CN100375230C - 用于群集系统的传送室 - Google Patents

用于群集系统的传送室 Download PDF

Info

Publication number
CN100375230C
CN100375230C CNB2004100461822A CN200410046182A CN100375230C CN 100375230 C CN100375230 C CN 100375230C CN B2004100461822 A CNB2004100461822 A CN B2004100461822A CN 200410046182 A CN200410046182 A CN 200410046182A CN 100375230 C CN100375230 C CN 100375230C
Authority
CN
China
Prior art keywords
main body
transfer chamber
opening
chamber
lid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
CNB2004100461822A
Other languages
English (en)
Chinese (zh)
Other versions
CN1573481A (zh
Inventor
张根夏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jusung Engineering Co Ltd
Original Assignee
Jusung Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=33448340&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CN100375230(C) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Jusung Engineering Co Ltd filed Critical Jusung Engineering Co Ltd
Publication of CN1573481A publication Critical patent/CN1573481A/zh
Application granted granted Critical
Publication of CN100375230C publication Critical patent/CN100375230C/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electron Beam Exposure (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
CNB2004100461822A 2003-06-02 2004-06-02 用于群集系统的传送室 Ceased CN100375230C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR200335350 2003-06-02
KR1020030035350A KR100441875B1 (ko) 2003-06-02 2003-06-02 분리형 이송 챔버

Publications (2)

Publication Number Publication Date
CN1573481A CN1573481A (zh) 2005-02-02
CN100375230C true CN100375230C (zh) 2008-03-12

Family

ID=33448340

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2004100461822A Ceased CN100375230C (zh) 2003-06-02 2004-06-02 用于群集系统的传送室

Country Status (5)

Country Link
US (3) US7282460B2 (enExample)
JP (1) JP4527444B2 (enExample)
KR (1) KR100441875B1 (enExample)
CN (1) CN100375230C (enExample)
TW (1) TWI249186B (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100682209B1 (ko) 2002-06-21 2007-02-12 어플라이드 머티어리얼스, 인코포레이티드 진공 처리 시스템용 전달 챔버
KR100441875B1 (ko) * 2003-06-02 2004-07-27 주성엔지니어링(주) 분리형 이송 챔버
TWD107405S1 (zh) * 2004-05-28 2005-11-01 東京威力科創股份有限公司 裝載鎖定處理室
US20060201074A1 (en) * 2004-06-02 2006-09-14 Shinichi Kurita Electronic device manufacturing chamber and methods of forming the same
CN101866828B (zh) 2004-06-02 2013-03-20 应用材料公司 电子装置制造室及其形成方法
US7784164B2 (en) * 2004-06-02 2010-08-31 Applied Materials, Inc. Electronic device manufacturing chamber method
US8648977B2 (en) 2004-06-02 2014-02-11 Applied Materials, Inc. Methods and apparatus for providing a floating seal having an isolated sealing surface for chamber doors
JP4280249B2 (ja) * 2004-06-02 2009-06-17 アプライド マテリアルズ インコーポレイテッド チャンバをシールするための方法及び装置
KR100544896B1 (ko) * 2004-07-27 2006-01-24 (주)아이씨디 일체형 실링부재를 구비한 알루미늄 플라즈마 챔버
KR100595418B1 (ko) * 2004-07-27 2006-07-03 (주)아이씨디 알루미늄 플라즈마 챔버 및 그 제조 방법
WO2006130811A2 (en) * 2005-06-02 2006-12-07 Applied Materials, Inc. Electronic device manufacturing chamber and methods of forming the same
JP4791110B2 (ja) * 2005-09-02 2011-10-12 東京エレクトロン株式会社 真空チャンバおよび真空処理装置
KR100831950B1 (ko) * 2005-11-28 2008-05-23 주식회사 유진테크 챔버
US7845891B2 (en) * 2006-01-13 2010-12-07 Applied Materials, Inc. Decoupled chamber body
US20080025821A1 (en) * 2006-07-25 2008-01-31 Applied Materials, Inc. Octagon transfer chamber
JP4473343B2 (ja) * 2007-11-09 2010-06-02 キヤノンアネルバ株式会社 インライン型ウェハ搬送装置
DE102007057644A1 (de) * 2007-11-28 2009-06-04 Oerlikon Trading Ag, Trübbach Vakuumkammer auf Rahmenbasis für Beschichtungsanlagen
JP2009239085A (ja) * 2008-03-27 2009-10-15 Foi:Kk 半導体ウェハ搬送装置および半導体ウェハ搬送方法
KR101598176B1 (ko) * 2010-03-30 2016-02-26 주식회사 원익아이피에스 진공챔버
JP2013527609A (ja) * 2010-04-30 2013-06-27 アプライド マテリアルズ インコーポレイテッド 縦型インラインｃｖｄシステム
CN108933097B (zh) * 2017-05-23 2023-06-23 东京毅力科创株式会社 真空输送组件和基片处理装置
JP6972852B2 (ja) * 2017-05-23 2021-11-24 東京エレクトロン株式会社 真空搬送モジュール及び基板処理装置
JP7526664B2 (ja) * 2020-12-28 2024-08-01 東京エレクトロン株式会社 基板処理装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6045620A (en) * 1997-07-11 2000-04-04 Applied Materials, Inc. Two-piece slit valve insert for vacuum processing system
CN1052566C (zh) * 1993-11-05 2000-05-17 株式会社半导体能源研究所 制造半导体器件的方法
JP2001509646A (ja) * 1997-07-11 2001-07-24 アプライド マテリアルズ インコーポレイテッド 半導体ウエハ製造装置のモジュール式アーキテクチャ
CN1334959A (zh) * 1999-02-12 2002-02-06 Lpe公司 在感应式外延反应器中用自调平真空系统处理衬底的装置与方法
CN1082243C (zh) * 1995-05-10 2002-04-03 泰格尔公司 处理半导体基片的半导体处理系统和方法
US6540869B2 (en) * 2000-06-02 2003-04-01 Tokyo Electron Limited Semiconductor processing system
US6558506B1 (en) * 1999-02-01 2003-05-06 Tokyo Electron Limited Etching system and etching chamber

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0864542A (ja) * 1994-08-25 1996-03-08 Plasma Syst:Kk 半導体処理装置用真空チャンバーおよびその製造方法
ES2159084T3 (es) * 1997-01-07 2001-09-16 Siegfried Dr Stramke Dispositivo para el tratamiento superficial por plasma de piezas de trabajo.
US6182851B1 (en) * 1998-09-10 2001-02-06 Applied Materials Inc. Vacuum processing chambers and method for producing
US6558509B2 (en) * 1999-11-30 2003-05-06 Applied Materials, Inc. Dual wafer load lock
US6977014B1 (en) * 2000-06-02 2005-12-20 Novellus Systems, Inc. Architecture for high throughput semiconductor processing applications
JP4253107B2 (ja) * 2000-08-24 2009-04-08 キヤノンアネルバ株式会社 基板処理装置及びその増設方法
JP2004335743A (ja) * 2003-05-08 2004-11-25 Ulvac Japan Ltd 真空処理装置用真空チャンバー
KR100441875B1 (ko) * 2003-06-02 2004-07-27 주성엔지니어링(주) 분리형 이송 챔버
CN101866828B (zh) * 2004-06-02 2013-03-20 应用材料公司 电子装置制造室及其形成方法
US7784164B2 (en) * 2004-06-02 2010-08-31 Applied Materials, Inc. Electronic device manufacturing chamber method

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1052566C (zh) * 1993-11-05 2000-05-17 株式会社半导体能源研究所 制造半导体器件的方法
CN1082243C (zh) * 1995-05-10 2002-04-03 泰格尔公司 处理半导体基片的半导体处理系统和方法
US6045620A (en) * 1997-07-11 2000-04-04 Applied Materials, Inc. Two-piece slit valve insert for vacuum processing system
JP2001509646A (ja) * 1997-07-11 2001-07-24 アプライド マテリアルズ インコーポレイテッド 半導体ウエハ製造装置のモジュール式アーキテクチャ
US6558506B1 (en) * 1999-02-01 2003-05-06 Tokyo Electron Limited Etching system and etching chamber
CN1334959A (zh) * 1999-02-12 2002-02-06 Lpe公司 在感应式外延反应器中用自调平真空系统处理衬底的装置与方法
US6540869B2 (en) * 2000-06-02 2003-04-01 Tokyo Electron Limited Semiconductor processing system

Also Published As

Publication number Publication date
CN1573481A (zh) 2005-02-02
US20040240983A1 (en) 2004-12-02
US7375041B2 (en) 2008-05-20
TWI249186B (en) 2006-02-11
TW200501217A (en) 2005-01-01
US7282460B2 (en) 2007-10-16
JP2004363601A (ja) 2004-12-24
US20080029029A1 (en) 2008-02-07
US20050205012A1 (en) 2005-09-22
JP4527444B2 (ja) 2010-08-18
KR100441875B1 (ko) 2004-07-27

Similar Documents

Publication Publication Date Title
CN100375230C (zh) 用于群集系统的传送室
JP2004363601A5 (enExample)
US20070237608A1 (en) Cluster device having dual structure
KR100965413B1 (ko) 기판 처리용 클러스터 장치 및 클러스터 장치의 기판 처리방법
US7637799B2 (en) Substrate production apparatus for producing a substrate for a display device
JP2010116591A (ja) 蒸着装置及び有機ｅｌ表示装置の製造方法
JP2584290B2 (ja) 液晶表示装置の製造方法
US20210149261A1 (en) Wiring structure, display substrate, display device and method for fabricating display substrate
KR101988014B1 (ko) 어레이 기판의 제조 방법 및 이에 사용되는 제조 장치
CN102280443A (zh) 阵列基板的结构及制造方法
KR101000086B1 (ko) 기판 처리용 클러스터 장치 및 클러스터 장치의 기판 처리 방법
US7158206B2 (en) Sputter for deposition of metal layer and fabricating method of liquid crystal display device using the same
KR20070045168A (ko) 적층 구조의 클러스터
JP5262406B2 (ja) スパッタリング装置及びそのメンテナンス方法
US6860964B2 (en) Etch/strip apparatus integrated with cleaning equipment
US7494833B2 (en) Apparatus for stacking cassette and a method of fabricating a liquid crystal display device using the same
TWI253758B (en) Method of manufacturing electro-optical device and heat treatment device for transparent substrate
US7432026B2 (en) Method of manufacturing dichroic filter array
KR100196025B1 (ko) 에이엠에이 화상표시소자
US8045082B2 (en) System for display images and fabrication method thereof
KR20040104004A (ko) 액정표시장치용 클러스터 장치
KR20010058627A (ko) 다층 익스텐션 스테이지
JPS60100470A (ja) Ｍｉｓ型薄膜トランジスタ
KR20060017254A (ko) 분리 가능한 이송챔버
JPH07211651A (ja) 製膜方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C35 Partial or whole invalidation of patent or utility model
IW01 Full invalidation of patent right

Decision date of declaring invalidation: 20100617

Decision number of declaring invalidation: 14964

Granted publication date: 20080312