CH637995A5 - Method for controlling and/or regulating a copper-plating bath operating without an external power supply - Google Patents
Method for controlling and/or regulating a copper-plating bath operating without an external power supply Download PDFInfo
- Publication number
- CH637995A5 CH637995A5 CH1419677A CH1419677A CH637995A5 CH 637995 A5 CH637995 A5 CH 637995A5 CH 1419677 A CH1419677 A CH 1419677A CH 1419677 A CH1419677 A CH 1419677A CH 637995 A5 CH637995 A5 CH 637995A5
- Authority
- CH
- Switzerland
- Prior art keywords
- bath
- mixed potential
- copper
- electrode
- potential
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US74411076A | 1976-11-22 | 1976-11-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH637995A5 true CH637995A5 (en) | 1983-08-31 |
Family
ID=24991471
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH1419677A CH637995A5 (en) | 1976-11-22 | 1977-11-21 | Method for controlling and/or regulating a copper-plating bath operating without an external power supply |
Country Status (14)
| Country | Link |
|---|---|
| JP (1) | JPS5365226A (it) |
| AT (1) | AT354213B (it) |
| AU (1) | AU512805B2 (it) |
| CA (1) | CA1112523A (it) |
| CH (1) | CH637995A5 (it) |
| DE (2) | DE2751104A1 (it) |
| ES (1) | ES464266A1 (it) |
| FR (1) | FR2371522A1 (it) |
| GB (1) | GB1588758A (it) |
| IL (1) | IL53298A (it) |
| IT (1) | IT1116376B (it) |
| NL (1) | NL7712683A (it) |
| SE (1) | SE442410B (it) |
| ZA (1) | ZA775495B (it) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5953348B2 (ja) * | 1977-12-16 | 1984-12-24 | 株式会社日立製作所 | 化学銅めつき液の主成分自動管理方法並びにその装置 |
| US4276323A (en) * | 1979-12-21 | 1981-06-30 | Hitachi, Ltd. | Process for controlling of chemical copper plating solution |
| JPS6096767A (ja) * | 1983-10-31 | 1985-05-30 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | 銅めつき方法 |
| US4707377A (en) * | 1983-10-31 | 1987-11-17 | International Business Machines Corporation | Copper plating |
| JPS61110799A (ja) * | 1984-10-30 | 1986-05-29 | インタ−ナシヨナル ビジネス マシ−ンズ コ−ポレ−シヨン | 金属めつき槽の制御装置 |
| US4623554A (en) * | 1985-03-08 | 1986-11-18 | International Business Machines Corp. | Method for controlling plating rate in an electroless plating system |
| EP0265895B1 (en) * | 1986-10-31 | 1993-02-10 | AMP-AKZO CORPORATION (a Delaware corp.) | Method for electrolessly depositing high quality copper |
| US4908242A (en) * | 1986-10-31 | 1990-03-13 | Kollmorgen Corporation | Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures |
| US4774101A (en) * | 1986-12-10 | 1988-09-27 | American Telephone And Telegraph Company, At&T Technologies, Inc. | Automated method for the analysis and control of the electroless metal plating solution |
| JPS63149278U (it) * | 1987-03-19 | 1988-09-30 | ||
| DE3718584A1 (de) * | 1987-06-03 | 1988-12-15 | Norddeutsche Affinerie | Verfahren zur messung der wirksamen inhibitorkonzentration waehrend der metallabscheidung aus waessrigen elektrolyten |
| US4842886A (en) * | 1987-11-04 | 1989-06-27 | International Business Machines Corporation | Method for electroless plating |
| AU3304389A (en) * | 1988-04-29 | 1989-11-02 | Kollmorgen Corporation | Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures |
| GB2225026A (en) * | 1988-11-22 | 1990-05-23 | American Chem & Refining Co | Electroless gold plating composition |
| JP2005206931A (ja) * | 2003-12-26 | 2005-08-04 | Sumitomo Electric Ind Ltd | 金属粉末の製造方法 |
| JP5116068B2 (ja) * | 2004-09-07 | 2013-01-09 | Ｊｘ日鉱日石金属株式会社 | 無電解金めっき液の安定化方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3375178A (en) * | 1964-05-28 | 1968-03-26 | Continental Oil Co | Method of confirming the occurrence of plating in electroless nickel-plating |
| FR1522048A (fr) * | 1966-05-06 | 1968-04-19 | Photocircuits Corp | Dépôt non galvanique de métaux |
| JPS5921386B2 (ja) * | 1976-04-13 | 1984-05-19 | 株式会社東芝 | 無電解メツキのメツキ速度自動制御方法 |
-
1977
- 1977-09-13 ZA ZA00775495A patent/ZA775495B/xx unknown
- 1977-11-03 IL IL53298A patent/IL53298A/xx unknown
- 1977-11-11 DE DE19772751104 patent/DE2751104A1/de not_active Ceased
- 1977-11-11 DE DE2759952A patent/DE2759952C2/de not_active Expired
- 1977-11-17 NL NL7712683A patent/NL7712683A/xx not_active Application Discontinuation
- 1977-11-18 AU AU30760/77A patent/AU512805B2/en not_active Expired
- 1977-11-18 CA CA291,214A patent/CA1112523A/en not_active Expired
- 1977-11-18 AT AT827777A patent/AT354213B/de not_active IP Right Cessation
- 1977-11-18 ES ES464266A patent/ES464266A1/es not_active Expired
- 1977-11-21 GB GB48323/77A patent/GB1588758A/en not_active Expired
- 1977-11-21 CH CH1419677A patent/CH637995A5/de not_active IP Right Cessation
- 1977-11-22 IT IT51901/77A patent/IT1116376B/it active
- 1977-11-22 SE SE7713192A patent/SE442410B/sv not_active IP Right Cessation
- 1977-11-22 FR FR7734995A patent/FR2371522A1/fr active Granted
- 1977-11-22 JP JP14147477A patent/JPS5365226A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| DE2759952C2 (de) | 1984-03-08 |
| IT1116376B (it) | 1986-02-10 |
| JPS5365226A (en) | 1978-06-10 |
| AT354213B (de) | 1979-12-27 |
| GB1588758A (en) | 1981-04-29 |
| FR2371522B1 (it) | 1980-02-15 |
| IL53298A (en) | 1981-02-27 |
| SE7713192L (sv) | 1978-05-23 |
| ZA775495B (en) | 1978-07-26 |
| JPS5753857B2 (it) | 1982-11-15 |
| ATA827777A (de) | 1979-05-15 |
| FR2371522A1 (fr) | 1978-06-16 |
| AU3076077A (en) | 1979-05-24 |
| NL7712683A (nl) | 1978-05-24 |
| CA1112523A (en) | 1981-11-17 |
| AU512805B2 (en) | 1980-10-30 |
| DE2751104A1 (de) | 1978-05-24 |
| SE442410B (sv) | 1985-12-23 |
| IL53298A0 (en) | 1978-01-31 |
| ES464266A1 (es) | 1978-08-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PL | Patent ceased |