TWI291439B - Charge controlling members - Google Patents

Charge controlling members Download PDF

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Publication number
TWI291439B
TWI291439B TW092124083A TW92124083A TWI291439B TW I291439 B TWI291439 B TW I291439B TW 092124083 A TW092124083 A TW 092124083A TW 92124083 A TW92124083 A TW 92124083A TW I291439 B TWI291439 B TW I291439B
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charge control
substrate
control member
polyamine
weight
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TW092124083A
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Chinese (zh)
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TW200407252A (en
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Naomitsu Nishihata
Masahito Tada
Yuuichi Komatsu
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Kureha Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/003—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/12—Polyester-amides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Packaging Frangible Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)

Abstract

Provided is a charge controlling member. At least one part of its body or surface layer is formed by a polyamide resin composition comprising, based on 100 parts by weight of the polyamide resin, 4 to 95 parts by weight of polymeric antistatic agent which is at least one selected from the group consisting of a polyetheresteramide and a graft copolymer obtained by graft-copolymerizing an ethylenic unsaturated monomer with a rubber-like trunk polymer having an alkylene oxide group.

Description

1291439 玖、發明說明： (一） 發明所屬之技術領域： 本發明係關於電荷控制構件’更詳細來說，係關於有用 作爲用於收藏電子零件封裝基板等之薄板狀之各種基板之 基板用卡匣等之電荷控制構件。 本發明之基板用卡匣係特別適合作爲用來收藏電子封 裝技術領域中之液晶顯示用玻璃基板、電漿顯示器用玻璃 基板、熱頭用玻璃基板、薄膜電子發光體顯示裝置用玻璃 基板、感應器用玻璃基板、光磁碟用玻璃基板、太陽電池 用玻璃基板等玻璃基板之卡匣。 本發明中’所旨胃電何控制構件（Charge Controlling Members)，係表示具有屬於半導電性範圍之表面電阻率， 加上其本身顯示抗靜電性，可顯示電荷控制機能之構件之 意思。所謂電荷控制機能係表示可控制與電荷控制構件表 面接觸之其他物品帶電量（靜電或電荷量）之機能之意思。 屬於半導電性範圍之表面電阻率係以1.0 X 1〇6〜1.0 X 1〇ι4 Ω/□之範圍內爲佳。表面電阻率之單位，雖然一般以ω表 示，但有以Ω /□表示之情況。即，表面電阻率係與沿著試 驗片表面流動之電流平行方向之電位斜率除以平均表面單 位電流之數値。該數値等於以各邊lcm正方形之相對邊爲 電極之2個電極間之表面電阻。其中，迄今以Ω /□表示表 面電阻率之單位，本發明中亦以Ω/□表示表面電阻率之單 位。 (二） 先前技術： 電子封裝技術中，驅動膜技術與微小連接技術，並配置 1291439 •連接半導體或機能元件、迴路元件等於配線基板上，與 其他構成元件組合在一起，而構成所希望之電子迴路。基 板方面’可使用例如玻璃基板、陶瓷基板、聚砂氧基板、 複合基板（例如，樹脂/陶瓷基板、樹脂/聚矽氧基板）、金屬 基座·金屬磁芯基板（絕緣層爲玻璃或聚亞胺等）等之薄板 狀基板。 該等基板本身、形成導體圖案之基板、組裝有薄膜電晶 體等筒機能兀件之基板（例如，液晶顯示用玻璃基板）等之 各種基板’於封裝基板或電子迴路元件之製造步驟等之 中，爲了搬運、保管、組合操作等，多數片收集在一起並 收藏於一個基板用卡匣來處理。 於基板用卡匣中，要求具有各基板可取出、入而不會互 相接觸，而且，可分離並支撐•收藏各基板之構造。因此， 基板用卡匣一般係由箱型框體所形成，該框體之一對對向 之側面上具有配置具溝槽側板之構造。各基板係收藏於該 等側板之對應溝槽間。具溝槽側板之形狀方面，一般爲從 側板之背板部分突出多數個唇狀擱板片之形狀者。相鄰之 擱板片間空隙爲溝槽，收藏基板於其中。該等構造之基板 用卡匣係揭示於例如特開平6-2868 1 2號公報、特開平6-247483號公報、特開平5-147680號公報、特開平9-36219 號公報等。 針對基板用卡匣之具體實例，參照第1圖及第2圖同時 說明。第1圖係基板用卡匣之一例之正面圖。該基板用卡 匣係由底面側框1、上面側框2、側板3,3、個別設置於該 等側板之唇狀擱板4,4、及接收側框5,5所構成。相鄰之唇 1291439 狀擱板間爲溝槽，收藏基板A於其中。 第2圖中，顯示上述基板用卡匣之斜視圖。於第2圖中 所示之基板用卡匣中，於箱型框體之一對側面上，雖然個 別配置3個具溝槽側板3,3，但該個數可針對基板大小等來 適宜地變更。底面側框丨及上面側框2，形成格子狀或其 他形狀均可。 該等構造之基板用卡匣一般雖由聚合物材料、金屬材料 或組合該等材料之複合材料（例如，金屬內插嵌或外插嵌構 件）所形成’但是在多數情況下，係藉由聚合物材料或至少 表面爲聚合物材料構成之構件所形成。在前述各構件由聚 合物材料所形成之情況下，一般係藉由熔融成形（代表來說 爲射出成形）來製作聚合物材料，接著，組合成箱型框體。 於該等構造之基板用卡匣中收藏基板，則基板與基板用 卡匣之具溝槽側板等之各構件接觸。在構成基板用卡匣之 各構件爲具有帶電性或導電性者之情況下，或者在因與基 板之接觸•脫離致使基板帶電大之類型材料所形成構成基 板用卡匣之各構件之情況下，基板受到該等構件之各種不 良影響。 較具體來說，以已形成薄膜電晶體之玻璃基板爲例，來 說明上述問題。在收藏已形成薄膜電晶體之玻璃基板於基 板用卡匣中之情況下，與該玻璃基板接觸之構件爲具有極 高表面電阻率之絕緣體，則一方面由於在該構件表面所帶 電之靜電損傷玻璃基板之迴路，一方面由於靜電而吸附浮 游在空中之塵埃於玻璃基板上。另外，與玻璃基板接觸之 構件之表面電阻率過低，則在玻璃基板接觸於該構件之情 1291439 況下，已感應帶電、漏電或帶電之玻璃基板會激烈地放電 而損壞迴路。 爲了解決上述問題，已知有調整與基板用卡匣之基板接 觸之構件表面電阻率於適度範圍內之方法。具體來說，提 案使用已植入抗靜電劑或電阻小之塡充材料於各種聚合物 材料之樹脂組成物，來形成構成基板用卡匣之構件之方 法。藉由該等方法，如果調整構件表面電阻率於106〜1014 Ω /□之範圍內，則可解決上述問題。 然而，在使用含有抗靜電劑之樹脂組成物來形成構件之 方法中，對於長時間之抗靜電則不充分。存在於構成基板 用卡匣之構件表面之抗靜電劑，係因水洗、摩擦等而被除 去，則在早期失去抗靜電效果。爲了持續抗靜電效果而增 大抗靜電劑之配合量，抗靜電劑容易移動至構件表面，則 由於流動於構件表面之抗靜電劑，加上灰塵或塵埃附著而 污染基板，因抗靜電劑溶出及揮發而污染周圍環境。 使用含有電阻小之塡料料之樹脂組成物所形成之基板 用卡匣方面，提案熔融成形於樹脂成分中含有金屬纖維與 鬚晶狀導電性材料之樹脂組成物而成之基板用卡匣（特開 平5- 1 47680號公報）、使用成形樹脂成分中含有金屬纖維、 金屬粒子、碳纖維、碳充塡物、石墨等導電性物質之樹脂 組成物而成之構件之基板用卡匣（特開平9-3 62 1 9號公報） 等。 然而，在使用該等導電性塡料料之情況下，導電性塡料 料與樹脂之電阻率相差甚大，由樹脂成分與導電性塡料料^ 所構成之樹脂組成物之電阻率，即使在導電性塡料料含胃 1291439 量稍微之變化亦激烈地變化。特別地，在對於基板用卡匣 所要求之1〇6〜1〇14Ω/□表面電阻率之範圍內，表面電阻率 之變動激烈。而且，成形該樹脂組成物而成之成形物表面 電阻率係隨位置而不均勻性大。因而，由於使用含有樹脂 成分與導電性塡料料之樹脂組成物，安定成形具有1 06〜1 Ο Μ Ω /□範圍內之所希望之表面電阻率之構件則極爲困難。 又，由於隨構件位置之表面電阻率不均勻性大，製造在任 何位置亦顯示非常固定之抗靜電性或表面電阻率之基板用 卡匣則有困難。 再者，即使調整與基板用卡匣之基板接觸之構件表面電 阻率在106〜1014Ω/□之範圍內，例如一方面由於玻璃基板 爲絕緣體而與基板用卡匣接觸，一方面在從基板用卡匣脫 離時，玻璃基板本身帶電，而會使形成於玻璃基板上之迴 路破損。 (三）發明內容： 本發明之目的在於提供有用作爲用來收藏電子元件封 裝基板等薄板狀之各種基板之基板用卡匣等之電荷控制構 件。 特別地，本發明之目的在於提供具有適度表面電阻率與 安定之抗靜電性、即使收藏已形成迴路之玻璃基板等，而 該基板帶電亦不會損壞迴路之基板用卡匣。 又，本發明之目的在於使用熔融流動性、成形性、灰塵 防止性、機械特性優異，極少不純物滲出於表面之聚合物 材料來提供具有該等優異特性之基板用卡匣等之電荷控制 構件。 1291439 本發明者等爲了達成前述目的所專心一志硏究之結 果，發現使用於聚醯胺樹脂中配合有特定之高分子型抗靜 電劑之聚醯胺樹脂組成物，來成形本身或該表面層至少一 部分之構件，爲抗靜電性優異，可控制與其接觸之物品帶 電量。 特別地，藉由以該聚醯胺樹脂組成物來成形至少與基板 用卡匣接觸之位置，可得到如前述之各種特性優異之基板 用卡匣。本發明之基板用卡匣係由於至少與基板接觸之位 置爲使用含有高分子型抗靜電劑之聚醯胺樹脂組成物所形 成，其本身不帶電。 又，本發明中所使用之聚醯胺樹脂組成物係熔融流動 性、成形性、灰塵防止性、機械強度優異，該成形物不會 污染基板表面。因此，本發明之基板用卡匣等之電荷控制 構件係可保護基板等之物品避免靜電，保持未附著塵埃之 適當淸潔度，同時防止基板等物品之激烈放電。 本發明之基板用卡匣可顯著抑制爲絕緣體之玻璃基板 之帶電。其理由在現階段來說雖然不淸楚，推論因帶電列 中之位置關係近之物質間摩擦係不是因爲帶電量變得較 小。即，推論由於構成本發明基板用卡匣主成分之聚醯胺 樹脂之帶電列，與玻璃基板之帶電列較近，一方面玻璃基 板與該基板用卡匣接觸，一方面在從基板用卡匣脫離玻璃 基板時，於玻璃基板所產生之帶電量。 本發明係基於該等之硏究知識而完成者。 因此，根據本發明，提供以藉由本身或至少該表面層之 一部分，以相對於100重量份（A)聚醯胺樹脂，含有4〜95 1291439 重量份比例之選自包含（B1)聚醚酯醯胺、及於具有環氧烷 基之橡膠狀骨架聚合物接枝聚合乙烯系不飽和單體之（B 2) 共聚物之群組至少一種之（B)高分子型抗靜電劑之聚醯胺 樹脂組成物所形成爲特徵之電荷控制構件。 本發明之電荷控制構件方面，至少與基板接觸之位置爲 藉由聚醯胺樹脂組成物所形成之基板用卡匣爲典型者。本 發明之電荷控制構件係活用其特性，亦有用作爲基板用卡 匣以外之其他電荷控制構件。1291439 发明 发明 发明 发明 发明 291 291 291 291 291 291 291 291 291 291 291 291 291 291 291 291 291 291 电荷 电荷 电荷 电荷 电荷 电荷 电荷 电荷 电荷 电荷 电荷 电荷 电荷 电荷 电荷 电荷 电荷 电荷 电荷 电荷 电荷 电荷 电荷 电荷 电荷 电荷 电荷Charge control components such as 匣. The cassette for a substrate of the present invention is particularly suitable as a glass substrate for liquid crystal display, a glass substrate for a plasma display, a glass substrate for a thermal head, a glass substrate for a thin film electronic light-emitting device, and a sensor for use in the field of electronic packaging technology. A glass substrate such as a glass substrate for a device, a glass substrate for a magneto-optical disk, or a glass substrate for a solar cell. In the present invention, the "Charge Controlling Members" means a surface resistivity which is in the range of semiconductivity, and means that it exhibits an antistatic property and can exhibit a charge control function. The so-called charge control function means the function of controlling the charge amount (electrostatic or charge amount) of other articles in contact with the surface of the charge control member. The surface resistivity in the semiconducting range is preferably in the range of 1.0 X 1 〇 6 to 1.0 X 1 〇 ι 4 Ω / □. The unit of surface resistivity, although generally expressed as ω, is represented by Ω / □. That is, the surface resistivity is the potential slope in the direction parallel to the current flowing along the surface of the test piece divided by the number of average surface unit currents. The number 値 is equal to the surface resistance between the two electrodes of the electrode with the opposite side of the square of each side of 1 cm. Here, the unit of surface resistivity is represented by Ω / □ so far, and the unit of surface resistivity is also expressed by Ω/□ in the present invention. (2) Prior technology: In the electronic packaging technology, the driving film technology and the micro-connection technology, and the configuration 1291439 • the connection of semiconductor or functional components, the circuit components are equal to the wiring substrate, combined with other constituent elements to form the desired electron Loop. For the substrate, for example, a glass substrate, a ceramic substrate, a polysilicate plate, a composite substrate (for example, a resin/ceramic substrate, a resin/polyoxyl plate), a metal base, and a metal core substrate (the insulating layer is glass or poly) can be used. A thin plate-like substrate such as an imine or the like. The substrate itself, the substrate on which the conductor pattern is formed, and the substrate on which a substrate such as a thin film transistor (for example, a glass substrate for liquid crystal display) is assembled, in the manufacturing steps of the package substrate or the electronic circuit element, and the like For handling, storage, combination operations, etc., most of the sheets are collected and stored in a substrate with a cassette. In the substrate cassette, it is required to have a structure in which the respective substrates can be taken out and not in contact with each other, and the respective substrates can be separated and supported. Therefore, the substrate cassette is generally formed of a box-shaped frame having a structure in which a grooved side plate is disposed on the opposite side surface of the frame. Each of the substrates is housed between corresponding grooves of the side plates. In terms of the shape of the grooved side plate, it is generally a shape in which a plurality of lip-shaped shelf sheets are protruded from the back plate portion of the side plate. The gap between the adjacent shelf sheets is a groove in which the substrate is housed. For example, Japanese Laid-Open Patent Publication No. Hei. A specific example of the substrate cassette is described with reference to Figs. 1 and 2 together. Fig. 1 is a front view showing an example of a cassette for a substrate. The substrate cassette is composed of a bottom side frame 1, an upper side frame 2, side plates 3, 3, and lip-shaped shelves 4, 4 and receiving side frames 5, 5 which are individually provided to the side plates. Adjacent lips 1291439 The space between the shelves is a groove in which the substrate A is stored. In the second drawing, a perspective view of the above-mentioned substrate cartridge is shown. In the substrate cassette shown in Fig. 2, three grooved side plates 3, 3 are individually disposed on one side of the box-shaped casing, but the number may be appropriately set for the substrate size or the like. change. The bottom side frame 丨 and the upper side frame 2 may be formed in a lattice shape or in other shapes. The cassettes for the substrates of these configurations are generally formed of a polymer material, a metal material or a composite material (for example, a metal insert or an insert insert member) of the materials, but in most cases, The polymeric material or at least the surface is formed of a member of a polymeric material. In the case where each of the above members is formed of a polymer material, a polymer material is generally produced by melt molding (representatively, injection molding), and then combined into a box-shaped frame. When the substrate is housed in the substrate cassette of the above-described structure, the substrate is in contact with each member such as the grooved side plate of the substrate. In the case where each member constituting the substrate cassette is electrically conductive or electrically conductive, or in the case of forming a substrate-type cassette by contact with the substrate or by a type of material that causes the substrate to be charged to be large. The substrate is subjected to various adverse effects of the members. More specifically, the above problem is explained by taking a glass substrate on which a thin film transistor has been formed as an example. In the case where the glass substrate on which the thin film transistor has been formed is collected in the substrate cassette, the member in contact with the glass substrate is an insulator having an extremely high surface resistivity, on the one hand, electrostatic damage on the surface of the member. The circuit of the glass substrate absorbs dust floating in the air on the glass substrate due to static electricity. Further, when the surface resistivity of the member in contact with the glass substrate is too low, in the case where the glass substrate is in contact with the member, the glass substrate which has been inductively charged, leaked or charged is severely discharged to damage the circuit. In order to solve the above problems, there has been known a method of adjusting the surface resistivity of a member that is in contact with the substrate of the substrate cassette in an appropriate range. Specifically, a method of forming a member for forming a substrate jam by using a resin composition in which an antistatic agent or a small electric resistance is implanted in various polymer materials is used as a proposal. By these methods, if the surface resistivity of the adjusting member is in the range of 106 to 1014 Ω / □, the above problem can be solved. However, in the method of forming a member using a resin composition containing an antistatic agent, it is insufficient for antistatic for a long period of time. The antistatic agent which is present on the surface of the member constituting the substrate jam is removed by water washing, rubbing, or the like, and the antistatic effect is lost at an early stage. In order to increase the antistatic effect and increase the amount of the antistatic agent, the antistatic agent is easily moved to the surface of the member, and the substrate is contaminated by the antistatic agent flowing on the surface of the member, and dust or dust adheres to it, and the antistatic agent is dissolved. And volatilize and pollute the surrounding environment. In the case of a substrate for forming a resin composition comprising a resin composition having a small electric resistance, it is proposed to melt-mold a substrate for a resin composition containing a resin composition of a metal fiber and a whisker-like conductive material in a resin component ( Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. 9-3 62 1 9 bulletin) and so on. However, in the case of using such a conductive cerium material, the electrical resistivity of the conductive cerium material and the resin differ greatly, and the resistivity of the resin composition composed of the resin component and the conductive cerium material, even in The conductive bismuth material contained a slight change in the amount of stomach 1291439 and also drastically changed. In particular, the surface resistivity fluctuates drastically within the range of the surface resistivity of 1 〇 6 to 1 〇 14 Ω / □ required for the substrate cassette. Further, the surface resistivity of the molded article obtained by molding the resin composition is large with positional unevenness. Therefore, it is extremely difficult to stably form a member having a desired surface resistivity in the range of 6,000 to 1 Ο Ω Ω / □ by using a resin composition containing a resin component and a conductive cerium material. Further, since the surface resistivity unevenness at the position of the member is large, it is difficult to manufacture a substrate jam which exhibits a very fixed antistatic property or surface resistivity at any position. Further, even if the surface resistivity of the member that is in contact with the substrate for the substrate cassette is adjusted to be in the range of 106 to 1014 Ω/□, for example, the glass substrate is in contact with the substrate with the substrate, and the substrate is used for the substrate. When the cassette is detached, the glass substrate itself is charged, and the circuit formed on the glass substrate is broken. (3) SUMMARY OF THE INVENTION The object of the present invention is to provide a charge control member for use as a substrate cassette or the like for collecting various substrates in a thin plate shape such as an electronic component package substrate. In particular, it is an object of the present invention to provide a substrate cassette which has an appropriate surface resistivity and stability of antistatic property, and which does not damage the circuit even if a glass substrate or the like which has been formed into a circuit is collected. Further, an object of the present invention is to provide a charge control member such as a substrate cartridge having such excellent properties, which is excellent in melt fluidity, moldability, dust prevention property, and mechanical property, and which has little impurity permeating the surface. 1291439 The inventors of the present invention have found that a polyamine resin composition containing a specific polymer type antistatic agent in a polyamide resin is used to form itself or the surface layer, in order to achieve the above-mentioned purpose. At least a part of the components are excellent in antistatic property and can control the amount of charge of the articles in contact therewith. In particular, by forming a position at least in contact with the substrate cassette by the polyimide resin composition, a substrate holder having various characteristics as described above can be obtained. The substrate for a substrate of the present invention is formed by using a polyimide resin composition containing a polymer type antistatic agent at least in contact with the substrate, and is itself uncharged. Further, the polyamide resin composition used in the present invention is excellent in melt fluidity, moldability, dust prevention property, and mechanical strength, and the molded article does not contaminate the surface of the substrate. Therefore, the charge control member such as the substrate for the substrate of the present invention can protect the substrate or the like from static electricity, maintain proper dustiness of unattached dust, and prevent intense discharge of articles such as substrates. The cassette for a substrate of the present invention can remarkably suppress charging of a glass substrate which is an insulator. The reason for this is that at this stage, although it is not unreasonable, it is inferred that the friction between substances due to the positional relationship in the electrified column is not because the charge amount becomes smaller. In other words, it is inferred that the electrification column of the polyamide resin constituting the main component of the substrate for the substrate of the present invention is closer to the electrification row of the glass substrate, and the glass substrate is in contact with the substrate by the cassette, and the card is used for the substrate. The amount of charge generated on the glass substrate when the glass substrate is removed from the glass substrate. The present invention has been completed based on such research knowledge. Therefore, according to the present invention, it is provided that, by itself or at least a part of the surface layer, it is selected from the group consisting of (B1) polyethers in an amount of 4 to 95 1291439 parts by weight relative to 100 parts by weight of the (A) polyamide resin. (B) Polymeric antistatic agent polymerization of at least one group of ester amides and (B 2 ) copolymers of rubber-like skeleton polymer graft-polymerized ethylenically unsaturated monomers having an alkylene oxide group The guanamine resin composition is formed into a characteristic charge control member. In the charge control member of the present invention, at least the position in contact with the substrate is a substrate jam formed by a polyimide resin composition. The charge control member of the present invention utilizes its characteristics and is also useful as a charge control member other than the substrate cartridge.

(四）實施方式： 實施發明之最佳形態 1 .聚醯胺樹脂 於本發明所使用之聚醯胺方面，舉例有環狀內醯胺之開 環聚合物、胺基羧酸之聚縮合物、二元酸與二胺之聚縮合 物等。(4) Embodiments: The best mode for carrying out the invention 1. Polyamine resin In the case of the polyamine used in the present invention, a ring-opening polymer of a cyclic indoleamine and a polycondensate of an aminocarboxylic acid are exemplified. , a polycondensate of a dibasic acid and a diamine, and the like.

聚醯胺樹脂之具體實例方面，可舉出有聚醯胺6、聚醯 胺66、聚醯胺610、聚醯胺612、聚醯胺11、聚醯胺12、 聚醯胺46等之脂肪族聚醯胺樹脂；聚醯胺MXD6(聚間二甲 苯己二醯胺）、聚醯胺6T(聚六亞甲基對苯二甲基醯胺）、聚 醯胺61(聚六亞甲基異苯二甲基醯胺）' 聚醯胺41(聚四亞甲 基異苯二甲基醯胺）、聚醯胺6T/66(六亞甲基二胺/己二酸/ 對苯二甲酸共聚物）、聚醯胺6Τ/6Ι (六亞甲基二胺/異苯二 甲酸/對苯二甲酸共聚物）、聚醯胺6Τ/6Ι/66 (六亞甲基二胺 /己二酸/異苯二甲酸/對苯二甲酸共聚物）、聚醯胺6Τ/Μ-5丁 (六亞甲基二胺/甲基戊二胺/對苯二甲酸共聚物）、聚醯胺 6Τ/6 (己內醯胺/六亞甲基二胺/對苯二甲酸共聚物）等脂肪 -12- Ϊ291439 族-芳香族聚醯胺樹脂；及該等2種以上之混合物。 2·1分子型抗靜雷劑 本發明中係使用至少一種選自由（Β 1)聚醚酯醯胺、及接 枝聚合乙烯系不飽和單體於具有環氧烷基之橡膠狀骨架聚 合物之（Β2)接枝共聚物所組成族群之高分子型抗靜電劑。 (1)聚醚酯醯胺：Specific examples of the polyamide resin include fats such as polyamide 6, polyamine 66, polyamide 610, polyamide 612, polyamine 11, polyamide 12, and polyamine 46. Polyamide amine resin; polyamido MXD6 (poly-m-xylylene adipamide), polyamido 6T (polyhexamethylene terephthalamide), polyamine 61 (polyhexamethylene) Isophthalic acid amide) Polyamide 41 (polytetramethylene isophthalamide), polyamine 6T/66 (hexamethylenediamine / adipic acid / terephthalic acid Copolymer), polyamine 6Τ/6Ι (hexamethylenediamine/isophthalic acid/terephthalic acid copolymer), polyamine 6Τ/6Ι/66 (hexamethylenediamine/adipic acid) /isophthalic acid/terephthalic acid copolymer), polyamine 6Τ/Μ-5 butyl (hexamethylenediamine/methylpentanediamine/terephthalic acid copolymer), polyamine 6Τ/ 6 (caprolactam / hexamethylenediamine / terephthalic acid copolymer) fat -12- Ϊ 291439 family-aromatic polyamide resin; and a mixture of these two or more. 2-1 Molecular Anti-Static Detergent Agent In the present invention, at least one rubber-based skeleton polymer selected from (Β 1) polyether ester decylamine and graft polymerized ethylenically unsaturated monomer having an alkylene oxide group is used. (Β2) a polymeric antistatic agent of a group consisting of graft copolymers. (1) Polyetheresteramine:

所謂本發明中所使甩之聚醚酯醯胺，係於兩末端具有羧 基之聚醯胺成分與聚羥基鏈烯二醇等之聚醚成分與酯鍵結 在一起之聚合物。聚醚成分方面，舉出有聚羥基鏈烯二醇、 聚羥基鏈烯二醇與雙酚類之環氧烷加成物之組合等。於兩 末端具有羧基之聚醯胺成分方面，舉出有內醯胺開環聚合 物、胺基羧酸之聚縮合物、二羧酸與二胺之聚縮合物等。The polyether ester decylamine which is used in the present invention is a polymer in which a polyether component having a carboxyl group at both terminals and a polyether component such as polyhydroxyalkenyl glycol are bonded to an ester. Examples of the polyether component include a combination of a polyhydroxyalkylene glycol, a polyhydroxyalkylene glycol, and an alkylene oxide adduct of a bisphenol. Examples of the polyamine component having a carboxyl group at both terminals include a decylamine ring-opening polymer, a polycondensate of an aminocarboxylic acid, a polycondensate of a dicarboxylic acid and a diamine, and the like.

聚醚酯醯胺之製造方法並無特別之限制，可利用公認之 方法。舉例有醯胺形成性單體與二羧酸反應而形成於兩末 端具有羧基之聚醯胺，並於其中加入雙酚類之環氧乙烷加 成物’於高溫、減壓下進行聚合反應之方法。聚醚酯醯胺 方面’可使用市售品，其具體實例方面，舉出有三洋化成 公司製之商品名「貝雷斯達特NC6321」、阿特開姆公司製 之商品名「赫巴克斯401 1」等。 (2)橡膠狀骨架聚合物之接枝共聚物： 構成本發明中所使用之接枝共聚物之較佳橡膠狀骨架 聚合物，係共聚合50〜95重量份至少一種選自由共軛二烯 及丙烯酸酯所組成族群之單體與5〜50重量％至少一種選自 具有4〜5 00個環氧烷基與乙烯系不飽和鍵之單體（以下稱爲 「聚環氧烷系單體」）、及〇〜50重量份至少一種（較佳〇〜40 -13- 1291439 重量％)必要時可與前述單體共聚合之乙烯系不飽和單體而 成之橡膠狀共聚物。 橡膠狀骨架聚合物係以選自包含共軛二烯及丙烯酸酯 之群組至少一種之單體爲主成分。共軛二烯方面係使用 1，3 -丁二烯、異戊二烯、氯化戊二烯、1，3 -戊二烯等。丙烯 酸酯方面係使用丙烯酸乙酯、丙烯酸丙酯、丙烯酸丁酯、 丙烯酸己醋、丙烯酸辛酯、丙嫌酸壬酯等。 接枝聚合於橡膠狀骨架聚合物之乙烯系不飽和單體方 面，可舉出有甲基丙烯酸甲酯、甲基丙烯酸丁酯、甲基丙 烯酸丙酯等之甲基丙烯酸烷基酯；苯乙烯、2-甲基苯乙烯、 3 -甲基苯乙烯、α-甲基苯乙烯等之乙烯基芳香族化合物； 乙酸乙烯酯、氯乙烯、丙烯腈等其他乙嫌基單體等。 接枝共聚物係可藉由在50〜90重量％、而以55〜85重量％ 爲佳之橡膠狀骨架聚合物存在下，接枝聚合10〜50重量％、 而以15〜45重量％爲佳之乙烯系不飽和單體而得。接枝聚合 法並無特定之限制，通常採用乳化聚合法。 3.塡料 在本發明所使用之聚醯胺樹脂組成物中，隨所希望，以 機械強度或耐熱性等之提升爲目的，可配合各種塡料。塡 料方面舉例有玻璃纖維、碳纖維、石綿纖維、二氧化矽纖 維、氧化鋁纖維、鉻纖維、氮化硼纖維、氮化矽纖維、硼 纖維、鈦酸鉀纖維等之無機纖維狀物；不銹鋼、鋁、鈦、 鋼、黃銅等之金屬纖維狀物；由聚醯胺樹脂、氟樹脂、聚 酯樹脂、丙烯酸樹脂等所形成之高熔點有機質纖維狀物質 等之纖維狀補強材料。 -14- 1291439 又，塡料方面，可舉例有雲母、二氧化矽、滑石粉、氧 化鋁、高嶺土、硫酸鉀、碳酸鉀、氧化鈦、亞鐵酸鹽、黏 土、玻璃粉、氧化鋅、碳酸鎳、氧化鐡、石英粉末、碳酸 鎂、硫酸鋇等粒狀或粉末狀塡料。 在控制基板用卡匣等之電荷控制構件之表面電阻率於 較佳範圍內方面，則希望使用非導電性之塡料。在該等塡 料中，亦補強基板用卡匣，而且，在控制該表面電阻率於 較佳範圍內方面，以使用玻璃纖維作爲纖維狀補強材料爲 佳。 該等塡料料係可個別單獨地使用，或可組合2種以上來 使用。於必要時，塡料亦可藉由集束劑或表面處理劑來處 理。集束劑或表面處理劑方面，舉例有環氧系化合物、異 氰酸酯系化合物、聚砂氧系化合物、鈦酸鹽系化合物等之 官能性化合物。該等化合物係由於對於塡料料預先實施表 面處理或集束處理來使用，或亦可在樹脂組成物調製時之 同時來添加。 4.其他添加劑The method for producing the polyether ester decylamine is not particularly limited, and a well-established method can be utilized. For example, a mercapto-forming monomer is reacted with a dicarboxylic acid to form a polyamine having a carboxyl group at both terminals, and an ethylene oxide adduct of a bisphenol is added thereto to carry out polymerization at a high temperature and under reduced pressure. The method. A commercially available product can be used for the term "polyether ester decylamine", and specific examples thereof include the product name "Béresdat NC6321" manufactured by Sanyo Chemical Co., Ltd., and the product name "Hbaks" manufactured by Atchem Co., Ltd. 401 1" and so on. (2) Graft copolymer of a rubbery skeleton polymer: a preferred rubbery skeleton polymer constituting the graft copolymer used in the present invention, which is copolymerized in an amount of 50 to 95 parts by weight, at least one selected from the group consisting of conjugated dienes And a monomer of the group consisting of acrylates and 5 to 50% by weight of at least one monomer selected from the group consisting of 4 to 500 epoxyalkyl groups and ethylenically unsaturated bonds (hereinafter referred to as "polyalkylene oxide monomer" And 橡胶~50 parts by weight of at least one (preferably 4040 - 13 - 1291439% by weight) of a rubbery copolymer obtained by copolymerizing an ethylene-based unsaturated monomer with the above-mentioned monomer. The rubber-like skeleton polymer is mainly composed of a monomer selected from at least one group consisting of a conjugated diene and an acrylate. As the conjugated diene, 1,3 -butadiene, isoprene, pentadiene chloride, 1,3-pentadiene or the like is used. As the acrylate, ethyl acrylate, propyl acrylate, butyl acrylate, hexyl acrylate, octyl acrylate, propyl decanoate or the like is used. Examples of the ethylene-based unsaturated monomer graft-polymerized to the rubber-based skeleton polymer include alkyl methacrylates such as methyl methacrylate, butyl methacrylate and propyl methacrylate; and styrene; a vinyl aromatic compound such as 2-methylstyrene, 3-methylstyrene or α-methylstyrene; or another ethylenic monomer such as vinyl acetate, vinyl chloride or acrylonitrile. The graft copolymer may be graft polymerized in an amount of from 50 to 90% by weight and preferably from 55 to 85% by weight, preferably from 10 to 50% by weight, and preferably from 15 to 45% by weight. Ethylene-based unsaturated monomer derived. The graft polymerization method is not particularly limited, and an emulsion polymerization method is usually employed. 3. Dipping material In the polyamine resin composition used in the present invention, various kinds of tanning materials can be blended for the purpose of improving mechanical strength or heat resistance as desired. Examples of the materials include inorganic fibers such as glass fiber, carbon fiber, asbestos fiber, cerium oxide fiber, alumina fiber, chrome fiber, boron nitride fiber, tantalum nitride fiber, boron fiber, and potassium titanate fiber; A metal fibrous material such as aluminum, titanium, steel or brass; a fibrous reinforcing material such as a high melting point organic fibrous material formed of a polyamide resin, a fluororesin, a polyester resin or an acrylic resin. -14- 1291439 In addition, examples of the tanning materials include mica, cerium oxide, talc, alumina, kaolin, potassium sulfate, potassium carbonate, titanium oxide, ferrous carbonate, clay, glass powder, zinc oxide, and carbonic acid. Granular or powdered materials such as nickel, cerium oxide, quartz powder, magnesium carbonate, barium sulfate. In the case where the surface resistivity of the charge control member such as the substrate for the control substrate is within a preferable range, it is desirable to use a non-conductive material. In the materials, the substrate is also used for reinforcing the substrate, and in order to control the surface resistivity within a preferred range, it is preferable to use glass fibers as the fibrous reinforcing material. These mash materials may be used individually or in combination of two or more. The dip can also be treated by a sizing agent or a surface treatment agent as necessary. Examples of the sizing agent or the surface treatment agent include functional compounds such as an epoxy compound, an isocyanate compound, a polyoxa compound, and a titanate compound. These compounds are used by previously performing surface treatment or bundling treatment for the tantalum material, or may be added simultaneously with the preparation of the resin composition. 4. Other additives

於本發明中所使用之聚醯胺樹脂組成物中，前述以外之 其他之添加劑方面，可適宜添加例如如含有環氧基之α -鏈 烯共聚物之耐衝擊性改質材料、如乙烯縮水甘油基甲基丙 燒酸酯之樹脂改良劑、季戊四醇四硬脂酸酯之滑劑、難燃 劑、染料或顏料等之著色劑等。 5·聚醯胺樹脂細成物 本發明中’係使用相對於（Α)1 00重量份聚醯胺樹脂而 S ’（Β)4〜95重量份的高分子型抗靜電劑，此高分子型抗靜 -15- 1291439 電劑係至少一種選自由（Βυ聚醚酯醯胺以及（B2)乙烯系不 飽和單體接枝於具有環氧烷基之橡膠狀骨架聚合物所成之 接枝共聚物所組成族群。 聚醯胺樹脂之配合比例過小則機械強度降低，同時流動 性變差，射出成形性及押出成形性變得不足。聚醯胺樹脂 之配合比例過大，則抗靜電性降低。高分子型抗靜電劑之 配合比例係相對於100重量份聚醯胺樹脂，爲4〜95重量 份，而以5〜90重量份爲佳，以6〜80重量份爲較佳。 高分子型抗靜電劑之配合比例過小，則抗靜電性降低。φ 高分子型抗靜電劑之配合比例過大，則機械強度降低，同 時流動性變差，射出成形性及押出成形性變不足。於高分 子型抗靜電劑之中，接枝共聚物配合量過大，則加諸於成 形加工性降低，聚醯胺樹脂組成物之彈性率亦變得過低。 在高分子型抗靜電劑爲聚醚酯烯胺之情況下，相對於 1 00重量份聚醯胺樹脂之配合比例爲4〜5 0重量份、而以 5〜4 5重量份爲佳，在許多情況下，亦可到具有所希望範圍In the polyamine resin composition used in the present invention, other additives than the above may be suitably added, for example, an impact-resistant modified material such as an epoxy-containing α-olefin copolymer, such as ethylene shrinkage. A resin modifier of glyceryl methylpropionate, a slip agent of pentaerythritol tetrastearate, a flame retardant, a coloring agent such as a dye or a pigment, and the like. 5·Polyuramine resin fine product In the present invention, a polymer type antistatic agent is used in an amount of 4 to 95 parts by weight based on 100 parts by weight of the polyamide resin and S '(Β). Type anti-static -15-1291439 electric agent is at least one selected from the group consisting of (polyether ester decylamine and (B2) ethylenically unsaturated monomer grafted to a rubbery skeleton polymer having an alkylene oxide group When the blending ratio of the polyamide resin is too small, the mechanical strength is lowered, and the fluidity is deteriorated, and the injection moldability and the extrusion moldability are insufficient. When the blending ratio of the polyamide resin is too large, the antistatic property is lowered. The blending ratio of the polymer type antistatic agent is 4 to 95 parts by weight based on 100 parts by weight of the polyamide resin, and preferably 5 to 90 parts by weight, preferably 6 to 80 parts by weight. When the blending ratio of the antistatic agent is too small, the antistatic property is lowered. When the blending ratio of the polymer antistatic agent is too large, the mechanical strength is lowered, the fluidity is deteriorated, and the injection moldability and the extrusion moldability are insufficient. Molecular antistatic agent, grafted When the amount of the polymer blended is too large, the moldability is lowered, and the elastic modulus of the polyamide resin composition is also too low. In the case where the polymer type antistatic agent is a polyether ester enamine, it is relative to 1 The blending ratio of 00 parts by weight of the polyamide resin is 4 to 50 parts by weight, preferably 5 to 45 parts by weight, and in many cases, may have a desired range.

內之表面電阻率之電荷控制構件。在高分子型抗靜電劑爲 接枝聚合乙烯系不飽和單體於具有環氧烷基之橡膠狀骨架 聚合物之接枝共聚物之情況下，在得到具有所希望範圍內 之表面電阻率之電荷控制構件方面，則希望相對於丨00重 量份聚醯胺樹脂之配合比例以4 5〜9 5重量份爲佳，而以 5 0〜9 0重量份爲較佳。 在配合玻璃纖維等之纖維狀補強材料之情況下，該配合 量係相對於1 00重量份聚醯胺樹脂，以80重量份以下爲 佳，以50〜70重量份爲較佳，以10〜60重量份爲特佳。纖 -16- 1291439 維狀補強材料之配合比例過小，則不能因添加而得到補強 效果，過大則恐怕一方面抗靜電性降低，一方面降低構件 表面之平滑性。 本發明之聚醯胺樹脂組成物係可藉由一般於合成樹脂 組成物之調製中所使甩之設備與方法來調製。例如，使用 漢歇爾混合機、桶混機等混合機來預先混合各原料成分， 必要時添加玻璃纖維等之塡料或添加劑並進一步混合之 後，使用單軸或雙軸押出機來捏合，由口模熔融押出而可 成爲成形用顆粒。由於使用全部成分之一部分來製作母 料，亦可採用混合所得之母料與剩餘成分之方法。又，爲 了提高各成分之分散性，亦可粉碎所使用原料之一部分、 篩選粒徑之後混合、熔融押出。 6.電荷鸪制構件 本發明之電荷控制構件係以聚醯胺樹脂組成物所形成 之本身或該表面層之表面電阻率在以1.0X106〜1.〇χΐ〇ΐ4Ω/ □爲佳、以 1.0Χ107 〜1·0Χ1014Ω/□爲較佳、以 l.OxiQ^i.oA charge control member for surface resistivity. In the case where the polymer type antistatic agent is a graft copolymerized ethylenically unsaturated monomer in a graft copolymer of a rubbery matrix polymer having an alkylene oxide group, a surface resistivity having a desired range is obtained. In the charge control member, it is preferred that the mixing ratio of the 00 parts by weight of the polyamide resin is preferably 4 5 to 95 parts by weight, and preferably 50 to 90 parts by weight. In the case of blending a fibrous reinforcing material such as glass fiber, the compounding amount is preferably 80 parts by weight or less, more preferably 50 to 70 parts by weight, based on 100 parts by weight of the polyamide resin. 60 parts by weight is particularly preferred. If the blending ratio of the fiber-16- 1291439 dimensional reinforcing material is too small, it cannot be reinforced by the addition. If it is too large, the antistatic property may be lowered on the one hand, and the smoothness of the surface of the member may be lowered on the other hand. The polyamine resin composition of the present invention can be prepared by an apparatus and method which is generally used in the preparation of a synthetic resin composition. For example, a mixing machine such as a Hanschel mixer or a tank mixer is used to premix each raw material component, and if necessary, a material or an additive such as glass fiber is added and further mixed, and then kneaded using a uniaxial or biaxial extruder. The die is melted and extruded to form pellets for molding. Since a part of all the ingredients is used to prepare the master batch, a method of mixing the obtained master batch and remaining components may also be employed. Further, in order to improve the dispersibility of each component, it is also possible to pulverize a part of the raw materials used, select the particle size, and then mix and melt and extrude. 6. Charge Twisting Member The charge controlling member of the present invention is formed by the polyamidamide resin composition itself or the surface layer has a surface resistivity of 1.0 X 106 〜1. 〇χΐ〇ΐ 4 Ω / □, preferably 1.0. Χ107 ～1·0Χ1014Ω/□ is preferred, with l.OxiQ^io

X 1〇14Ω /□爲更佳之範圍內。表面電阻率之上限係以0.5 X 1〇14Ω /□爲佳。 電荷控制構件之表面電阻率過低，則在例如電荷控制構 件爲基板用卡匣之情況下，於基板用卡匣與基板接觸時， 恐怕會發生基板之激烈放電。該表面電阻率過高，則基板 用卡匣等之電荷控制構件變得容易帶電，保護基板等之物 品避免靜電、保持不附著塵埃之適切淸潔度則變得困難。 又，表面電阻率過高則抗靜電性降低，限制了在要求抗靜 電性領域之使用。再者，表面電阻率過高則難以控制所接 -17- 1291439 觸之其他物品之帶電量。 本發明之電荷控制構件係希望爲具有於23 °C溫度、50% 相對濕度之條件下，摩擦以聚醯胺樹脂組成物所形成之本 身或其表面層與基板之後，以表面電位計測定之玻璃基板 表面電位以150V以下爲佳，以100V以下爲較佳，以80V 以下爲特佳之電荷控制機能者。 又，本發明之電荷控制構件係使用靜電衰減計（STATIC DECAY METER)，依照 MIL-B- 8 1 705 C 所測定之從 5000V 至 50V之靜電衰減時間 （static decay time)，並希望以5秒鐘 以下爲佳，以3秒鐘以下爲較佳，以2秒鐘爲特佳。 本發明之電荷控制構件係以基板用卡匣爲佳，以基板用 卡匣至少與基板接觸之位置爲以聚醯胺樹脂組成物所形成 者爲佳。 本發明之基板用卡匣並無限定於特定構造者，係由箱型 框體所形成者，在該框體之一對相對之側面上係具有配置 具溝槽之側板構造者爲佳。如前述，該等基板用卡匣之具 體實例係具有如示於第1圖及第2圖之構造者。 典型之基板用卡匣係由底側面框1、上面側框2、側板 3,3、個別設置於該等側板之唇狀之擱板4,4及接受側框5,5 所構成。唇狀擱板係以由側板之背板面所定之間隙平行地 設置成多數片突起。鄰接之唇狀擱板間爲溝槽，於其中收 藏基板A。具溝槽之側板形狀或大小係因所希望可變成各 種形狀或大小。該等各構件係通常藉由射出成形來製造， 然後，組合成箱型框體。各構件亦可由熱可塑性樹脂組成 物所形成，或者亦可爲金屬內嵌或外嵌品。 -18- 1291439 該等構造之基板用卡匣雖全部材料可由聚_胺樹脂組 成物所形成，但必要時，僅接觸基板之構件由聚醯胺樹脂 組成物所形成亦可。與基板接觸之構件方面，例如有具溝 槽側板3,3、接受框5，5等。具溝槽側板3,3係側板本身與 唇狀擱板亦可由聚醯胺樹脂組成物一體成形，或者亦可組 合個別所形成者成一體。 側板本身係亦可以金屬製成骨架、藉由在其周圍上內嵌 或外嵌成形聚醯胺樹脂組成物來複合化者。接受框5，5係1 個亦可、2個以上亦可。接受框爲平板狀亦可，或與具溝 槽側板同樣地，爲設置有唇狀擱板者亦可。 本發明之基板用卡匣構造係於前述者以外，在該技術領 域中，廣泛包含使用作爲用來收藏電子元件封裝基板等薄 板狀之各種基板之基板用卡匣者。 收藏於本發明之基板用卡匣之基板方面，可舉出有玻璃 基板、陶瓷基板、聚矽氧基板、複合基板（例如，樹脂/陶X 1 〇 14 Ω / □ is a better range. The upper limit of the surface resistivity is preferably 0.5 X 1 〇 14 Ω / □. When the surface resistivity of the charge control member is too low, for example, when the charge control member is a substrate chuck, when the substrate cassette is brought into contact with the substrate, a severe discharge of the substrate may occur. When the surface resistivity is too high, the charge control member such as a substrate is easily charged, and it is difficult to protect the substrate or the like from static electricity and to maintain the proper cleanness of the dust. Further, when the surface resistivity is too high, the antistatic property is lowered, which limits the use in the field of antistatic properties. Furthermore, if the surface resistivity is too high, it is difficult to control the amount of charge of other items touched by the -17-1291439. The charge control member of the present invention is desirably a glass having a surface potentiometer after being rubbed with a polyimide resin composition itself or a surface layer thereof and a substrate at a temperature of 23 ° C and a relative humidity of 50%. The surface potential of the substrate is preferably 150 V or less, preferably 100 V or less, and 80 V or less is a particularly preferable charge control function. Further, the charge control member of the present invention uses a static decay meter (STATIC DECAY METER), which has a static decay time of from 5000 V to 50 V measured in accordance with MIL-B-8 1 705 C, and is desirably 5 seconds. Below the clock is better, preferably less than 3 seconds, especially 2 seconds. The charge control member of the present invention is preferably a substrate cassette, and it is preferred that the substrate cassette is at least in contact with the substrate at a position of a polyamide resin composition. The card holder for a substrate of the present invention is not limited to a specific structure, and is formed by a box-shaped frame. It is preferable that one of the frames has a side plate structure in which a groove is disposed on the opposite side surface. As described above, the specific examples of the substrate jams have the structures shown in Figs. 1 and 2. A typical substrate cassette is composed of a bottom side frame 1, an upper side frame 2, side plates 3, 3, and lip-shaped shelves 4, 4 and receiving side frames 5, 5 which are individually provided to the side plates. The lip shelf is arranged in parallel as a plurality of projections in a gap defined by the back panel surface of the side panel. The adjacent lip-shaped shelves are grooves in which the substrate A is housed. The shape or size of the grooved side panels can be varied into various shapes or sizes as desired. These members are usually manufactured by injection molding and then combined into a box-shaped frame. Each member may also be formed of a thermoplastic resin composition, or may be a metal inlay or an insert. -18- 1291439 All the materials for the substrate for these structures may be formed of a poly-amine resin composition, but if necessary, only the member contacting the substrate may be formed of a polyamide resin composition. The members in contact with the substrate include, for example, grooved side plates 3, 3, receiving frames 5, 5, and the like. The grooved side panels 3, the 3 series side panels themselves and the lip panels may also be integrally formed from a polyamide resin composition, or may be integrated into a single body. The side panels themselves may also be made of a metal skeleton, which is compounded by embedding or embedding a polyamide resin composition on its periphery. Accepting frame 5, 5 is one, and two or more are acceptable. The receiving frame may be a flat plate shape, or may be a lip-shaped shelf as in the case of the grooved side plate. The card cassette structure of the present invention is not limited to the above, and in this technical field, a substrate holder for use as a substrate for collecting various types of thin plates such as an electronic component package substrate is widely used. The substrate to be used for the substrate for use in the substrate of the present invention includes a glass substrate, a ceramic substrate, a polyoxyl oxylate plate, and a composite substrate (for example, a resin/ceramic).

瓷基板、樹脂/聚砂氧基板）、金屬基座·金屬磁芯基板（絕 緣層爲玻璃或聚亞胺等）等之薄板狀基板。該等基板之用途 方面，可舉出有電子封裝技術領域中之液晶顯示用玻璃基 板' 電漿顯示用玻璃基板、熱頭用玻璃基板、LSI封裝用陶 瓷基板、高溢流1C用陶瓷基板等。 本發明之基板用卡匣係由於可顯著地控制玻璃基板之 帶電量，而以作爲收藏液晶顯示用玻璃基板、電漿顯示用 玻璃基板、熱頭用玻璃基板、薄膜電子發光顯示裝置用玻 璃基板、感應器用玻璃基板、光磁裝置用玻璃基板、太陽 電池用玻璃基板等之玻璃基板之卡匣爲特佳。 -19- 1291439 本發明之電荷控制構件係除了基板用卡匣之外’有用作 爲如下述之各種構件。 (1)電氣電子構件： 搬運箱、晶圓船、晶圓載具、晶圓盒、1C晶片盤、1C 晶片載具、1C輸送管、1C卡、錄音帶及唱片包裝、裝置用 盒、保存用盤、保存用箱、輸送容器、磁卡讀取器、電腦 外殼、數據機外殼、監視器外殻、CR-ROM、DVD外殻、印 表機外殼、連接器、硬碟載具、MR頭載具與盤、GMR頭載 具與盤、HSA載具與盤、HGA載具與盤、中空線圈馬達用 材料、液晶面板載具。 (2) 事務機器/電腦： 印刷電路板卡匣、接地卜申、紙張牽引機、油壺罐、色 帶卡匣、引導針、盤、輥、齒輪、鏈輪、皮帶、容器、帶 電輕、複製_、顯像輥、除電輕、帶電帶、複製帶、顯像 帶、除電帶、畫面形成裝置裝之其他〇 A機器元件、紙及 紙鈔輸送元件、送紙滑軌。 (3) 電訊電子：A thin plate-shaped substrate such as a porcelain substrate, a resin/polysilicate plate, a metal base or a metal core substrate (an insulating layer is glass or polyimide). For the use of the substrate, there are a glass substrate for liquid crystal display in the field of electronic packaging technology, a glass substrate for plasma display, a glass substrate for a thermal head, a ceramic substrate for LSI packaging, a ceramic substrate for high overflow 1C, and the like. . The substrate for a substrate of the present invention can be used as a glass substrate for liquid crystal display, a glass substrate for plasma display, a glass substrate for a thermal head, or a glass substrate for a thin film electronic light-emitting display device, because the charge amount of the glass substrate can be significantly controlled. It is particularly preferable that the glass substrate such as a glass substrate for an inductor, a glass substrate for a magneto-optical device, or a glass substrate for a solar cell is used. -19- 1291439 The charge control member of the present invention is used as a member as described below except for the substrate for the cassette. (1) Electrical and electronic components: totes, wafer carriers, wafer carriers, wafer cassettes, 1C wafer trays, 1C wafer carriers, 1C transport tubes, 1C cards, audio tapes and record tapes, device boxes, storage trays , storage box, transport container, magnetic card reader, computer case, data machine case, monitor case, CR-ROM, DVD case, printer case, connector, hard disk carrier, MR head carrier And discs, GMR head carriers and discs, HSA carriers and discs, HGA carriers and discs, materials for hollow coil motors, and liquid crystal panel carriers. (2) Transaction machine/computer: printed circuit board card, grounding, paper tractor, oil can, ribbon cassette, guide needle, plate, roller, gear, sprocket, belt, container, charged light, Copy _, developing roller, light-removing light, charging belt, copying tape, developing tape, static strip, other machine components installed in the screen forming device, paper and banknote transporting components, paper feed slides. (3) Telecommunications Electronics:

行動電話元件、呼叫器、區域行動電話元件。 H (4) 化學及其它加工： 搬運箱、盒、盤、耐磨材、抗靜電元件、裝置容器、墊 子、醫藥裝置、試驗裝置、電線及電纜被覆材、電線支撐 體、電波吸收體、床材、地毯、防蟲板、壁材、鞋底、^ 音/影帶、刷子、送風扇、面狀發熱體、多重開關7 —、 (5)汽車構件： 燃料線連接器、 電子電氣外殻、氣油桶蓋、燃料過濃、器 -20- 1291439 燃料線夾、燃料桶、機器盤座、門把、燃料線、內裝材。 【實例】 以下舉出實例與比較例，針對本發明來較具體地說明， 但本發明係不受該等實例之限制者。物性之測定方法係如 以下之說明。 U)表面電阻率： 在試樣之表面電阻率爲1 X 1 Ο6 Ω /□以上之情況下，係遵 照JIS K-6911，使用定電壓器（菊水公司製300-1A型）、電 流計（凱斯勒公司製6 1 6型）、及試樣元件（橫河•修雷特 巴卡得公司製1 608A型），以施加電壓100V測定。在試樣 之表面電阻率未滿1 X 1〇6Ω /□之情況下，遵照；ns K-7194， 使用三菱化學公司製羅雷斯特-HP來測定。 (2) 玻璃基板之帶電量； 於2 3 °C溫度、5 0 %相度濕度之條件下，以表面電位計 (Model 3 44、特雷克日本公司製）測定試樣與玻璃基板摩擦 後之玻璃基板之表面電位。 (3) 靜電•衰減時間（static decay time): 使用 ETS 公司製 STATIC DECAY METER-406C、依照 MIL-B-8 1 705 C，測定從5000V至50V之靜電衰減時間。 [合成例Π接枝共聚_物_,.之_盖_选JI. 於裝置有攬拌機、溫度計、壓力計之耐壓反應容器中， 置入23重量份1，3-丁二烯、30重量份丙烯酸丁酯、12重 量份甲氧基聚乙二醇甲基丙烯酸酯、〇·〇16重量份二異丙基 苯羥基過氧化物、0.006重量份甲醛化次硫酸鈉、0.001 5重 量份乙二胺四乙酸鐵（III)鹽、0.2重量份焦磷酸鈉、2.0重 -21 - 1291439 4份油酸鉀、及200重量份去離子水，於60°C攪拌10小時。 聚合後’以99 %產率得到80nm平均粒徑之橡膠狀骨架聚合 物。 於65重量份固體成分之上述橡膠狀骨架聚合物之乳膠 中’添加35重量份甲基丙烯酸甲酯、〇.3重量份正辛基硫 酉享、0.018重量份二異丙基苯羥基過氧化物、〇.007重量份 甲醒化次硫酸鈉、1 ·〇重量份油酸鉀、及50重量份去離子 水作爲乙烯系不飽和單體混合物，於氮氣置換後，於60<t 攪拌1 0小時來接枝共聚合。取出所得之乳膠，添加2〇〇重 量份0 · 7重量％濃度之鹽酸水溶液來析出接枝共聚物。水洗 •脫水後，得到4 3重量％含水率之粉末狀接枝共聚物。藉 由氣流式瞬間乾燥機於1 〇〇。(：熱風溫度之條件下使其乾 燥’以97 %產率得到白色粉末之接枝共聚物。使用漢歇爾 混合機來乾式混合99重量份所得之接枝共聚物與1重量份 陰離子系界面活性劑’並使用作爲高分子型抗靜電劑。 【實例1〜6、比較例1〜6】 以漢歇爾混合機均勻地乾式混合示於表1之各成分之 後，供給於45mm 0之雙軸捏合押出機（池貝鐵工所公司製 PCM-45)，進行熔融押出而得到顆粒。乾燥所得之顆粒後， 藉由射出成形機（東芝機械公司製IS-75)，製成物性測定 用之平板。結果示於表1。 -22- 1291439 比較例 1 曾 扁 1 1 〇 ▼—Η m (N 1 1 5.0E+11 0.14 450 1 1 着 1 〇 f-H 1 m (N 1 1 8.0E+10 <0.01 280 寸 1 1 1 〇 τ-Η 1 1 cn (Μ ! 1 5.0E+11 r-H 330 m 1 1 〇 1 1 載 cn (N 1 蠢 7.0E+11 0.05 370 <N o t—H 1 1 1 ! 1 1 1 雇 cn cn 1.0E+03 <0.01 240 r-H o r-H 1 1 1 1 1 1 1 (N 1 1.0E+15 >60 1200 實施例 1 ο t-Η 1 1 1 1 cn m 1 m m 1 8.0E+10 0.04 1 ο l—H » 1 着 1 寸 1 〇\ (N 1 9.0E+11 iT) 〇 m 寸 O 1 1 1 1 1 1 等 1 8.0E+12 as oo o r-H 1 1 1 K 瞧 m m 1 m m 1 4.0E+10 <0.01 (N o T—t 1 1 1 1 1 寸 1 ON <N 1 6.0E+11 寸· o (N i—H o T-H 1 1 1 1 1 卜 1 1 2.0E+13 00 (N (Al)聚醯胺46 (A2)聚酞醯胺 聚碳酸酯 聚對苯二甲酸乙二醇酯 聚對苯二甲酸丁二醇酯 聚苯硫醚 (Bl)聚醚酯醯胺 (B2)接枝共聚物 (Cl)玻璃纖維 (C2)碳纖維 表面電阻率Ω/〇 靜電®減時間(秒） 玻璃基板之表面電位(V)Mobile phone components, pagers, regional mobile phone components. H (4) Chemical and other processing: Totes, boxes, trays, wear-resistant materials, antistatic components, device containers, mats, medical devices, test devices, wire and cable coverings, wire supports, radio wave absorbers, beds Materials, carpets, insect-proof panels, wall materials, soles, ^ sound/video tapes, brushes, blowers, planar heating elements, multiple switches 7 —, (5) Automotive components: fuel line connectors, electrical and electronic enclosures, Gas oil drum cover, fuel over-concentration, -20- 1291439 fuel line clamp, fuel barrel, machine disc holder, door handle, fuel line, interior material. EXAMPLES Examples and comparative examples are given below to more specifically the present invention, but the present invention is not limited by the examples. The method of measuring physical properties is as follows. U) Surface resistivity: When the surface resistivity of the sample is 1 X 1 Ο6 Ω /□ or more, a constant voltage device (Model 300-1A, manufactured by Kikusui Co., Ltd.) and an ammeter are used in accordance with JIS K-6911. Kessler Co., Ltd. Model 6 1 6), and sample components (Model 1 608A manufactured by Yokogawa / Schattert Baccarat Co., Ltd.) were measured at an applied voltage of 100V. In the case where the surface resistivity of the sample is less than 1 X 1 〇 6 Ω / □, it is measured in accordance with NR K-7194 using Lorester-HP manufactured by Mitsubishi Chemical Corporation. (2) The amount of charge of the glass substrate; after the sample is rubbed against the glass substrate by a surface potentiometer (Model 3 44, manufactured by Terex Japan) at a temperature of 23 ° C and a humidity of 50%. The surface potential of the glass substrate. (3) Static decay time: The static decay time from 5000V to 50V was measured using STATIC DECAY METER-406C manufactured by ETS Corporation and MIL-B-8 1 705 C. [Synthesis Example: Graft Copolymerization_Materials_.._盖_选 JI. In a pressure-resistant reaction vessel equipped with a mixer, a thermometer, and a pressure gauge, 23 parts by weight of 1,3-butadiene, 30 parts by weight of butyl acrylate, 12 parts by weight of methoxy polyethylene glycol methacrylate, 〇·〇 16 parts by weight of diisopropyl phenyl hydroxy peroxide, 0.006 parts by weight of sodium formaldehyde sulfoxylate, 0.001 5 weight Part of iron (III) ethylenediaminetetraacetate, 0.2 parts by weight of sodium pyrophosphate, 2.0 weight of -21,291,439 parts of potassium oleate, and 200 parts by weight of deionized water were stirred at 60 ° C for 10 hours. After the polymerization, a rubbery skeleton polymer having an average particle diameter of 80 nm was obtained in a yield of 99%. Adding 35 parts by weight of methyl methacrylate, 3.3 parts by weight of n-octyl thioxanthene, 0.018 parts by weight of diisopropylbenzene hydroxyperoxidation in 65 parts by weight of the solid latex of the rubbery skeleton polymer 007.007 parts by weight of sodium sulfonate sodium sulfonate, 1 · hydrazine part by weight of potassium oleate, and 50 parts by weight of deionized water as a mixture of ethylenically unsaturated monomers, after nitrogen replacement, stirring at 60 < t Graft copolymerization was carried out for 0 hours. The obtained latex was taken out, and a graft weight copolymer was precipitated by adding 2 parts by weight of a 0.7% by weight aqueous hydrochloric acid solution. Water washing • After dehydration, a powdery graft copolymer having a water content of 43% by weight was obtained. The airflow type instant dryer is used for 1 〇〇. (: drying under hot air temperature conditions to obtain a white powder graft copolymer in 97% yield. Using a Hanschel mixer to dry mix 99 parts by weight of the obtained graft copolymer with 1 part by weight of an anionic interface The active agent was used as a polymer type antistatic agent. [Examples 1 to 6 and Comparative Examples 1 to 6] The components of Table 1 were uniformly dry-mixed by a Hanschel mixer, and supplied to a pair of 45 mm 0 The shaft kneading extruder (PCM-45, manufactured by Chiba Iron Works Co., Ltd.) was melted and extruded to obtain pellets, and the obtained pellets were dried, and then molded into a physical property by an injection molding machine (IS-75, manufactured by Toshiba Machine Co., Ltd.). The results are shown in Table 1. -22- 1291439 Comparative Example 1 Zeng Bian 1 1 〇▼—Η m (N 1 1 5.0E+11 0.14 450 1 1 with 1 〇fH 1 m (N 1 1 8.0E+10 <0.01 280 inch 1 1 1 〇τ-Η 1 1 cn (Μ ! 1 5.0E+11 rH 330 m 1 1 〇1 1 cn (N 1 stupid 7.0E+11 0.05 370 <N ot-H 1 1 1 ! 1 1 1 Employment cn cn 1.0E+03 <0.01 240 rH o rH 1 1 1 1 1 1 1 (N 1 1.0E+15 > 60 1200 Example 1 ο t-Η 1 1 1 1 cn m 1 mm 1 8.0E+10 0.04 1 ο l—H » 1 with 1 inch 1 〇\ (N 1 9.0E+11 iT) 〇m inch O 1 1 1 1 1 1 etc 1 8.0E+12 as oo o rH 1 1 1 K 瞧mm 1 mm 1 4.0E+10 <0.01 (N o T-t 1 1 1 1 1 inch 1 ON <N 1 6.0E+11 inch·o (N i-H o TH 1 1 1 1 1 Bu 1 1 2.0E+13 00 (N (Al) Polyamide 46 (A2) Polyamide Polycarbonate Polyethylene terephthalate Polybutylene terephthalate Polyphenylene sulfide (Bl) polyether ester decylamine (B2) graft copolymer (Cl) glass fiber (C2) carbon fiber surface resistivity Ω / 〇 static charge / minus time (seconds) surface potential of the glass substrate (V)

-23- 1291439 (備註） (1 ) 聚醯胺46 : DSM ]SR恩普拉股份有限公司製，商品 名「 Stanyl TS300」； (2 ) 聚酞醯胺：聚醯胺6T/6I/66，阿默克公司製，商品 名〃阿默迪爾」； (3 ) 聚碳酸酯：二菱氣體化學公司製，商品名「優必隆 S - 2 0 0 0」； (4 ) 聚對苯二甲酸乙二醇酯：三井化學股份有限公司 製，商品名「S A 1 3 5」； (5 ) 聚對苯二甲酸丁二醇酯：聚合塑膠製，商品名「求 拉捏克2002」； (6 ) 聚苯硫醚：吳羽化學工業股份有限公司製，商品名 「福特隆KPS W-214」； (7 ) 聚醚酯醯胺··三洋化成工業股份有限公司製，商品 名「貝雷斯塔特NC6321」； (8 ) 玻璃纖維：旭纖維玻璃製，商品名「FT6 89」； (9 ) 碳纖維：東邦縲縈公司製之PAN系碳纖維，商品名 「貝斯伐伊特HTA3000」。 如由表1之結果所得知，使用以特定配合比例所配合之 高分子型抗靜電劑於聚醯胺樹脂中之樹脂組成物（實例丨~ 6) 則顯示 1.0X106 〜1·0Χ1014Ω/□、而以 1·0Χ109〜1()Χ1014Ω / □爲較佳範圍內之表面電阻率，靜電衰減時間爲2秒以 下，再者’可得到能抑制與玻璃基板摩擦後之情況下表面 電位於極低程度之成形物。該成形物不會吸附浮游在空氣 中之塵埃等。 -24- 1291439 因此，該等之聚醯胺樹脂組成物係適合作爲基板用卡匣 之成形材料。本發明之基板用卡匣係不會有破壞組裝有薄 膜電晶體之玻璃基板迴路之疑慮。 另外’使用不含有高分子型抗靜電劑之聚醯胺樹脂組成 物I (It較例1)所成形之成形物，係表面電阻率高、靜電衰減 時間亦爲60秒以上，未充分發現抗靜電機能。再者，與玻 璃基板摩擦之情況下玻璃基板表面電位亦高達i 200V，不 能滿足作爲基板用卡匣樹脂材料之要求特性。使用充塡碳 纖維於聚醯胺樹脂之聚醯胺樹脂組成物（比較例2)所成形 之成形物，係表面電阻率較1 05 Ω / □低，在玻璃基板接觸 於該構件之情況下，感應帶電、漏電或帶電之玻璃基板激 烈地放電，恐怕會破壞迴路。又，與玻璃基板摩擦之情況 下玻璃基板表面電位亦高達240V，不能滿足作爲基板用卡 匣樹脂材料之要求特性。 由含有聚碳酸酯、聚對苯二甲酸乙二醇酯、聚對苯二甲 酸丁醇二酯、或聚苯硫醚與高分子型抗靜電劑之樹脂組成 物所形成之成形物（比較例3〜6)，顯示109〜1〇 14 Ω /□之範圍 內之表面電阻率，而且，靜電衰減時間爲1秒以下，但是， 不能抑制與玻璃基板摩擦情況下玻璃基板表面電位於低程 度，不能充分地滿足作爲基板用卡匣樹脂材料之要求特 性。 【產業上之利用可行性】 本發明之電荷控制構件係有用作爲用於收藏電：^ %件： 封裝基板等之薄板狀之各種基板之基板用卡®等。彳艮_ # 發明，提供具有適度之表面電阻率與安定抗靜電性，彳文^ -25- 1291439 已形成迴路之基板等，該基板帶電亦不會破壞迴路之基板 用卡匣。 根據本發明，使用熔融流動性、成形性、灰塵防止性、 機械特性優異，極少不純物滲出在基板表面之聚合物材 料，可提供具有該等優異特性之基板用卡匣。再者，根據 本發明，可保護基板避免靜電，保持不附著塵埃之適切淸 潔度’同時防止基板之激烈放電。本發明之電荷控制構件 係在基板用卡匣以外，亦可適用於要求抗靜電性或電荷控 制特性之如前述各種用途。 (五）圖式簡單說明： 第1圖顯示基板用卡匣之一實例之正視圖。 第2圖係顯示基板用卡匣之一實例之斜視圖。 元件符號說明： 1 :底面側框 2 :上面側框 3 :側板 4 :唇狀擱板-23- 1291439 (Remarks) (1) Polyamide 46: DSM]SR manufactured by Enpra Co., Ltd. under the trade name "Stanyl TS300"; (2) Polyamide: Polyamine 6T/6I/66, Made by Amerco, under the trade name Amedil; (3) Polycarbonate: manufactured by Mitsubishi Gas Chemical Co., Ltd. under the trade name "Ubilon S-200"; (4) Poly(p-phenylene) Ethylene glycolate: manufactured by Mitsui Chemicals Co., Ltd., trade name "SA 1 3 5"; (5) Polybutylene terephthalate: made of polymerized plastic, trade name "Zhaqik 2002"; 6) Polyphenylene sulfide: manufactured by Wu Yu Chemical Industry Co., Ltd., trade name "Ford Long KPS W-214"; (7) Polyether ester decylamine · Sanyo Chemical Industry Co., Ltd., trade name "Beyley Stadt NC6321"; (8) Glass fiber: Asahi fiber glass, trade name "FT6 89"; (9) Carbon fiber: PAN carbon fiber made by Toho Group Co., Ltd., trade name "Besvait HTA3000". As is apparent from the results of Table 1, the resin composition (Example 丨~6) in which the polymer type antistatic agent blended in a specific compounding ratio is used in the polyimide resin shows 1.0X106 〜1·0Χ1014 Ω/□, The surface resistivity in the preferred range is 1·0Χ109~1()Χ1014Ω / □, and the static decay time is 2 seconds or less. In addition, the surface electric current can be suppressed to a very low level after being rubbed against the glass substrate. The degree of formation. The molded article does not adsorb dust or the like floating in the air. -24- 1291439 Therefore, these polyamide resin compositions are suitable as a molding material for a substrate. The card cassette of the present invention does not have the problem of destroying the glass substrate circuit in which the thin film transistor is assembled. In addition, the molded article formed by using the polyamidamide resin composition I (It is compared with Example 1) containing no polymer type antistatic agent has a high surface resistivity and a static decay time of 60 seconds or more. Electrostatic function. Further, in the case of rubbing against the glass substrate, the surface potential of the glass substrate was as high as i 200 V, which was not satisfactory as a resin material for a substrate. The molded article formed by using the carbonized fiber in the polyamide resin composition of the polyamide resin (Comparative Example 2) has a surface resistivity lower than 10 Ω / □, and when the glass substrate is in contact with the member, Inductively charged, leaking or charged glass substrates are severely discharged, which may damage the circuit. Further, in the case of rubbing against the glass substrate, the surface potential of the glass substrate was as high as 240 V, which was not satisfactory as a resin material for a substrate. A molded article formed of a resin composition containing polycarbonate, polyethylene terephthalate, polybutylene terephthalate or polyphenylene sulfide and a polymeric antistatic agent (Comparative Example) 3 to 6), the surface resistivity in the range of 109 to 1 〇 14 Ω / □ is displayed, and the static decay time is 1 second or less. However, the surface of the glass substrate is not suppressed to be low when the glass substrate is rubbed. The required characteristics as the resin material for the substrate are not sufficiently satisfied. [Industrial Applicability] The charge control member of the present invention is useful as a substrate card for use in a substrate for storing various types of substrates such as a package substrate.彳艮_ # Invention, providing a moderate surface resistivity and stability antistatic property, 彳文^-25- 1291439 has formed a circuit substrate, etc., the substrate is charged without destroying the substrate of the circuit card. According to the present invention, it is possible to provide a substrate cartridge having such excellent characteristics by using a polymer material which is excellent in melt fluidity, moldability, dust prevention property, and mechanical property, and which has few impurities which are exuded on the surface of the substrate. Further, according to the present invention, it is possible to protect the substrate from static electricity, maintain the appropriate cleanliness of the dust, and prevent the discharge of the substrate. The charge control member of the present invention can be applied to various substrates as required for the substrate, and can be applied to various applications requiring antistatic properties or charge control properties as described above. (5) Brief description of the drawings: Fig. 1 is a front view showing an example of a substrate cassette. Fig. 2 is a perspective view showing an example of a substrate cassette. Component symbol description: 1 : bottom side frame 2 : upper side frame 3 : side plate 4 : lip shelf

5 :接收側框 A :基板 -26-5 : Receiving side frame A : Substrate -26-

Claims (1)

1291439 拾、申請專利範圍： 1· 一種電荷控制構件，其本體或表面層的至少一部分爲由 聚醯胺樹脂組成物所形成，該聚醯胺樹脂含有相對於 (A) 100重量份聚醯胺樹脂而言，（B)4〜95重量份的高分子 型抗靜電劑，此高分子型抗靜電劑係至少一種選自由（B 1) 聚醚酯醯胺以及（B 2)乙烯系不飽和單體接枝於具有環氧 烷基之橡膠狀骨架聚合物所成之接枝共聚物所組成族 群。 2.如申請專利範圍第1項之電荷控制構件，其中聚醯胺樹 脂組成物所形成之本體或該表面層之表面電阻率爲在 1.0X106 〜1·0Χ1014Ω/□之範圍內。 3·如申請專利範圍第1項之電荷控制構件，其中（Α)聚醯胺 樹脂係脂肪族聚醯胺樹脂、脂肪族-芳香族聚醯胺樹脂或 其混合物。 4·如申請專利範圍第3項之電荷控制構件，其中脂肪族聚 醯胺樹脂爲聚醯胺6、聚醯胺66、聚醯胺610、聚醯胺 612、聚醯胺11、聚醯胺12、或聚醯胺46。 5.如申請專利範圍第3項之電荷控制構件，其中脂肪族-芳 香族聚醯胺樹脂係聚醯胺 MXD6(聚間二甲苯己二醯 胺）、聚醯胺6T(聚六亞甲基對苯二甲基醯胺）、聚醯胺 61 (聚六亞甲基異苯二甲基醯胺）、聚醯胺41(聚四亞甲基 異苯二甲基醯胺）、聚醯胺6Τ/66 (六亞甲基二胺/己二酸/ 對苯二甲酸共聚物）、聚醯胺6Τ/6Ι(六亞甲基二胺/異苯二 甲酸/對苯二甲酸共聚物）、聚醯胺6Τ/6Ι/66(六亞甲基二 胺/己二酸/異苯二甲酸/對苯二甲酸共聚物）、聚醯胺 -27- 1291439 6Τ/Μ-5Τ(六亞甲基二胺/甲基戊二胺/對苯二甲酸共聚物） 或聚醯胺6T/6(己內醯胺/六亞甲基二胺/對苯二甲酸共聚 物）。 6.如申請專利範圍第1項之電荷控制構件，其中（Β 1)聚醚 酯醯胺爲於兩末端具有羧基之聚醯胺成分與聚醚成分經 酯鍵結成的聚合物。 7·如申請專利範圍第6項之電荷控制構件，其中於兩末端 具有羧基之聚醯胺成分爲內醯胺開環聚合物、胺基羧酸 之聚縮合物或二羧酸與二胺之聚縮合物。 8. 如申請專利範圍第6項之電荷控制構件，其中聚醚成分 爲聚氧化伸烷基二醇、或聚氧化伸烷基二醇與雙酚類之 環氧烷類加成物之組合。 9. 如申請專利範圍第1項之電荷控制構件，其中（Β2)接枝 共聚物爲在50〜90重量％橡膠狀骨架聚合物之存在下，接 枝聚合10〜50重量％乙烯系不飽和單體而得之接枝共聚 物。 10. 如申請專利範圍第9項之電荷控制構件，其中橡膠狀骨 架聚合物爲50〜95重量％至少一種選自由共軛二烯及丙 烯酸酯所組成族組之單體、5〜50重量％至少一種具有 4〜5 00個環氧烷基與乙烯系不飽和鍵的聚環氧烷系單 體、及0〜5 0重量份至少一種與該些單體可共聚合之乙烯 系不飽和單體之共聚物。 11·如申請專利範圍第9項之電荷控制構件，其中乙烯系不 飽和單體爲甲基丙烯酸烷酯、乙烯基芳香族化合物、其 它乙烯基單體、或含有它們的混合物。 -28- 1291439 12·如申請專利範圍第1項之電荷控制構件，其中聚醯胺樹 脂組成物更含有相對於100重量份（Α)聚醯胺樹脂而言， 80重量份以下的（C)纖維狀補強材料。 13. 如申請專利範圍第丨2項之電荷控制構件，其中（C)纖維 狀補強材料係玻璃纖維。 14. 如申請專利範圍第1項之電荷控制構件，其在溫度23 °C、相對濕度50%之條件下，以聚醯胺樹脂組成物所形 成之本身或該表面層之表面與玻璃基板摩擦後，具以表 面電位計所測定之玻璃基板表面電位爲1 50V以下之電 荷控制機能。 15. 如申請專利範圍第1項之電荷控制構件，其中使用靜電 •衰減計（STATIC DECAY METER)，依照 MIL-B- 8 1 705C 所測定之從5000V至50V之靜電衰減時間（static decay t i m e)爲5秒以下。 16. 如申請專利範圍第1項之電荷控制構件，其爲基板用卡 匣。 17. 如申請專利範圍第1 6項之電荷控制構件，其中基板用卡 匣爲基板用卡匣之至少於基板接觸位置爲藉由聚醯胺樹 脂組成物所形成者。 18·如申請專利範圍第1 7項之電荷控制構件，其中基板用卡 匣爲玻璃基板用卡匣。1291439 Pickup, Patent Application Range: 1. A charge control member having at least a portion of its body or surface layer formed of a polyamide resin composition containing 100 parts by weight of polyamine relative to (A) (B) 4 to 95 parts by weight of a polymer type antistatic agent, at least one selected from the group consisting of (B 1) polyether ester decylamine and (B 2) ethylenic unsaturation. The monomer is grafted to a group of graft copolymers of a rubbery backbone polymer having an alkylene oxide group. 2. The charge control member according to claim 1, wherein the surface resistivity of the body or the surface layer formed of the polyamide resin composition is in the range of 1.0 X 106 〜1·0 Χ 1014 Ω/□. 3. The charge control member according to claim 1, wherein the (poly)polyamine resin is an aliphatic polyamine resin, an aliphatic-aromatic polyamide resin or a mixture thereof. 4. The charge control member according to claim 3, wherein the aliphatic polyamine resin is polyamine 6, polyamine 66, polyamide 610, polyamide 612, polyamine 11, polyamine 12. Polyamide 46. 5. The charge control member according to claim 3, wherein the aliphatic-aromatic polyamide resin is polyamine MXD6 (poly-m-xylylene adipamide) or polyamine 6T (polyhexamethylene) p-Benzyl decylamine, polydecylamine 61 (polyhexamethylene isophthalamide), polyamine 41 (polytetramethylene isophthalamide), polyamine 6Τ/66 (hexamethylenediamine/adipic acid/terephthalic acid copolymer), polyamine 6Τ/6Ι (hexamethylenediamine/isophthalic acid/terephthalic acid copolymer), Polyamine 6Τ/6Ι/66 (hexamethylenediamine/adipic acid/isophthalic acid/terephthalic acid copolymer), polyamido-27- 1291439 6Τ/Μ-5Τ (hexamethylene) Diamine/methylpentanediamine/terephthalic acid copolymer) or polyamine 6T/6 (caprolactam/hexamethylenediamine/terephthalic acid copolymer). 6. The charge control member according to claim 1, wherein the (?) polyether oxime is a polymer obtained by ester-bonding a polyamine component having a carboxyl group at both terminals to a polyether component. 7. The charge control member according to claim 6, wherein the polyamine component having a carboxyl group at both ends is an indoleamine ring-opening polymer, a polycondensate of an aminocarboxylic acid or a dicarboxylic acid and a diamine. Polycondensate. 8. The charge control member of claim 6, wherein the polyether component is a polyoxyalkylene glycol or a combination of a polyoxyalkylene glycol and an alkylene oxide adduct of a bisphenol. 9. The charge control member according to claim 1, wherein the (Β2) graft copolymer is in the presence of 50 to 90% by weight of a rubbery skeleton polymer, and graft polymerization is 10 to 50% by weight of ethylenic unsaturation. Monomeric graft copolymer. 10. The charge control member according to claim 9, wherein the rubbery skeleton polymer is 50 to 95% by weight of at least one monomer selected from the group consisting of a conjugated diene and an acrylate, and 5 to 50% by weight. At least one polyalkylene oxide monomer having 4 to 500 epoxyalkyl groups and an ethylenically unsaturated bond, and 0 to 50 parts by weight of at least one ethylenically unsaturated monomer copolymerizable with the monomers Copolymer of body. 11. The charge control member according to claim 9, wherein the ethylenically unsaturated monomer is an alkyl methacrylate, a vinyl aromatic compound, another vinyl monomer, or a mixture thereof. -28- 1291439. The charge control member according to claim 1, wherein the polyamide resin composition further contains 80 parts by weight or less based on 100 parts by weight of the (poly) polyamide resin (C) Fibrous reinforcing material. 13. The charge control member of claim 2, wherein the (C) fibrous reinforcing material is a glass fiber. 14. The charge control member according to claim 1, wherein the surface of the surface layer and the glass substrate are rubbed by the polyimide resin composition at a temperature of 23 ° C and a relative humidity of 50%. Thereafter, the surface control potential of the glass substrate measured by the surface potentiometer was a charge control function of 150 V or less. 15. For the charge control member of claim 1, the static decay time from 5000V to 50V measured according to MIL-B-8 1 705C using a static decay meter (STATIC DECAY METER) It is 5 seconds or less. 16. The charge control member of claim 1, wherein the charge control member is a substrate cassette. 17. The charge control member according to claim 16 wherein the substrate cassette is formed by a polyamide resin composition at least at a substrate contact position. 18. The charge control member according to claim 17, wherein the substrate cassette is a cassette for a glass substrate.
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KR101353157B1 (en) * 2010-12-28 2014-01-22 도쿄엘렉트론가부시키가이샤 Electrostatic chuck
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