司 发光二极管封装装置
CN1460300A (zh) * 2001-02-21 2003-12-03 索尼公司 半导体发光器件及其制造方法、以及电极层连接结构
CN1461060A (zh) * 2003-04-16 2003-12-10 方大集团股份有限公司 复合量子阱结构高亮度GaN基蓝光LED外延片
JP2005064153A (ja) * 2003-08-08 2005-03-10 Koha Co Ltd 半導体層

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
MOCVD生长的GaN单晶膜的蓝带发光研究. 李述体,王立,辛勇,彭学新,熊传兵,姚冬敏,江风益.发光学报,第21卷第1期. 2000 *

Also Published As

Publication number Publication date
JP5159040B2 (ja) 2013-03-06
CN1841800A (zh) 2006-10-04
DE102006000150A1 (de) 2006-11-30
US20060223287A1 (en) 2006-10-05
KR100887470B1 (ko) 2009-03-10
US7524741B2 (en) 2009-04-28
KR20060105546A (ko) 2006-10-11
JP2006310765A (ja) 2006-11-09
DE102006000150B4 (de) 2018-02-08
TWI317178B (en) 2009-11-11
TW200735410A (en) 2007-09-16

Similar Documents

Publication Publication Date Title
CN100461475C (zh) 形成低温生长缓冲层的方法、以及制造发光元件的方法
US8309982B2 (en) Group-III nitride semiconductor light-emitting device, method for manufacturing the same, and lamp
JP5272390B2 (ja) Iii族窒化物半導体の製造方法、iii族窒化物半導体発光素子の製造方法、及びiii族窒化物半導体発光素子、並びにランプ
KR101316492B1 (ko) 질화물 반도체 발광소자 및 그 제조 방법
TW200838000A (en) Group-III nitride compound semiconductor device and production method thereof, group-III nitride compound semiconductor light-emitting device and production method thereof, and lamp
CN101506946B (zh) Ⅲ族氮化物化合物半导体发光元件的制造方法、ⅲ族氮化物化合物半导体发光元件和灯
CN101874306A (zh) Ⅲ族氮化物半导体发光元件及其制造方法以及灯
JP2009277882A (ja) Iii族窒化物半導体発光素子の製造方法及びiii族窒化物半導体発光素子、並びにランプ
JP2008205267A (ja) Iii族窒化物半導体発光素子の製造方法及びiii族窒化物半導体発光素子並びにランプ
CN102113140A (zh) Ⅲ族氮化物半导体发光元件的制造方法、ⅲ族氮化物半导体发光元件和灯
CN101405876B (zh) Ⅲ族氮化物半导体发光元件和其制造方法、以及灯
EP2270879A1 (en) Nitride semiconductor light emitting element
CN106328771A (zh) 一种在金属氮化镓复合衬底上外延无裂纹高晶体质量led外延层的方法
CN1864277A (zh) 氮化物半导体;使用该半导体的发光器件,发光二极管,激光器件和灯;及其制造方法
US8278129B2 (en) Manufacturing method of nitride semi-conductor layer, and a nitride semi-conductor light emitting device with its manufacturing method
JP5041883B2 (ja) Iii族窒化物半導体層の製造方法、iii族窒化物半導体発光素子の製造方法
CN101578715A (zh) Ⅲ族氮化物化合物半导体元件及其制造方法、ⅲ族氮化物化合物半导体发光元件及其制造方法和灯
JP4882351B2 (ja) 半導体積層基板、その製造方法及び発光素子
JP4806993B2 (ja) Iii−v族化合物半導体膜の形成方法
JP2008053372A (ja) 半導体デバイスの製造方法
JP2008294449A (ja) Iii族窒化物半導体発光素子の製造方法及びiii族窒化物半導体発光素子並びにランプ
JP2008135463A (ja) Iii族窒化物半導体の製造方法、iii族窒化物半導体発光素子の製造方法、及びiii族窒化物半導体発光素子、並びにランプ
CN101542756A (zh) Ⅲ族氮化物半导体发光元件的制造方法、ⅲ族氮化物半导体发光元件和灯
CN114188449A (zh) 一种电子阻挡层生长方法、外延层及led芯片
JP2008034510A (ja) Iii族窒化物化合物半導体発光素子及びその製造方法、並びにランプ

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Free format text: FORMER OWNER: KOHA CO., LTD.

Owner name: KOHA CO., LTD.

Free format text: FORMER OWNER: TOYODA GOSEI CO., LTD.

Effective date: 20110311

C41 Transfer of patent application or patent right or utility model
COR Change of bibliographic data

Free format text: CORRECT: ADDRESS; FROM: AICHI, JAPAN TO: TOKYO METROPOLITAN, JAPAN

TR01 Transfer of patent right

Effective date of registration: 20110311

Address after: Tokyo, Japan, Japan

Patentee after: Koha Co., Ltd.

Address before: Aichi

Co-patentee before: Koha Co., Ltd.

Patentee before: Toyoda Gosei Co., Ltd.

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090211

Termination date: 20180331

CF01 Termination of patent right due to non-payment of annual fee