AU2003263593A1 - Charge control members - Google Patents

Charge control members

Info

Publication number
AU2003263593A1
AU2003263593A1 AU2003263593A AU2003263593A AU2003263593A1 AU 2003263593 A1 AU2003263593 A1 AU 2003263593A1 AU 2003263593 A AU2003263593 A AU 2003263593A AU 2003263593 A AU2003263593 A AU 2003263593A AU 2003263593 A1 AU2003263593 A1 AU 2003263593A1
Authority
AU
Australia
Prior art keywords
charge control
control members
members
charge
control
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003263593A
Inventor
Yuuichi Komatsu
Naomitsu Nishihata
Masahito Tada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kureha Corp
Original Assignee
Kureha Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kureha Corp filed Critical Kureha Corp
Publication of AU2003263593A1 publication Critical patent/AU2003263593A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/003—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/12—Polyester-amides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
AU2003263593A 2002-09-02 2003-09-02 Charge control members Abandoned AU2003263593A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPNO.2002-257051 2002-09-02
JP2002257051 2002-09-02
PCT/JP2003/011208 WO2004023532A2 (en) 2002-09-02 2003-09-02 Charge control members

Publications (1)

Publication Number Publication Date
AU2003263593A1 true AU2003263593A1 (en) 2004-03-29

Family

ID=31972974

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003263593A Abandoned AU2003263593A1 (en) 2002-09-02 2003-09-02 Charge control members

Country Status (6)

Country Link
JP (1) JP4540478B2 (en)
KR (1) KR100716701B1 (en)
CN (1) CN100380577C (en)
AU (1) AU2003263593A1 (en)
TW (1) TWI291439B (en)
WO (1) WO2004023532A2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4971654B2 (en) * 2005-04-21 2012-07-11 株式会社クレハ PCB cassette
JP2006342345A (en) * 2005-05-13 2006-12-21 Kureha Corp Antistatic resin composition
KR101353157B1 (en) * 2010-12-28 2014-01-22 도쿄엘렉트론가부시키가이샤 Electrostatic chuck
CN103662454B (en) * 2013-11-27 2015-09-30 深圳市华星光电技术有限公司 Substrate box
KR101802863B1 (en) * 2016-12-06 2017-11-29 양락주 Mask cassette
CN108001843A (en) * 2017-12-06 2018-05-08 宣城杰爱新材料科技有限公司 A kind of composite mortar thermal insulation board dispenser

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2556119B2 (en) * 1988-08-16 1996-11-20 東レ株式会社 Antistatic resin composition and method for producing the same
JP3419964B2 (en) * 1995-06-27 2003-06-23 日本ポリペンコ株式会社 Antistatic monomer-cast nylon molded product
EP0915506B1 (en) * 1997-04-04 2009-12-16 Teijin Limited Silicon wafer carrier
JPH11302481A (en) * 1998-04-22 1999-11-02 Idemitsu Petrochem Co Ltd Styrenic resin composition and semiconductor conveyor jig
JP2000044778A (en) * 1998-08-03 2000-02-15 Teijin Ltd Resin composition and component for upset-detecting switch made of the same
CN1189516C (en) * 1998-11-05 2005-02-16 吴羽化学工业株式会社 Antistatic resin composition
JP2000248186A (en) * 1999-02-26 2000-09-12 Teijin Ltd Resin composition and jig for transporting electronic part made of it
JP3942326B2 (en) * 1999-04-22 2007-07-11 株式会社クレハ Thermoplastic resin composition
JP5060004B2 (en) * 2000-10-05 2012-10-31 東レ株式会社 Exterior parts for vehicles and manufacturing method thereof

Also Published As

Publication number Publication date
CN100380577C (en) 2008-04-09
TWI291439B (en) 2007-12-21
KR100716701B1 (en) 2007-05-14
JP4540478B2 (en) 2010-09-08
WO2004023532A2 (en) 2004-03-18
KR20050042796A (en) 2005-05-10
WO2004023532A3 (en) 2004-10-21
JP2005537378A (en) 2005-12-08
TW200407252A (en) 2004-05-16
CN1679139A (en) 2005-10-05

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase