CN100334710C - 导体图形的制造方法 - Google Patents

导体图形的制造方法 Download PDF

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Publication number
CN100334710C
CN100334710C CNB2005100519669A CN200510051966A CN100334710C CN 100334710 C CN100334710 C CN 100334710C CN B2005100519669 A CNB2005100519669 A CN B2005100519669A CN 200510051966 A CN200510051966 A CN 200510051966A CN 100334710 C CN100334710 C CN 100334710C
Authority
CN
China
Prior art keywords
conductor
resist layer
resist
nesa coating
photomask
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2005100519669A
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English (en)
Chinese (zh)
Other versions
CN1661793A (zh
Inventor
筱原英司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Publication of CN1661793A publication Critical patent/CN1661793A/zh
Application granted granted Critical
Publication of CN100334710C publication Critical patent/CN100334710C/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/26—Devices for calling a subscriber
    • H04M1/27—Devices whereby a plurality of signals may be stored simultaneously
    • H04M1/274—Devices whereby a plurality of signals may be stored simultaneously with provision for storing more than one subscriber number at a time, e.g. using toothed disc
    • H04M1/2745—Devices whereby a plurality of signals may be stored simultaneously with provision for storing more than one subscriber number at a time, e.g. using toothed disc using static electronic memories, e.g. chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
    • G06F21/30—Authentication, i.e. establishing the identity or authorisation of security principals
    • G06F21/31—User authentication
    • G06F21/32—User authentication using biometric data, e.g. fingerprints, iris scans or voiceprints
    • G—PHYSICS
    • G10—MUSICAL INSTRUMENTS; ACOUSTICS
    • G10L—SPEECH ANALYSIS TECHNIQUES OR SPEECH SYNTHESIS; SPEECH RECOGNITION; SPEECH OR VOICE PROCESSING TECHNIQUES; SPEECH OR AUDIO CODING OR DECODING
    • G10L15/00—Speech recognition
    • G10L15/02—Feature extraction for speech recognition; Selection of recognition unit
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M3/00—Automatic or semi-automatic exchanges
    • H04M3/42—Systems providing special services or facilities to subscribers
    • H04M3/487—Arrangements for providing information services, e.g. recorded voice services or time announcements
    • H04M3/493—Interactive information services, e.g. directory enquiries ; Arrangements therefor, e.g. interactive voice response [IVR] systems or voice portals
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M2215/00—Metering arrangements; Time controlling arrangements; Time indicating arrangements
    • H04M2215/62—Called party billing, e.g. reverse billing, freephone, collect call, 0800 or 0900

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Signal Processing (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Security & Cryptography (AREA)
  • Acoustics & Sound (AREA)
  • Human Computer Interaction (AREA)
  • Audiology, Speech & Language Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Multimedia (AREA)
  • Computational Linguistics (AREA)
  • Computer Hardware Design (AREA)
  • Software Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
CNB2005100519669A 2004-02-23 2005-02-23 导体图形的制造方法 Expired - Fee Related CN100334710C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004046179A JP2005236188A (ja) 2004-02-23 2004-02-23 導体パターンの製造方法
JP046179/2004 2004-02-23

Publications (2)

Publication Number Publication Date
CN1661793A CN1661793A (zh) 2005-08-31
CN100334710C true CN100334710C (zh) 2007-08-29

Family

ID=35010980

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2005100519669A Expired - Fee Related CN100334710C (zh) 2004-02-23 2005-02-23 导体图形的制造方法

Country Status (3)

Country Link
JP (1) JP2005236188A (ko)
KR (1) KR100602912B1 (ko)
CN (1) CN100334710C (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100773588B1 (ko) * 2006-06-29 2007-11-05 한국과학기술원 폴리머 패턴 형성방법 및 이를 이용한 금속 박막 패턴,금속 패턴, 마이크로셔터, 마이크로렌즈 어레이 스탬퍼,플라스틱 몰드의 형성방법
JP4861893B2 (ja) * 2006-07-28 2012-01-25 東京エレクトロン株式会社 基板の処理方法、プログラム、コンピュータ記憶媒体及び基板の処理システム
JP6021399B2 (ja) * 2012-04-13 2016-11-09 ラピスセミコンダクタ株式会社 半導体装置の製造方法
JP5941737B2 (ja) * 2012-04-13 2016-06-29 ラピスセミコンダクタ株式会社 半導体装置の製造方法
US9293402B2 (en) 2012-04-13 2016-03-22 Lapis Semiconductor Co., Ltd. Device with pillar-shaped components

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1130291A (zh) * 1994-10-04 1996-09-04 松下电器产业株式会社 转印导体的制造方法和层迭用生片的制造方法
JP2002062638A (ja) * 2000-08-21 2002-02-28 Semiconductor Leading Edge Technologies Inc マスクブランクス、フォトマスク、パターン形成方法および半導体装置の製造方法
JP2003287872A (ja) * 2003-05-09 2003-10-10 Toppan Printing Co Ltd パターン転写方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1130291A (zh) * 1994-10-04 1996-09-04 松下电器产业株式会社 转印导体的制造方法和层迭用生片的制造方法
JP2002062638A (ja) * 2000-08-21 2002-02-28 Semiconductor Leading Edge Technologies Inc マスクブランクス、フォトマスク、パターン形成方法および半導体装置の製造方法
JP2003287872A (ja) * 2003-05-09 2003-10-10 Toppan Printing Co Ltd パターン転写方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Fabrication of fine metal microstructures packaged in thebonded glass substrates Kawamura A,Ike S,Shoji S,Conference on Design,Characterization,and Packaging for MEMS and Microelectronics 1999 *

Also Published As

Publication number Publication date
KR20060045328A (ko) 2006-05-17
CN1661793A (zh) 2005-08-31
KR100602912B1 (ko) 2006-07-19
JP2005236188A (ja) 2005-09-02

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Granted publication date: 20070829

Termination date: 20100223