JP2005236188A - 導体パターンの製造方法 - Google Patents

導体パターンの製造方法 Download PDF

Info

Publication number
JP2005236188A
JP2005236188A JP2004046179A JP2004046179A JP2005236188A JP 2005236188 A JP2005236188 A JP 2005236188A JP 2004046179 A JP2004046179 A JP 2004046179A JP 2004046179 A JP2004046179 A JP 2004046179A JP 2005236188 A JP2005236188 A JP 2005236188A
Authority
JP
Japan
Prior art keywords
resist layer
conductor pattern
transparent conductive
conductive film
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004046179A
Other languages
English (en)
Japanese (ja)
Inventor
Eiji Shinohara
英司 篠原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Priority to JP2004046179A priority Critical patent/JP2005236188A/ja
Priority to KR1020050014383A priority patent/KR100602912B1/ko
Priority to CNB2005100519669A priority patent/CN100334710C/zh
Publication of JP2005236188A publication Critical patent/JP2005236188A/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/26—Devices for calling a subscriber
    • H04M1/27—Devices whereby a plurality of signals may be stored simultaneously
    • H04M1/274—Devices whereby a plurality of signals may be stored simultaneously with provision for storing more than one subscriber number at a time, e.g. using toothed disc
    • H04M1/2745—Devices whereby a plurality of signals may be stored simultaneously with provision for storing more than one subscriber number at a time, e.g. using toothed disc using static electronic memories, e.g. chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
    • G06F21/30—Authentication, i.e. establishing the identity or authorisation of security principals
    • G06F21/31—User authentication
    • G06F21/32—User authentication using biometric data, e.g. fingerprints, iris scans or voiceprints
    • G—PHYSICS
    • G10—MUSICAL INSTRUMENTS; ACOUSTICS
    • G10L—SPEECH ANALYSIS TECHNIQUES OR SPEECH SYNTHESIS; SPEECH RECOGNITION; SPEECH OR VOICE PROCESSING TECHNIQUES; SPEECH OR AUDIO CODING OR DECODING
    • G10L15/00—Speech recognition
    • G10L15/02—Feature extraction for speech recognition; Selection of recognition unit
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M3/00—Automatic or semi-automatic exchanges
    • H04M3/42—Systems providing special services or facilities to subscribers
    • H04M3/487—Arrangements for providing information services, e.g. recorded voice services or time announcements
    • H04M3/493—Interactive information services, e.g. directory enquiries ; Arrangements therefor, e.g. interactive voice response [IVR] systems or voice portals
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M2215/00—Metering arrangements; Time controlling arrangements; Time indicating arrangements
    • H04M2215/62—Called party billing, e.g. reverse billing, freephone, collect call, 0800 or 0900

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Signal Processing (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Security & Cryptography (AREA)
  • Acoustics & Sound (AREA)
  • Human Computer Interaction (AREA)
  • Audiology, Speech & Language Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Multimedia (AREA)
  • Computational Linguistics (AREA)
  • Computer Hardware Design (AREA)
  • Software Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP2004046179A 2004-02-23 2004-02-23 導体パターンの製造方法 Pending JP2005236188A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2004046179A JP2005236188A (ja) 2004-02-23 2004-02-23 導体パターンの製造方法
KR1020050014383A KR100602912B1 (ko) 2004-02-23 2005-02-22 도체 패턴의 제조방법
CNB2005100519669A CN100334710C (zh) 2004-02-23 2005-02-23 导体图形的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004046179A JP2005236188A (ja) 2004-02-23 2004-02-23 導体パターンの製造方法

Publications (1)

Publication Number Publication Date
JP2005236188A true JP2005236188A (ja) 2005-09-02

Family

ID=35010980

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004046179A Pending JP2005236188A (ja) 2004-02-23 2004-02-23 導体パターンの製造方法

Country Status (3)

Country Link
JP (1) JP2005236188A (ko)
KR (1) KR100602912B1 (ko)
CN (1) CN100334710C (ko)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013222752A (ja) * 2012-04-13 2013-10-28 Lapis Semiconductor Co Ltd 半導体装置の製造方法
JP2013222754A (ja) * 2012-04-13 2013-10-28 Lapis Semiconductor Co Ltd 半導体装置の製造方法
US9293402B2 (en) 2012-04-13 2016-03-22 Lapis Semiconductor Co., Ltd. Device with pillar-shaped components

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100773588B1 (ko) * 2006-06-29 2007-11-05 한국과학기술원 폴리머 패턴 형성방법 및 이를 이용한 금속 박막 패턴,금속 패턴, 마이크로셔터, 마이크로렌즈 어레이 스탬퍼,플라스틱 몰드의 형성방법
JP4861893B2 (ja) * 2006-07-28 2012-01-25 東京エレクトロン株式会社 基板の処理方法、プログラム、コンピュータ記憶媒体及び基板の処理システム

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100276052B1 (ko) * 1994-10-04 2000-12-15 모리시타 요이찌 전사도체의 제조방법 및 적층용 그린시트의 제조방법
JP2002062638A (ja) * 2000-08-21 2002-02-28 Semiconductor Leading Edge Technologies Inc マスクブランクス、フォトマスク、パターン形成方法および半導体装置の製造方法
JP3760927B2 (ja) * 2003-05-09 2006-03-29 凸版印刷株式会社 パターン転写方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013222752A (ja) * 2012-04-13 2013-10-28 Lapis Semiconductor Co Ltd 半導体装置の製造方法
JP2013222754A (ja) * 2012-04-13 2013-10-28 Lapis Semiconductor Co Ltd 半導体装置の製造方法
US9293402B2 (en) 2012-04-13 2016-03-22 Lapis Semiconductor Co., Ltd. Device with pillar-shaped components
US9721879B2 (en) 2012-04-13 2017-08-01 Lapis Semiconductor Co., Ltd. Device with pillar-shaped components
US10424537B2 (en) 2012-04-13 2019-09-24 Lapis Semiconductor Co., Ltd. Device with pillar-shaped components
US10957638B2 (en) 2012-04-13 2021-03-23 Lapis Semiconductor Co., Ltd. Device with pillar-shaped components

Also Published As

Publication number Publication date
KR20060045328A (ko) 2006-05-17
KR100602912B1 (ko) 2006-07-19
CN1661793A (zh) 2005-08-31
CN100334710C (zh) 2007-08-29

Similar Documents

Publication Publication Date Title
JP4534984B2 (ja) 金属フォトエッチング製品の製造方法
JP2014027317A (ja) プリント基板の製造方法
KR20150087691A (ko) 임베디드 트레이스 기판과 그의 범프 형성 방법
KR100602912B1 (ko) 도체 패턴의 제조방법
JP2010263000A (ja) 電子部品製造方法
JP2004221450A (ja) プリント配線板およびその製造方法
CN111624851A (zh) 压印模板及其制备方法
CN110161809B (zh) 一种改进光刻胶粘结性的结构及其方法
KR20130060999A (ko) 패턴 형성 방법
CN113873771A (zh) 一种适用于超精细fpc线路的制作工艺
JP2018046223A (ja) 凹凸構造体の製造方法、インプリントモールド製造用基材、およびインプリントモールドの製造方法
JP2004218033A (ja) エッチング製品及びエッチング方法
JPH0681173A (ja) 金属膜パターン形成方法
TWI625607B (zh) 具薄膜圖案的基板及形成薄膜圖案於基板的方法
KR20060136174A (ko) 미세 패턴 형성 방법
JP2001350269A (ja) 半田印刷用マスクの製造方法
JP2004204251A (ja) 金属エッチング製品及びその製造方法
KR100917774B1 (ko) 인쇄 회로 기판의 회로 선폭 제어 방법
JP2003183811A (ja) メタルマスク、及び、その製造方法
JP2010135461A (ja) 電子部品実装用フィルムキャリアテープの製造方法
KR20030000475A (ko) 패턴 형성 방법
KR101250422B1 (ko) 액정표시장치용 고정밀 인쇄판 및 그의 제조 방법
JP2005264283A (ja) 金属エッチング製品及びその製造方法
JP4421706B2 (ja) 表面にメッキパターンを備えた金属部品の製造方法
JP2014162109A (ja) スクリーン印刷版の製造方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20060906

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20060907

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20080905

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080916

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20081113

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20090324