CH619334A5 - - Google Patents

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Publication number
CH619334A5
CH619334A5 CH1096377A CH1096377A CH619334A5 CH 619334 A5 CH619334 A5 CH 619334A5 CH 1096377 A CH1096377 A CH 1096377A CH 1096377 A CH1096377 A CH 1096377A CH 619334 A5 CH619334 A5 CH 619334A5
Authority
CH
Switzerland
Prior art keywords
wire
contacting
clamp
capillary
horn
Prior art date
Application number
CH1096377A
Other languages
German (de)
English (en)
Inventor
Karl Nicklaus
Original Assignee
Esec Sales Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Esec Sales Sa filed Critical Esec Sales Sa
Priority to CH1096377A priority Critical patent/CH619334A5/de
Priority to US05/938,042 priority patent/US4205773A/en
Priority to DE19782837841 priority patent/DE2837841A1/de
Priority to GB7835565A priority patent/GB2004222B/en
Publication of CH619334A5 publication Critical patent/CH619334A5/de

Links

Classifications

    • H10W72/075—
    • H10W72/0711—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45015—Cross-sectional shape being circular
    • H10W72/07141—
    • H10W72/07168—
    • H10W72/07502—
    • H10W72/07532—
    • H10W72/07533—
    • H10W72/50—
    • H10W72/5522—

Landscapes

  • Wire Bonding (AREA)
CH1096377A 1977-09-07 1977-09-07 CH619334A5 (enExample)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CH1096377A CH619334A5 (enExample) 1977-09-07 1977-09-07
US05/938,042 US4205773A (en) 1977-09-07 1978-08-30 Contacting device for making a wire connection on a microcircuit
DE19782837841 DE2837841A1 (de) 1977-09-07 1978-08-30 Kontaktiereinrichtung fuer die herstellung einer drahtverbindung an einem mikroschaltkreis
GB7835565A GB2004222B (en) 1977-09-07 1978-09-05 Contacting device for producing a wire connection to a microcircuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH1096377A CH619334A5 (enExample) 1977-09-07 1977-09-07

Publications (1)

Publication Number Publication Date
CH619334A5 true CH619334A5 (enExample) 1980-09-15

Family

ID=4368639

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1096377A CH619334A5 (enExample) 1977-09-07 1977-09-07

Country Status (4)

Country Link
US (1) US4205773A (enExample)
CH (1) CH619334A5 (enExample)
DE (1) DE2837841A1 (enExample)
GB (1) GB2004222B (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58137221A (ja) * 1982-02-10 1983-08-15 Hitachi Ltd ワイヤボンデイング装置
US4475681A (en) * 1982-05-24 1984-10-09 The Micromanipulator Co., Inc. Bonder apparatus
US4603803A (en) * 1982-08-24 1986-08-05 Asm Assembly Automation, Ltd. Wire bonding apparatus
GB2125720B (en) * 1982-08-24 1986-11-05 Asm Assembly Automation Ltd Wire bonding apparatus
US4550871A (en) * 1982-08-24 1985-11-05 Asm Assembly Automation Ltd. Four-motion wire bonder
US4597522A (en) * 1983-12-26 1986-07-01 Kabushiki Kaisha Toshiba Wire bonding method and device
US4600138A (en) * 1984-07-25 1986-07-15 Hughes Aircraft Company Bonding tool and clamp assembly and wire handling method
DE3672530D1 (de) * 1985-05-31 1990-08-16 Dynapert Delvotec Sa Verbindungskopf.
DE19812706A1 (de) * 1998-03-23 1999-10-07 F&K Delvotec Bondtechnik Gmbh Verfahren und Vorrichtung zum "ball-bonden"
US20060219754A1 (en) * 2005-03-31 2006-10-05 Horst Clauberg Bonding wire cleaning unit and method of wire bonding using same
CN112872537A (zh) * 2019-11-29 2021-06-01 晋城三赢精密电子有限公司 具有清洁功能的焊线机
US11842978B1 (en) * 2022-07-15 2023-12-12 Asmpt Singapore Pte. Ltd. Wire bonding system including a wire biasing tool

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1707943A (en) * 1929-04-02 pocovl
US2308606A (en) * 1941-05-08 1943-01-19 Bell Telephone Labor Inc Method of making solder connections
US3520459A (en) * 1967-09-29 1970-07-14 Texas Instruments Inc Tape advance system
US3643321A (en) * 1970-06-17 1972-02-22 Kulicke & Soffa Ind Inc Method and apparatus for tailless wire bonding
US3672556A (en) * 1970-07-13 1972-06-27 John C Diepeveen Wire clamp
US3863827A (en) * 1972-11-10 1975-02-04 Mech El Ind Inc Tailless wire bonder
US3941486A (en) * 1974-06-03 1976-03-02 The Computervision Corporation Wire bonder

Also Published As

Publication number Publication date
US4205773A (en) 1980-06-03
GB2004222B (en) 1982-03-24
DE2837841A1 (de) 1979-03-15
GB2004222A (en) 1979-03-28

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Legal Events

Date Code Title Description
PL Patent ceased
PL Patent ceased