CH619334A5 - - Google Patents

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Publication number
CH619334A5
CH619334A5 CH1096377A CH1096377A CH619334A5 CH 619334 A5 CH619334 A5 CH 619334A5 CH 1096377 A CH1096377 A CH 1096377A CH 1096377 A CH1096377 A CH 1096377A CH 619334 A5 CH619334 A5 CH 619334A5
Authority
CH
Switzerland
Prior art keywords
wire
contacting
clamp
capillary
horn
Prior art date
Application number
CH1096377A
Other languages
German (de)
English (en)
Inventor
Karl Nicklaus
Original Assignee
Esec Sales Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Esec Sales Sa filed Critical Esec Sales Sa
Priority to CH1096377A priority Critical patent/CH619334A5/de
Priority to DE19782837841 priority patent/DE2837841A1/de
Priority to US05/938,042 priority patent/US4205773A/en
Priority to GB7835565A priority patent/GB2004222B/en
Publication of CH619334A5 publication Critical patent/CH619334A5/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]

Landscapes

  • Wire Bonding (AREA)
CH1096377A 1977-09-07 1977-09-07 CH619334A5 (enExample)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CH1096377A CH619334A5 (enExample) 1977-09-07 1977-09-07
DE19782837841 DE2837841A1 (de) 1977-09-07 1978-08-30 Kontaktiereinrichtung fuer die herstellung einer drahtverbindung an einem mikroschaltkreis
US05/938,042 US4205773A (en) 1977-09-07 1978-08-30 Contacting device for making a wire connection on a microcircuit
GB7835565A GB2004222B (en) 1977-09-07 1978-09-05 Contacting device for producing a wire connection to a microcircuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH1096377A CH619334A5 (enExample) 1977-09-07 1977-09-07

Publications (1)

Publication Number Publication Date
CH619334A5 true CH619334A5 (enExample) 1980-09-15

Family

ID=4368639

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1096377A CH619334A5 (enExample) 1977-09-07 1977-09-07

Country Status (4)

Country Link
US (1) US4205773A (enExample)
CH (1) CH619334A5 (enExample)
DE (1) DE2837841A1 (enExample)
GB (1) GB2004222B (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58137221A (ja) * 1982-02-10 1983-08-15 Hitachi Ltd ワイヤボンデイング装置
US4475681A (en) * 1982-05-24 1984-10-09 The Micromanipulator Co., Inc. Bonder apparatus
US4550871A (en) * 1982-08-24 1985-11-05 Asm Assembly Automation Ltd. Four-motion wire bonder
US4603803A (en) * 1982-08-24 1986-08-05 Asm Assembly Automation, Ltd. Wire bonding apparatus
GB2125720B (en) * 1982-08-24 1986-11-05 Asm Assembly Automation Ltd Wire bonding apparatus
US4597522A (en) * 1983-12-26 1986-07-01 Kabushiki Kaisha Toshiba Wire bonding method and device
US4600138A (en) * 1984-07-25 1986-07-15 Hughes Aircraft Company Bonding tool and clamp assembly and wire handling method
EP0203597B1 (en) * 1985-05-31 1990-07-11 Emhart Industries, Inc. Bonding head
DE19812706A1 (de) * 1998-03-23 1999-10-07 F&K Delvotec Bondtechnik Gmbh Verfahren und Vorrichtung zum "ball-bonden"
US20060219754A1 (en) * 2005-03-31 2006-10-05 Horst Clauberg Bonding wire cleaning unit and method of wire bonding using same
CN112872537A (zh) * 2019-11-29 2021-06-01 晋城三赢精密电子有限公司 具有清洁功能的焊线机
US11842978B1 (en) * 2022-07-15 2023-12-12 Asmpt Singapore Pte. Ltd. Wire bonding system including a wire biasing tool

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1707943A (en) * 1929-04-02 pocovl
US2308606A (en) * 1941-05-08 1943-01-19 Bell Telephone Labor Inc Method of making solder connections
US3520459A (en) * 1967-09-29 1970-07-14 Texas Instruments Inc Tape advance system
US3643321A (en) * 1970-06-17 1972-02-22 Kulicke & Soffa Ind Inc Method and apparatus for tailless wire bonding
US3672556A (en) * 1970-07-13 1972-06-27 John C Diepeveen Wire clamp
US3863827A (en) * 1972-11-10 1975-02-04 Mech El Ind Inc Tailless wire bonder
US3941486A (en) * 1974-06-03 1976-03-02 The Computervision Corporation Wire bonder

Also Published As

Publication number Publication date
GB2004222A (en) 1979-03-28
DE2837841A1 (de) 1979-03-15
GB2004222B (en) 1982-03-24
US4205773A (en) 1980-06-03

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Legal Events

Date Code Title Description
PL Patent ceased
PL Patent ceased