WO2004023532A3 - Charge control members - Google Patents

Charge control members Download PDF

Info

Publication number
WO2004023532A3
WO2004023532A3 PCT/JP2003/011208 JP0311208W WO2004023532A3 WO 2004023532 A3 WO2004023532 A3 WO 2004023532A3 JP 0311208 W JP0311208 W JP 0311208W WO 2004023532 A3 WO2004023532 A3 WO 2004023532A3
Authority
WO
WIPO (PCT)
Prior art keywords
charge control
weight
parts
polyamide resin
control members
Prior art date
Application number
PCT/JP2003/011208
Other languages
French (fr)
Other versions
WO2004023532A2 (en
Inventor
Naomitsu Nishihata
Masahito Tada
Yuuichi Komatsu
Original Assignee
Kureha Chemical Ind Co Ltd
Naomitsu Nishihata
Masahito Tada
Yuuichi Komatsu
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kureha Chemical Ind Co Ltd, Naomitsu Nishihata, Masahito Tada, Yuuichi Komatsu filed Critical Kureha Chemical Ind Co Ltd
Priority to AU2003263593A priority Critical patent/AU2003263593A1/en
Priority to JP2004534137A priority patent/JP4540478B2/en
Publication of WO2004023532A2 publication Critical patent/WO2004023532A2/en
Publication of WO2004023532A3 publication Critical patent/WO2004023532A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/003—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/12—Polyester-amides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Packaging Frangible Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention provides a charge control member, wherein at least a part of a substantial body or surface layer thereof is formed of a polyamide resin composition comprising 100 parts by weight of a polyamide resin, and 4 to 95 parts by weight of at least one polymer type antistatic agent selected from the group consisting of a polyether ester amide, and a graft copolymer obtained by graft polymerization of an ethylenic unsaturated monomer onto a rubber-like backbone polymer having an alkylene oxide group.
PCT/JP2003/011208 2002-09-02 2003-09-02 Charge control members WO2004023532A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU2003263593A AU2003263593A1 (en) 2002-09-02 2003-09-02 Charge control members
JP2004534137A JP4540478B2 (en) 2002-09-02 2003-09-02 Charge control member

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPNO.2002-257051 2002-09-02
JP2002257051 2002-09-02

Publications (2)

Publication Number Publication Date
WO2004023532A2 WO2004023532A2 (en) 2004-03-18
WO2004023532A3 true WO2004023532A3 (en) 2004-10-21

Family

ID=31972974

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2003/011208 WO2004023532A2 (en) 2002-09-02 2003-09-02 Charge control members

Country Status (6)

Country Link
JP (1) JP4540478B2 (en)
KR (1) KR100716701B1 (en)
CN (1) CN100380577C (en)
AU (1) AU2003263593A1 (en)
TW (1) TWI291439B (en)
WO (1) WO2004023532A2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4971654B2 (en) * 2005-04-21 2012-07-11 株式会社クレハ PCB cassette
JP2006342345A (en) * 2005-05-13 2006-12-21 Kureha Corp Antistatic resin composition
KR101353157B1 (en) * 2010-12-28 2014-01-22 도쿄엘렉트론가부시키가이샤 Electrostatic chuck
CN103662454B (en) * 2013-11-27 2015-09-30 深圳市华星光电技术有限公司 Substrate box
KR101802863B1 (en) * 2016-12-06 2017-11-29 양락주 Mask cassette
CN108001843A (en) * 2017-12-06 2018-05-08 宣城杰爱新材料科技有限公司 A kind of composite mortar thermal insulation board dispenser

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0915506A1 (en) * 1997-04-04 1999-05-12 Teijin Limited Silicon wafer carrier
US6344513B1 (en) * 1999-02-26 2002-02-05 Teijin Limited Resin composition and jig for use in transportation
US6348540B1 (en) * 1998-04-22 2002-02-19 Idemitsu Petrochemical Co., Ltd. Styrenic resin composition and semiconductor carrier device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2556119B2 (en) * 1988-08-16 1996-11-20 東レ株式会社 Antistatic resin composition and method for producing the same
JP3419964B2 (en) * 1995-06-27 2003-06-23 日本ポリペンコ株式会社 Antistatic monomer-cast nylon molded product
JP2000044778A (en) * 1998-08-03 2000-02-15 Teijin Ltd Resin composition and component for upset-detecting switch made of the same
WO2000027917A1 (en) * 1998-11-05 2000-05-18 Kureha Kagaku Kogyo Kabushiki Kaisha Antistatic resin composition
JP3942326B2 (en) * 1999-04-22 2007-07-11 株式会社クレハ Thermoplastic resin composition
JP5060004B2 (en) * 2000-10-05 2012-10-31 東レ株式会社 Exterior parts for vehicles and manufacturing method thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0915506A1 (en) * 1997-04-04 1999-05-12 Teijin Limited Silicon wafer carrier
US6348540B1 (en) * 1998-04-22 2002-02-19 Idemitsu Petrochemical Co., Ltd. Styrenic resin composition and semiconductor carrier device
US6344513B1 (en) * 1999-02-26 2002-02-05 Teijin Limited Resin composition and jig for use in transportation

Also Published As

Publication number Publication date
WO2004023532A2 (en) 2004-03-18
CN1679139A (en) 2005-10-05
AU2003263593A1 (en) 2004-03-29
TWI291439B (en) 2007-12-21
JP2005537378A (en) 2005-12-08
JP4540478B2 (en) 2010-09-08
KR20050042796A (en) 2005-05-10
CN100380577C (en) 2008-04-09
TW200407252A (en) 2004-05-16
KR100716701B1 (en) 2007-05-14

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