CN100380577C - 电荷控制部件 - Google Patents

电荷控制部件 Download PDF

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Publication number
CN100380577C
CN100380577C CNB038199386A CN03819938A CN100380577C CN 100380577 C CN100380577 C CN 100380577C CN B038199386 A CNB038199386 A CN B038199386A CN 03819938 A CN03819938 A CN 03819938A CN 100380577 C CN100380577 C CN 100380577C
Authority
CN
China
Prior art keywords
polyamide
electric charge
charge control
control assembly
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB038199386A
Other languages
English (en)
Chinese (zh)
Other versions
CN1679139A (zh
Inventor
西畑直光
多田正人
小松勇一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kureha Corp
Original Assignee
Kureha Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kureha Corp filed Critical Kureha Corp
Publication of CN1679139A publication Critical patent/CN1679139A/zh
Application granted granted Critical
Publication of CN100380577C publication Critical patent/CN100380577C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/003—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/12—Polyester-amides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Packaging Frangible Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
CNB038199386A 2002-09-02 2003-09-02 电荷控制部件 Expired - Fee Related CN100380577C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002257051 2002-09-02
JP257051/2002 2002-09-02

Publications (2)

Publication Number Publication Date
CN1679139A CN1679139A (zh) 2005-10-05
CN100380577C true CN100380577C (zh) 2008-04-09

Family

ID=31972974

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB038199386A Expired - Fee Related CN100380577C (zh) 2002-09-02 2003-09-02 电荷控制部件

Country Status (6)

Country Link
JP (1) JP4540478B2 (fr)
KR (1) KR100716701B1 (fr)
CN (1) CN100380577C (fr)
AU (1) AU2003263593A1 (fr)
TW (1) TWI291439B (fr)
WO (1) WO2004023532A2 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4971654B2 (ja) * 2005-04-21 2012-07-11 株式会社クレハ 基板用カセット
JP2006342345A (ja) * 2005-05-13 2006-12-21 Kureha Corp 制電性樹脂組成物
KR101353157B1 (ko) * 2010-12-28 2014-01-22 도쿄엘렉트론가부시키가이샤 정전 척
CN103662454B (zh) * 2013-11-27 2015-09-30 深圳市华星光电技术有限公司 基板盒
KR101802863B1 (ko) * 2016-12-06 2017-11-29 양락주 마스크 카세트
CN108001843A (zh) * 2017-12-06 2018-05-08 宣城杰爱新材料科技有限公司 一种复合砂浆保温板用安放架

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6268030B1 (en) * 1997-04-04 2001-07-31 Teijin Limited Silicon wafer carrier
US6344513B1 (en) * 1999-02-26 2002-02-05 Teijin Limited Resin composition and jig for use in transportation
US6348540B1 (en) * 1998-04-22 2002-02-19 Idemitsu Petrochemical Co., Ltd. Styrenic resin composition and semiconductor carrier device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2556119B2 (ja) * 1988-08-16 1996-11-20 東レ株式会社 制電性樹脂組成物およびその製造方法
JP3419964B2 (ja) * 1995-06-27 2003-06-23 日本ポリペンコ株式会社 帯電防止性モノマ−キャストナイロン成形品
JP2000044778A (ja) * 1998-08-03 2000-02-15 Teijin Ltd 樹脂組成物およびそれからなる転倒検知スイッチ用部品
EP1179564A4 (fr) * 1998-11-05 2005-03-09 Kureha Chemical Ind Co Ltd Composition de resine antistatique
JP3942326B2 (ja) * 1999-04-22 2007-07-11 株式会社クレハ 熱可塑性樹脂組成物
JP5060004B2 (ja) * 2000-10-05 2012-10-31 東レ株式会社 車両用外装部品およびその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6268030B1 (en) * 1997-04-04 2001-07-31 Teijin Limited Silicon wafer carrier
US6348540B1 (en) * 1998-04-22 2002-02-19 Idemitsu Petrochemical Co., Ltd. Styrenic resin composition and semiconductor carrier device
US6344513B1 (en) * 1999-02-26 2002-02-05 Teijin Limited Resin composition and jig for use in transportation

Also Published As

Publication number Publication date
AU2003263593A1 (en) 2004-03-29
TWI291439B (en) 2007-12-21
JP2005537378A (ja) 2005-12-08
WO2004023532A3 (fr) 2004-10-21
WO2004023532A2 (fr) 2004-03-18
CN1679139A (zh) 2005-10-05
KR100716701B1 (ko) 2007-05-14
KR20050042796A (ko) 2005-05-10
TW200407252A (en) 2004-05-16
JP4540478B2 (ja) 2010-09-08

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20080409

Termination date: 20120902