CH619334A5 - - Google Patents
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- Publication number
- CH619334A5 CH619334A5 CH1096377A CH1096377A CH619334A5 CH 619334 A5 CH619334 A5 CH 619334A5 CH 1096377 A CH1096377 A CH 1096377A CH 1096377 A CH1096377 A CH 1096377A CH 619334 A5 CH619334 A5 CH 619334A5
- Authority
- CH
- Switzerland
- Prior art keywords
- wire
- contacting
- clamp
- capillary
- horn
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
- H01L2224/45012—Cross-sectional shape
- H01L2224/45015—Cross-sectional shape being circular
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85203—Thermocompression bonding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH1096377A CH619334A5 (ko) | 1977-09-07 | 1977-09-07 | |
DE19782837841 DE2837841A1 (de) | 1977-09-07 | 1978-08-30 | Kontaktiereinrichtung fuer die herstellung einer drahtverbindung an einem mikroschaltkreis |
US05/938,042 US4205773A (en) | 1977-09-07 | 1978-08-30 | Contacting device for making a wire connection on a microcircuit |
GB7835565A GB2004222B (en) | 1977-09-07 | 1978-09-05 | Contacting device for producing a wire connection to a microcircuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH1096377A CH619334A5 (ko) | 1977-09-07 | 1977-09-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
CH619334A5 true CH619334A5 (ko) | 1980-09-15 |
Family
ID=4368639
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH1096377A CH619334A5 (ko) | 1977-09-07 | 1977-09-07 |
Country Status (4)
Country | Link |
---|---|
US (1) | US4205773A (ko) |
CH (1) | CH619334A5 (ko) |
DE (1) | DE2837841A1 (ko) |
GB (1) | GB2004222B (ko) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58137221A (ja) * | 1982-02-10 | 1983-08-15 | Hitachi Ltd | ワイヤボンデイング装置 |
US4475681A (en) * | 1982-05-24 | 1984-10-09 | The Micromanipulator Co., Inc. | Bonder apparatus |
GB2125720B (en) * | 1982-08-24 | 1986-11-05 | Asm Assembly Automation Ltd | Wire bonding apparatus |
US4603803A (en) * | 1982-08-24 | 1986-08-05 | Asm Assembly Automation, Ltd. | Wire bonding apparatus |
US4550871A (en) * | 1982-08-24 | 1985-11-05 | Asm Assembly Automation Ltd. | Four-motion wire bonder |
US4597522A (en) * | 1983-12-26 | 1986-07-01 | Kabushiki Kaisha Toshiba | Wire bonding method and device |
US4600138A (en) * | 1984-07-25 | 1986-07-15 | Hughes Aircraft Company | Bonding tool and clamp assembly and wire handling method |
DE3672530D1 (de) * | 1985-05-31 | 1990-08-16 | Dynapert Delvotec Sa | Verbindungskopf. |
DE19812706A1 (de) * | 1998-03-23 | 1999-10-07 | F&K Delvotec Bondtechnik Gmbh | Verfahren und Vorrichtung zum "ball-bonden" |
US20060219754A1 (en) * | 2005-03-31 | 2006-10-05 | Horst Clauberg | Bonding wire cleaning unit and method of wire bonding using same |
CN112872537A (zh) * | 2019-11-29 | 2021-06-01 | 晋城三赢精密电子有限公司 | 具有清洁功能的焊线机 |
US11842978B1 (en) * | 2022-07-15 | 2023-12-12 | Asmpt Singapore Pte. Ltd. | Wire bonding system including a wire biasing tool |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1707943A (en) * | 1929-04-02 | pocovl | ||
US2308606A (en) * | 1941-05-08 | 1943-01-19 | Bell Telephone Labor Inc | Method of making solder connections |
US3520459A (en) * | 1967-09-29 | 1970-07-14 | Texas Instruments Inc | Tape advance system |
US3643321A (en) * | 1970-06-17 | 1972-02-22 | Kulicke & Soffa Ind Inc | Method and apparatus for tailless wire bonding |
US3672556A (en) * | 1970-07-13 | 1972-06-27 | John C Diepeveen | Wire clamp |
US3863827A (en) * | 1972-11-10 | 1975-02-04 | Mech El Ind Inc | Tailless wire bonder |
US3941486A (en) * | 1974-06-03 | 1976-03-02 | The Computervision Corporation | Wire bonder |
-
1977
- 1977-09-07 CH CH1096377A patent/CH619334A5/de not_active IP Right Cessation
-
1978
- 1978-08-30 US US05/938,042 patent/US4205773A/en not_active Expired - Lifetime
- 1978-08-30 DE DE19782837841 patent/DE2837841A1/de not_active Withdrawn
- 1978-09-05 GB GB7835565A patent/GB2004222B/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
GB2004222A (en) | 1979-03-28 |
DE2837841A1 (de) | 1979-03-15 |
US4205773A (en) | 1980-06-03 |
GB2004222B (en) | 1982-03-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PL | Patent ceased |