KR100441875B1 - 분리형 이송 챔버 - Google Patents

분리형 이송 챔버 Download PDF

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Publication number
KR100441875B1
KR100441875B1 KR1020030035350A KR20030035350A KR100441875B1 KR 100441875 B1 KR100441875 B1 KR 100441875B1 KR 1020030035350 A KR1020030035350 A KR 1020030035350A KR 20030035350 A KR20030035350 A KR 20030035350A KR 100441875 B1 KR100441875 B1 KR 100441875B1
Authority
KR
South Korea
Prior art keywords
chamber
transfer chamber
bodies
coupled
cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020030035350A
Other languages
English (en)
Korean (ko)
Inventor
장근하
Original Assignee
주성엔지니어링(주)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=33448340&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR100441875(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 주성엔지니어링(주) filed Critical 주성엔지니어링(주)
Priority to KR1020030035350A priority Critical patent/KR100441875B1/ko
Priority to TW093115658A priority patent/TWI249186B/zh
Priority to JP2004162901A priority patent/JP4527444B2/ja
Priority to US10/859,893 priority patent/US7282460B2/en
Priority to CNB2004100461822A priority patent/CN100375230C/zh
Publication of KR100441875B1 publication Critical patent/KR100441875B1/ko
Application granted granted Critical
Priority to US11/135,727 priority patent/US7375041B2/en
Priority to US11/872,617 priority patent/US20080029029A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electron Beam Exposure (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
KR1020030035350A 2003-06-02 2003-06-02 분리형 이송 챔버 Ceased KR100441875B1 (ko)

Priority Applications (7)

Application Number Priority Date Filing Date Title
KR1020030035350A KR100441875B1 (ko) 2003-06-02 2003-06-02 분리형 이송 챔버
TW093115658A TWI249186B (en) 2003-06-02 2004-06-01 Transfer chamber for cluster system
JP2004162901A JP4527444B2 (ja) 2003-06-02 2004-06-01 クラスタ用移送チャンバー
CNB2004100461822A CN100375230C (zh) 2003-06-02 2004-06-02 用于群集系统的传送室
US10/859,893 US7282460B2 (en) 2003-06-02 2004-06-02 Transfer chamber for cluster system
US11/135,727 US7375041B2 (en) 2003-06-02 2005-05-23 Transfer chamber for cluster system
US11/872,617 US20080029029A1 (en) 2003-06-02 2007-10-15 Transfer chamber for cluster system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020030035350A KR100441875B1 (ko) 2003-06-02 2003-06-02 분리형 이송 챔버

Publications (1)

Publication Number Publication Date
KR100441875B1 true KR100441875B1 (ko) 2004-07-27

Family

ID=33448340

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020030035350A Ceased KR100441875B1 (ko) 2003-06-02 2003-06-02 분리형 이송 챔버

Country Status (5)

Country Link
US (3) US7282460B2 (enExample)
JP (1) JP4527444B2 (enExample)
KR (1) KR100441875B1 (enExample)
CN (1) CN100375230C (enExample)
TW (1) TWI249186B (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006011756A1 (en) * 2004-07-27 2006-02-02 Innovation For Creative Devices Co., Ltd. Aluminum plasma chamber and method for manufacturing the same
WO2006011757A1 (en) * 2004-07-27 2006-02-02 Innovation For Creative Devices Co., Ltd. Aluminum plasma chamber having one body sealing member
KR100727499B1 (ko) 2004-06-02 2007-06-13 어플라이드 머티어리얼스, 인코포레이티드 전자 장치 제조 챔버 및 이의 형성 방법
KR100831950B1 (ko) * 2005-11-28 2008-05-23 주식회사 유진테크 챔버
US7784164B2 (en) 2004-06-02 2010-08-31 Applied Materials, Inc. Electronic device manufacturing chamber method
US8033772B2 (en) 2002-06-21 2011-10-11 Applied Materials, Inc. Transfer chamber for vacuum processing system
US8648977B2 (en) 2004-06-02 2014-02-11 Applied Materials, Inc. Methods and apparatus for providing a floating seal having an isolated sealing surface for chamber doors

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100441875B1 (ko) * 2003-06-02 2004-07-27 주성엔지니어링(주) 분리형 이송 챔버
TWD107405S1 (zh) * 2004-05-28 2005-11-01 東京威力科創股份有限公司 裝載鎖定處理室
US20060201074A1 (en) * 2004-06-02 2006-09-14 Shinichi Kurita Electronic device manufacturing chamber and methods of forming the same
JP4280249B2 (ja) * 2004-06-02 2009-06-17 アプライド マテリアルズ インコーポレイテッド チャンバをシールするための方法及び装置
WO2006130811A2 (en) * 2005-06-02 2006-12-07 Applied Materials, Inc. Electronic device manufacturing chamber and methods of forming the same
JP4791110B2 (ja) * 2005-09-02 2011-10-12 東京エレクトロン株式会社 真空チャンバおよび真空処理装置
US7845891B2 (en) * 2006-01-13 2010-12-07 Applied Materials, Inc. Decoupled chamber body
US20080025821A1 (en) * 2006-07-25 2008-01-31 Applied Materials, Inc. Octagon transfer chamber
JP4473343B2 (ja) * 2007-11-09 2010-06-02 キヤノンアネルバ株式会社 インライン型ウェハ搬送装置
DE102007057644A1 (de) * 2007-11-28 2009-06-04 Oerlikon Trading Ag, Trübbach Vakuumkammer auf Rahmenbasis für Beschichtungsanlagen
JP2009239085A (ja) * 2008-03-27 2009-10-15 Foi:Kk 半導体ウェハ搬送装置および半導体ウェハ搬送方法
KR101598176B1 (ko) * 2010-03-30 2016-02-26 주식회사 원익아이피에스 진공챔버
JP2013527609A (ja) * 2010-04-30 2013-06-27 アプライド マテリアルズ インコーポレイテッド 縦型インラインcvdシステム
CN108933097B (zh) * 2017-05-23 2023-06-23 东京毅力科创株式会社 真空输送组件和基片处理装置
JP6972852B2 (ja) * 2017-05-23 2021-11-24 東京エレクトロン株式会社 真空搬送モジュール及び基板処理装置
JP7526664B2 (ja) * 2020-12-28 2024-08-01 東京エレクトロン株式会社 基板処理装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1052566C (zh) * 1993-11-05 2000-05-17 株式会社半导体能源研究所 制造半导体器件的方法
JPH0864542A (ja) * 1994-08-25 1996-03-08 Plasma Syst:Kk 半導体処理装置用真空チャンバーおよびその製造方法
US5672239A (en) * 1995-05-10 1997-09-30 Tegal Corporation Integrated semiconductor wafer processing system
ES2159084T3 (es) * 1997-01-07 2001-09-16 Siegfried Dr Stramke Dispositivo para el tratamiento superficial por plasma de piezas de trabajo.
US6045620A (en) * 1997-07-11 2000-04-04 Applied Materials, Inc. Two-piece slit valve insert for vacuum processing system
US6312525B1 (en) * 1997-07-11 2001-11-06 Applied Materials, Inc. Modular architecture for semiconductor wafer fabrication equipment
US6182851B1 (en) * 1998-09-10 2001-02-06 Applied Materials Inc. Vacuum processing chambers and method for producing
WO2000045425A1 (en) * 1999-02-01 2000-08-03 Tokyo Electron Limited Etching system and etching chamber
IT1308606B1 (it) * 1999-02-12 2002-01-08 Lpe Spa Dispositivo per maneggiare substrati mediante un istema autolivellante a depressione in reattori epistassiali ad induzione con suscettore
US6558509B2 (en) * 1999-11-30 2003-05-06 Applied Materials, Inc. Dual wafer load lock
JP4021125B2 (ja) * 2000-06-02 2007-12-12 東京エレクトロン株式会社 ウェハ移載装置の装置ユニット接続時に用いられるレールの真直性保持装置
US6977014B1 (en) * 2000-06-02 2005-12-20 Novellus Systems, Inc. Architecture for high throughput semiconductor processing applications
JP4253107B2 (ja) * 2000-08-24 2009-04-08 キヤノンアネルバ株式会社 基板処理装置及びその増設方法
JP2004335743A (ja) * 2003-05-08 2004-11-25 Ulvac Japan Ltd 真空処理装置用真空チャンバー
KR100441875B1 (ko) * 2003-06-02 2004-07-27 주성엔지니어링(주) 분리형 이송 챔버
CN101866828B (zh) * 2004-06-02 2013-03-20 应用材料公司 电子装置制造室及其形成方法
US7784164B2 (en) * 2004-06-02 2010-08-31 Applied Materials, Inc. Electronic device manufacturing chamber method

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8033772B2 (en) 2002-06-21 2011-10-11 Applied Materials, Inc. Transfer chamber for vacuum processing system
KR100727499B1 (ko) 2004-06-02 2007-06-13 어플라이드 머티어리얼스, 인코포레이티드 전자 장치 제조 챔버 및 이의 형성 방법
US7784164B2 (en) 2004-06-02 2010-08-31 Applied Materials, Inc. Electronic device manufacturing chamber method
KR101108366B1 (ko) 2004-06-02 2012-01-25 어플라이드 머티어리얼스, 인코포레이티드 전자 장치 제조 챔버 및 이의 형성 방법
US8648977B2 (en) 2004-06-02 2014-02-11 Applied Materials, Inc. Methods and apparatus for providing a floating seal having an isolated sealing surface for chamber doors
US9580956B2 (en) 2004-06-02 2017-02-28 Applied Materials, Inc. Methods and apparatus for providing a floating seal for chamber doors
WO2006011756A1 (en) * 2004-07-27 2006-02-02 Innovation For Creative Devices Co., Ltd. Aluminum plasma chamber and method for manufacturing the same
WO2006011757A1 (en) * 2004-07-27 2006-02-02 Innovation For Creative Devices Co., Ltd. Aluminum plasma chamber having one body sealing member
KR100831950B1 (ko) * 2005-11-28 2008-05-23 주식회사 유진테크 챔버

Also Published As

Publication number Publication date
CN1573481A (zh) 2005-02-02
US20040240983A1 (en) 2004-12-02
US7375041B2 (en) 2008-05-20
TWI249186B (en) 2006-02-11
CN100375230C (zh) 2008-03-12
TW200501217A (en) 2005-01-01
US7282460B2 (en) 2007-10-16
JP2004363601A (ja) 2004-12-24
US20080029029A1 (en) 2008-02-07
US20050205012A1 (en) 2005-09-22
JP4527444B2 (ja) 2010-08-18

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St.27 status event code: A-5-5-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000