CH646723A5 - Epoxyharzhaltige, formbare zusammensetzung von tiefem waermeausdehnungskoeffizient und hoher thermischer leitfaehigkeit. - Google Patents

Epoxyharzhaltige, formbare zusammensetzung von tiefem waermeausdehnungskoeffizient und hoher thermischer leitfaehigkeit. Download PDF

Info

Publication number
CH646723A5
CH646723A5 CH562681A CH562681A CH646723A5 CH 646723 A5 CH646723 A5 CH 646723A5 CH 562681 A CH562681 A CH 562681A CH 562681 A CH562681 A CH 562681A CH 646723 A5 CH646723 A5 CH 646723A5
Authority
CH
Switzerland
Prior art keywords
filler
composition
weight
epoxy resin
less
Prior art date
Application number
CH562681A
Other languages
German (de)
English (en)
Inventor
Makoto Shinohara
James J Miyashiro
Original Assignee
Morton Norwich Products Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Morton Norwich Products Inc filed Critical Morton Norwich Products Inc
Publication of CH646723A5 publication Critical patent/CH646723A5/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CH562681A 1980-09-10 1981-09-01 Epoxyharzhaltige, formbare zusammensetzung von tiefem waermeausdehnungskoeffizient und hoher thermischer leitfaehigkeit. CH646723A5 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US18576580A 1980-09-10 1980-09-10

Publications (1)

Publication Number Publication Date
CH646723A5 true CH646723A5 (de) 1984-12-14

Family

ID=22682373

Family Applications (1)

Application Number Title Priority Date Filing Date
CH562681A CH646723A5 (de) 1980-09-10 1981-09-01 Epoxyharzhaltige, formbare zusammensetzung von tiefem waermeausdehnungskoeffizient und hoher thermischer leitfaehigkeit.

Country Status (5)

Country Link
JP (1) JPS6056749B2 (ja)
CH (1) CH646723A5 (ja)
DE (1) DE3135526C2 (ja)
GB (1) GB2083478B (ja)
NL (1) NL8102948A (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2129002A (en) * 1982-09-13 1984-05-10 Brian Bennett Filled thermosetting resin compositions
JPH0261947U (ja) * 1988-10-29 1990-05-09
CA2083868A1 (en) * 1990-11-14 1993-06-12 Chong Soo Lee Coated abrasive having a coating of an epoxy resin coatable from water
CA2054554A1 (en) * 1990-11-14 1992-05-15 Chong Soo Lee Coated abrasive having an overcoating of an epoxy resin coatable from water and a grinding aid
JPH06325955A (ja) * 1993-05-13 1994-11-25 Hitachi Ltd 内燃機関用点火装置及び点火装置装着型ディストリビュータ
TWI494363B (zh) * 2009-09-04 2015-08-01 Iteq Corp An epoxy resin composition and a film and a substrate made of the epoxy resin composition
US8206819B2 (en) * 2010-01-27 2012-06-26 Iteq Corporation Varnish, prepreg, and substrate thereof
RU2598861C1 (ru) * 2015-09-28 2016-09-27 Российская Федерация, от имени которой выступает Министерство промышленности и торговли Российской Федерации (Минпромторг России) Электроизоляционный заливочный компаунд
CN115805714A (zh) * 2022-12-16 2023-03-17 毫厘机电(苏州)有限公司 一种消除多材料结合热膨胀的工艺方法

Also Published As

Publication number Publication date
JPS6056749B2 (ja) 1985-12-11
DE3135526C2 (de) 1983-11-03
GB2083478B (en) 1984-03-07
NL8102948A (nl) 1982-04-01
JPS5749647A (en) 1982-03-23
GB2083478A (en) 1982-03-24
DE3135526A1 (de) 1982-04-22

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Date Code Title Description
PL Patent ceased