CN100377036C - 电子设备 - Google Patents

电子设备 Download PDF

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Publication number
CN100377036C
CN100377036C CNB2006100747922A CN200610074792A CN100377036C CN 100377036 C CN100377036 C CN 100377036C CN B2006100747922 A CNB2006100747922 A CN B2006100747922A CN 200610074792 A CN200610074792 A CN 200610074792A CN 100377036 C CN100377036 C CN 100377036C
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CN
China
Prior art keywords
air
circuit board
housing
fan
partition member
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Active
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CNB2006100747922A
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English (en)
Chinese (zh)
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CN1848039A (zh
Inventor
草本丈治
中岛雄二
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dynabook Inc
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Toshiba Corp
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Publication date
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Publication of CN1848039A publication Critical patent/CN1848039A/zh
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Publication of CN100377036C publication Critical patent/CN100377036C/zh
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CNB2006100747922A 2005-04-15 2006-04-14 电子设备 Active CN100377036C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005118641 2005-04-15
JP2005118641A JP4675666B2 (ja) 2005-04-15 2005-04-15 電子機器

Publications (2)

Publication Number Publication Date
CN1848039A CN1848039A (zh) 2006-10-18
CN100377036C true CN100377036C (zh) 2008-03-26

Family

ID=37077627

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2006100747922A Active CN100377036C (zh) 2005-04-15 2006-04-14 电子设备

Country Status (3)

Country Link
US (1) US7310227B2 (enExample)
JP (1) JP4675666B2 (enExample)
CN (1) CN100377036C (enExample)

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RU2007138421A (ru) 2005-03-17 2009-04-27 Индастриал Оригами, Инк. (Us) Точно сложенные, высокопрочные, обладающие усталостной прочностью структуры и лист для них
US9047066B2 (en) 2005-09-30 2015-06-02 Intel Corporation Apparatus and method to efficiently cool a computing device
US7542293B2 (en) * 2006-04-10 2009-06-02 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Thermal module
JP4213729B2 (ja) * 2006-05-23 2009-01-21 株式会社東芝 電子機器
JP4167700B2 (ja) * 2006-05-31 2008-10-15 株式会社東芝 電子機器
CN101106888B (zh) * 2006-07-14 2012-06-13 富准精密工业(深圳)有限公司 散热模组
JP5113363B2 (ja) * 2006-09-28 2013-01-09 富士通株式会社 電子機器
JP4921096B2 (ja) * 2006-09-28 2012-04-18 富士通株式会社 電子機器および冷却部品
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JP4199795B2 (ja) * 2006-10-30 2008-12-17 レノボ・シンガポール・プライベート・リミテッド 電子機器の筐体温度抑制構造および携帯式コンピュータ
US7764514B2 (en) * 2006-12-08 2010-07-27 Intel Corporation Electromagnetic interference shielding for device cooling
WO2008098217A2 (en) 2007-02-09 2008-08-14 Industrial Origami, Inc. Load-bearing three-dimensional structure
US20100128431A1 (en) * 2007-03-07 2010-05-27 Andre Sloth Eriksen Hybrid liquid-air cooled graphics display adapter
JP2008251687A (ja) * 2007-03-29 2008-10-16 Toshiba Corp プリント回路板、およびこれを備えた電子機器
US7589973B2 (en) * 2007-09-05 2009-09-15 Sun Microsystems, Inc. Air duct flow optimization device
US7602607B2 (en) * 2007-09-28 2009-10-13 Intel Corporation External protrusion for air flow distribution
KR101425680B1 (ko) * 2007-11-15 2014-07-31 엘지전자 주식회사 휴대용 컴퓨터의 방열구조
US7957140B2 (en) * 2007-12-31 2011-06-07 Intel Corporation Air mover for device surface cooling
JP4998417B2 (ja) * 2008-09-12 2012-08-15 富士通株式会社 電子機器
CN101742875B (zh) * 2008-11-20 2011-10-05 英业达股份有限公司 散热组件
US8107239B2 (en) 2009-02-27 2012-01-31 Kabushiki Kaisha Toshiba Electronic apparatus and cooling fan
JP2015038897A (ja) * 2009-03-30 2015-02-26 株式会社東芝 電子機器
JP4693925B2 (ja) * 2009-09-30 2011-06-01 株式会社東芝 電子機器
JP4802272B2 (ja) * 2009-09-30 2011-10-26 株式会社東芝 電子機器
JP4999943B2 (ja) * 2010-01-27 2012-08-15 東芝テック株式会社 情報処理端末
US8233280B2 (en) * 2010-03-15 2012-07-31 Lincoln Global, Inc. Electronic module with center mounting fasteners
JP4892078B2 (ja) 2010-05-11 2012-03-07 株式会社東芝 電子機器
JP4823374B1 (ja) * 2010-05-11 2011-11-24 株式会社東芝 電子機器
JP5445507B2 (ja) * 2010-06-03 2014-03-19 株式会社デンソー 電力変換装置
JP4818452B2 (ja) * 2010-07-23 2011-11-16 株式会社東芝 電子機器
US8953313B2 (en) * 2010-09-24 2015-02-10 Intel Corporation Method and apparatus for enhanced cooling of mobile computing device surfaces
EP2586277B1 (en) * 2010-09-29 2014-06-18 Siemens Aktiengesellschaft Subsea control system
US20120162903A1 (en) * 2010-12-23 2012-06-28 Macdonald Mark Electro-hydrodynamic cooling for handheld mobile computing device
JP2012190060A (ja) 2011-03-08 2012-10-04 Toshiba Corp 電子機器
JP5238841B2 (ja) * 2011-03-08 2013-07-17 株式会社東芝 電子機器
JP5927539B2 (ja) * 2011-07-25 2016-06-01 パナソニックＩｐマネジメント株式会社 電子機器
JP4922473B2 (ja) * 2011-10-07 2012-04-25 株式会社東芝 電子機器
TWI505073B (zh) * 2012-03-22 2015-10-21 Compal Electronics Inc 電子裝置
JP5306511B1 (ja) * 2012-04-27 2013-10-02 株式会社東芝 電子機器
US8936164B2 (en) * 2012-07-06 2015-01-20 Industrial Origami, Inc. Solar panel rack
CN202870717U (zh) * 2012-08-27 2013-04-10 高亿实业有限公司 笔记本电脑散热装置
US9538632B2 (en) * 2012-10-18 2017-01-03 Apple Inc. Printed circuit board features of a portable computer
JP6201511B2 (ja) * 2013-08-15 2017-09-27 富士通株式会社 電子機器
WO2015047615A1 (en) * 2013-09-26 2015-04-02 Intel Corporation Partitioned cooling for electronic devices and systems
WO2015149212A1 (en) * 2014-03-31 2015-10-08 Intel Corporation Sonic dust remediation
KR102568676B1 (ko) * 2016-12-14 2023-08-22 삼성전자주식회사 방음 구조를 구비한 전자 장치
CN109362207A (zh) * 2018-10-26 2019-02-19 努比亚技术有限公司 一种风冷散热装置及终端
US10969838B2 (en) * 2019-09-05 2021-04-06 Dell Products, L.P. Hybrid cooling system with multiple outlet blowers
US11681340B2 (en) * 2020-03-17 2023-06-20 Nvidia Corporation Blow-through axial fan for a graphics processing unit
TWI763256B (zh) * 2021-01-15 2022-05-01 宏碁股份有限公司 可攜式電子裝置的散熱系統
US11503740B2 (en) * 2021-02-10 2022-11-15 Dell Products L.P. Cooling system for an information handling system
US11429164B1 (en) * 2021-02-10 2022-08-30 Dell Products L.P. Cooling system for an information handling system
US12207029B2 (en) * 2022-10-03 2025-01-21 Hitron Technologies Inc. Heat dissipating device
TWI870136B (zh) * 2023-10-20 2025-01-11 仁寶電腦工業股份有限公司 電子裝置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001142574A (ja) * 1999-11-18 2001-05-25 Hitachi Ltd 電子装置
CN1391434A (zh) * 2001-06-08 2003-01-15 株式会社东芝 带有冷却产热部件的冷却单元的电子装置
EP1521164A2 (en) * 2003-09-30 2005-04-06 Kabushiki Kaisha Toshiba Electronic apparatus with air cooling unit

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JP3663706B2 (ja) * 1995-01-27 2005-06-22 株式会社日立製作所 パーソナルコンピュータ
US5725622A (en) * 1996-09-04 1998-03-10 Electronic Cable Specialists, Inc. Hood for use on Avionic line replaceable unit
JPH11194859A (ja) * 1998-01-05 1999-07-21 Matsushita Electric Ind Co Ltd 情報処理装置
JP2000223876A (ja) * 1999-01-29 2000-08-11 Toshiba Corp 電子機器
JP2000323878A (ja) * 1999-05-12 2000-11-24 Matsushita Electric Ind Co Ltd 電子機器の冷却構造
JP4195952B2 (ja) * 1999-09-03 2008-12-17 パナソニック株式会社 冷却構造を有する携帯型情報処理装置
JP2002009214A (ja) * 2000-06-26 2002-01-11 Toshiba Corp 放熱部材取付構造
JP3690658B2 (ja) * 2001-07-13 2005-08-31 インターナショナル・ビジネス・マシーンズ・コーポレーション ヒートシンク、冷却部材、半導体基板冷却装置、コンピュータ、および放熱方法
JP4896359B2 (ja) * 2003-01-28 2012-03-14 富士通株式会社 電子装置
US20050276018A1 (en) * 2004-06-14 2005-12-15 Moore Earl W Thermal management system for a portable computing device
JP4504760B2 (ja) * 2004-08-09 2010-07-14 富士通株式会社 電子機器
JP2006207881A (ja) * 2005-01-26 2006-08-10 Matsushita Electric Ind Co Ltd 冷却装置及びそれを備えた電子機器
US7262964B1 (en) * 2005-04-27 2007-08-28 Hewlett-Packard Development Company, L.P. Airflow control baffle
JP2007149007A (ja) * 2005-11-30 2007-06-14 Toshiba Corp 電子機器

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001142574A (ja) * 1999-11-18 2001-05-25 Hitachi Ltd 電子装置
CN1391434A (zh) * 2001-06-08 2003-01-15 株式会社东芝 带有冷却产热部件的冷却单元的电子装置
EP1521164A2 (en) * 2003-09-30 2005-04-06 Kabushiki Kaisha Toshiba Electronic apparatus with air cooling unit

Also Published As

Publication number Publication date
JP4675666B2 (ja) 2011-04-27
US7310227B2 (en) 2007-12-18
US20060232934A1 (en) 2006-10-19
JP2006301715A (ja) 2006-11-02
CN1848039A (zh) 2006-10-18

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20190107

Address after: No. 6, 15, 5 Dingmu, Toyota, Tokyo, Japan

Patentee after: Toshiba terminal Solutions Ltd

Address before: Tokyo, Japan port area Zhi Pu Ding Ding 1, No. 1

Patentee before: Toshiba Corp

TR01 Transfer of patent right