JP5295770B2 - 導電性樹脂組成物を用いた導電性シート - Google Patents
導電性樹脂組成物を用いた導電性シート Download PDFInfo
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- JP5295770B2 JP5295770B2 JP2008529860A JP2008529860A JP5295770B2 JP 5295770 B2 JP5295770 B2 JP 5295770B2 JP 2008529860 A JP2008529860 A JP 2008529860A JP 2008529860 A JP2008529860 A JP 2008529860A JP 5295770 B2 JP5295770 B2 JP 5295770B2
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- resin
- mass
- copolymer
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- sheet
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- 239000011342 resin composition Substances 0.000 title claims description 28
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- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 claims description 8
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 claims description 8
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- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 claims 1
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- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
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- DFFZOPXDTCDZDP-UHFFFAOYSA-N naphthalene-1,5-dicarboxylic acid Chemical compound C1=CC=C2C(C(=O)O)=CC=CC2=C1C(O)=O DFFZOPXDTCDZDP-UHFFFAOYSA-N 0.000 description 2
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- HMUNWXXNJPVALC-UHFFFAOYSA-N 1-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)C(CN1CC2=C(CC1)NN=N2)=O HMUNWXXNJPVALC-UHFFFAOYSA-N 0.000 description 1
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 1
- LDXJRKWFNNFDSA-UHFFFAOYSA-N 2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]ethanone Chemical compound C1CN(CC2=NNN=C21)CC(=O)N3CCN(CC3)C4=CN=C(N=C4)NCC5=CC(=CC=C5)OC(F)(F)F LDXJRKWFNNFDSA-UHFFFAOYSA-N 0.000 description 1
- WZFUQSJFWNHZHM-UHFFFAOYSA-N 2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)CC(=O)N1CC2=C(CC1)NN=N2 WZFUQSJFWNHZHM-UHFFFAOYSA-N 0.000 description 1
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- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- Y10T428/1334—Nonself-supporting tubular film or bag [e.g., pouch, envelope, packet, etc.]
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Description
(1)ポリカーボネート樹脂33〜93質量%と、ポリアルキレンテレフタレート樹脂3〜44質量%と、共重合体中のエチレン含有量が30〜48質量%であるエチレン−酢酸ビニル共重合体、及び共重合体中のエチレン含有量が30〜40質量%であるエチレン−エチルアクリレート共重合体とからなる群から選ばれる少なくとも1種の炭化水素系共重合体3〜40質量%と、を含む熱可塑性樹脂100質量部に対して、カーボンブラック5〜50質量部を含有してなる導電性樹脂組成物からなる導電性シート。
(2)上記(1)に記載の導電性シートを、アクリロニトリル−ブタジエン−スチレン共重合体(ABS)樹脂、ポリカーボネート樹脂、及びポリアルキレンテレフタレート樹脂からなる群から選ばれた1種以上の熱可塑性樹脂を含む基材層の片側または両側に有する導電性シート。
(3)上記(1)又は(2)に記載の導電性シートを用いた電子部品包装容器。
(4)上記(1)又は(2)に記載の導電性シートを用いたエンボスキャリアテープ。
(5)上記(4)に記載のエンボスキャリアテープを用いた電子部品包装体。
ポリカーボネート樹脂の含有量が33質量%未満ではシートの力学特性が低下する傾向にあり、93質量%を超えると成形時の熱量が著しく増加する傾向にある。ポリアルキレンテレフタレート樹脂の含有量が3質量%未満では成形時の熱量が著しく増加する傾向にあり、40質量%を超えるとシート製膜時の溶融粘度が低くなり、膜厚の精度が低下する傾向にある。炭化水素系共重合体の含有量が3質量%未満ではシール強度向上の効果が十分に得られない傾向にあり、逆に40質量%を越えると得られるシートの力学特性が低下する傾向にある。なお、導電性樹脂組成物中のポリカーボネート樹脂、ポリアルキレンテレフタレート樹脂、及び炭化水素系共重合体の含有割合の好ましい範囲は、シール強度の他に衝撃強度等の物性値のバランスを考慮して決めたものである。
またシアン化ビニル単量体としては、アクリロニトリル、メタアクリロニトリルまたは各種ハロゲン置換アクリロニトリル等があげられる。上述の共重合体及びその共重合体とのブレンド物の具体例としては、アクリロニトリル−ブタジエン−スチレン三元共重合体やアクリロニトリル−スチレン二元共重合体にポリブタジエンをポリマーアロイ化したものが挙げられる。またゴム成分を含まないアクリロニトリル−スチレン二元共重合体も含まれる。
1)エチレン系共重合体
EVA(エチレン−酢酸ビニル共重合体);
NUCコポリマー 3195 日本ユニカー社製
エバフレックス 40LX 三井デュポンポリケミカル社製
エバフレックス 45LX 三井デュポンポリケミカル社製
EEA(エチレン−エチルアクリレート共重合体);
NUCコポリマー 6520 日本ユニカー社製
NUCコポリマー 6940 日本ユニカー社製
EGMA−g−AS(エチレン−グリシジルメタクリレート共重合体、AS樹脂グラフトポリマー);
モディパー A4400 日本油脂社製
2)スチレン系共重合体
SBBS(スチレン−ブチレン−ブテン−スチレン共重合体);
タフテック P2000 旭化成社製
SEBS(スチレン−エチレン−ブチレン−スチレン共重合体);
タフテック H1041 旭化成社製
タフテック H1043 旭化成社製
SEPS(スチレン−エチレン−プロピレン−スチレン共重合体);
セプトン S2063 クラレ社製
セプトン S2104 クラレ社製
3)ポリカーボネート樹脂
パンライト L−1225 帝人化成社製
4)ポリアルキレンテレフタレート樹脂
ノバデュラン 5010R8M 三菱エンジニアリングプラスチックス社製
5)カーボンブラック
ケッチェンブラックEC ライオン社製
デンカブラック粒状 電気化学工業社製
各実施例および各比較例で作製したシートの各種物性を、下記の方法で評価し、その結果を表にまとめて示した。なお、表中のMD、又は縦方向とはシートの流れ方向を示し、TD、又は横方向とはシートの幅方向を示す。
(シール強度)
熱傾斜試験機(東洋精機社製)により、シートに市販のカバーテープ(電気化学工業社製ALS−ATA)を140℃と150℃で熱シールし、24時間常温で静置した。カバーテープを熱シールしたシートの熱シールした箇所の両端を切り落とし、幅を15mmとした後、200mm/分の速度で180度剥離し、その剥離強度を測定した。得られた数値をシール幅(15mm)で割った値をシール強度とした。
(降伏点強度、破断点強度、引張伸び、引張弾性率)
JIS−K−7127に準拠し、4号試験片(MD方向)を使用して、インストロン型引張試験機により10mm/分の引張速度で引張試験を行った。
(耐折強度)
JIS−P8115に準拠し、MIT耐揉疲労試験機(東洋精機社製)により、左右に135度ずつ繰り返し折り曲げ、試験片が切断したときの屈曲回数を耐折強度とした。
(衝撃強度)
東洋精機社製デュポン式衝撃試験機にて1/2インチ半球状撃芯、荷重500gおよび1kgを用いて、環境温度23℃において測定した。結果をJIS−K7211の50%衝撃破壊エネルギー値(単位:J)で表示した。
(表面抵抗値)
メガオームメーターMODEL800(ACL社製)により幅方向に3点の表面抵抗値を測定し、その対数平均値を測定値とした。
(引裂強度)
JIS−K−7128−3に準拠し、評価を行った。
(カーボン汚染性)
シートを振動台に固定し、その上に19mm×25mmの枠を設置し、その中にQFP(Quad Flat Package)14mm×20mm−64pinのICを納入し、ストローク30mmで毎分480往復の速度で80万回平面方向に振動させた後、ICのリード部への付着物の有無を判定した。付着物がほとんどない状態を優、少ない場合を良、付着物の多い場合を不可とした
表1−1と表1−2に示す配合に従い二軸押出機(PCM−40、池貝鉄鋼所社製)により溶融混練し、樹脂ペレットと得た。更に、65mm単軸押出機1台を要したシート製膜装置を用い、得られた樹脂ペレットを溶融混練し単層シートを作製した。得られたシートの厚さは300μmであった。カーボンブラックはポリカーボネート樹脂とエチレン系共重合体からなる熱可塑性樹脂100質量部に対して、添加した。
表1−2に示す配合とした以外は、参考例1−1と同様の方法で単層シートを作製した。
表2−1及び表2−2に示す配合に従い、二軸押出機(PCM−40、池貝鉄鋼所社製)により溶融混練し、樹脂ペレットと得た。更に、65mm単軸押出機1台を要したシート製膜装置を用い、得られた樹脂ペレットを溶融混練し単層シートを作製した。得られたシートの厚さは300μmであった。
表2−2に示す配合とした以外は参考例2−1と同様の操作を行い、単層シートを作製した。尚、比較例2−3については成形加工性が悪く、外観の良好なシートを得ることが出来なかった。
表3−1と表3−2に示す配合に従い二軸押出機(PCM−40、池貝鉄鋼所社製)により溶融混練し、樹脂ペレットと得た。更に、65mm単軸押出機1台を要したシート製膜装置を用い、得られた樹脂ペレットを溶融混練し単層シートを作製した。得られたシートの厚さは300μmであった。カーボンブラックはポリカーボネート樹脂、ポリアルキレンテレフタレート樹脂とエチレン系共重合体からなる熱可塑性樹脂100質量部に対して、添加した。
表3−2に示す配合とした以外は、例3−1と同様の方法で単層シートを作製した。比較例3−2については外観が良好なシートを得ることが困難であった。
表4−1と表4−2に示す配合に従い二軸押出機(PCM−40、池貝鉄鋼所社製)により溶融混練し、樹脂ペレットと得た。更に、65mm単軸押出機1台を要したシート製膜装置を用い、得られた樹脂ペレットを溶融混練し単層シートを作製した。得られたシートの厚さは300μmであった。カーボンブラックはポリカーボネート樹脂、ポリアルキレンテレフタレート樹脂とスチレン系共重合体からなる熱可塑性樹脂100質量部に対して、添加した。
表4−2に示す配合とした以外は、参考例4−1と同様の方法で単層シートを作製した。
なお、2006年8月15日に出願された日本特許出願2006−221351号、2006年9月6日に出願された日本特許出願2006−240933号、2006年10月30日に出願された日本特許出願2006−293450号及び2006年10月30日に出願された日本特許出願2006−294947号の明細書、特許請求の範囲、及び要約書の全内容をここに引用し、本発明の明細書の開示として、取り入れるものである。
Claims (5)
- ポリカーボネート樹脂33〜93質量%と、ポリアルキレンテレフタレート樹脂3〜44質量%と、共重合体中のエチレン含有量が30〜48質量%であるエチレン−酢酸ビニル共重合体、及び共重合体中のエチレン含有量が30〜40質量%であるエチレン−エチルアクリレート共重合体とからなる群から選ばれる少なくとも1種の炭化水素系共重合体3〜40質量%と、を含む熱可塑性樹脂100質量部に対して、カーボンブラック5〜50質量部を含有してなる導電性樹脂組成物からなる導電性シート。
- 請求項1に記載の導電性シートを、アクリロニトリル−ブタジエン−スチレン共重合体(ABS)樹脂、ポリカーボネート樹脂、及びポリアルキレンテレフタレート樹脂からなる群から選ばれた1種以上の熱可塑性樹脂を含む基材層の片側または両側に有する導電性シート。
- 請求項1又は2に記載の導電性シートを用いた電子部品包装容器。
- 請求項1又は2に記載の導電性シートを用いたエンボスキャリアテープ。
- 請求項4に記載のエンボスキャリアテープを用いた電子部品包装体。
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US8999470B2 (en) | 2010-03-24 | 2015-04-07 | Denki Kagaku Kogyo Kabushiki Kaisha | Surface conductive laminated sheet and electronic part packaging container |
KR101955745B1 (ko) * | 2011-10-14 | 2019-03-07 | 덴카 주식회사 | 커버 테이프 |
KR20140141208A (ko) * | 2013-05-31 | 2014-12-10 | 제일모직주식회사 | 전기전도성이 우수한 캐리어 테이프용 폴리카보네이트계 수지 조성물 |
KR101662368B1 (ko) | 2013-07-26 | 2016-10-04 | 롯데첨단소재(주) | 전도성 시트 조성물 |
JP6325859B2 (ja) * | 2014-03-20 | 2018-05-16 | リンテック株式会社 | 導電性樹脂シート |
WO2017159164A1 (ja) * | 2016-03-17 | 2017-09-21 | 住化ポリカーボネート株式会社 | ポリカーボネート樹脂組成物、成形体及びキャリアテープ |
US11619892B2 (en) * | 2018-07-05 | 2023-04-04 | Canon Kabushiki Kaisha | Resin molded product, resin laminate, cartridge, image-forming apparatus, method for manufacturing resin molded product, method for manufacturing resin laminate, and method for manufacturing cartridge |
KR20220056953A (ko) * | 2020-10-29 | 2022-05-09 | 현대자동차주식회사 | 도금 부착력 및 광 투과도가 향상된 열가소성 수지 조성물 및 이를 이용하여 제조된 성형품 |
TWI789007B (zh) * | 2021-09-13 | 2023-01-01 | 南亞塑膠工業股份有限公司 | 導電聚酯疊層結構及導電包裝材料 |
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US20090280280A1 (en) | 2009-11-12 |
CN101501136A (zh) | 2009-08-05 |
WO2008020579A1 (fr) | 2008-02-21 |
JPWO2008020579A1 (ja) | 2010-01-07 |
TWI437043B (zh) | 2014-05-11 |
CN101501136B (zh) | 2012-02-22 |
KR20090049049A (ko) | 2009-05-15 |
KR101419073B1 (ko) | 2014-07-11 |
TW200829648A (en) | 2008-07-16 |
US8148456B2 (en) | 2012-04-03 |
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