CH505903A - Legierung auf Kupferbasis und Verfahren zur Herstellung derselben - Google Patents

Legierung auf Kupferbasis und Verfahren zur Herstellung derselben

Info

Publication number
CH505903A
CH505903A CH1378167A CH1378167A CH505903A CH 505903 A CH505903 A CH 505903A CH 1378167 A CH1378167 A CH 1378167A CH 1378167 A CH1378167 A CH 1378167A CH 505903 A CH505903 A CH 505903A
Authority
CH
Switzerland
Prior art keywords
alloy
layer
oxidation
copper
additive
Prior art date
Application number
CH1378167A
Other languages
German (de)
English (en)
Inventor
J Caule Elmer
J Pryor Michael
R Sperry Philip
Original Assignee
Olin Mathieson
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olin Mathieson filed Critical Olin Mathieson
Publication of CH505903A publication Critical patent/CH505903A/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
    • C23C2/08—Tin or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264—Up to 3 mils
    • Y10T428/265—1 mil or less

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacture Of Alloys Or Alloy Compounds (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Contacts (AREA)
CH1378167A 1966-10-04 1967-10-02 Legierung auf Kupferbasis und Verfahren zur Herstellung derselben CH505903A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US58409766A 1966-10-04 1966-10-04

Publications (1)

Publication Number Publication Date
CH505903A true CH505903A (de) 1971-04-15

Family

ID=24335919

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1378167A CH505903A (de) 1966-10-04 1967-10-02 Legierung auf Kupferbasis und Verfahren zur Herstellung derselben

Country Status (9)

Country Link
US (1) US3475227A (xx)
AT (1) AT281439B (xx)
BE (1) BE704652A (xx)
CH (1) CH505903A (xx)
DE (1) DE1558628B2 (xx)
FR (1) FR1549380A (xx)
GB (1) GB1184118A (xx)
NL (1) NL6713475A (xx)
SE (1) SE346573B (xx)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3116680A1 (de) * 1981-04-27 1982-11-18 Siemens AG, 1000 Berlin und 8000 München Kontaktwerkstoff aus einer kupferlegierung und verfahren zu seiner herstellung

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4076560A (en) * 1976-03-15 1978-02-28 Olin Corporation Wrought copper-silicon based alloys with enhanced elasticity and method of producing same
US4071359A (en) * 1976-03-31 1978-01-31 Olin Corporation Copper base alloys
US4025367A (en) * 1976-06-28 1977-05-24 Olin Corporation Process for treating copper alloys to improve thermal stability
US4362262A (en) * 1980-06-09 1982-12-07 Olin Corporation Method of forming a composite material
US4330599A (en) * 1980-06-09 1982-05-18 Olin Corporation Composite material
JPS5935419B2 (ja) * 1981-03-25 1984-08-28 住友特殊金属株式会社 形状記憶合金
US4866571A (en) * 1982-06-21 1989-09-12 Olin Corporation Semiconductor package
US4570337A (en) * 1982-04-19 1986-02-18 Olin Corporation Method of assembling a chip carrier
US5014159A (en) * 1982-04-19 1991-05-07 Olin Corporation Semiconductor package
US4491622A (en) * 1982-04-19 1985-01-01 Olin Corporation Composites of glass-ceramic to metal seals and method of making the same
US4851615A (en) * 1982-04-19 1989-07-25 Olin Corporation Printed circuit board
US4500028A (en) * 1982-06-28 1985-02-19 Olin Corporation Method of forming a composite material having improved bond strength
US4656499A (en) * 1982-08-05 1987-04-07 Olin Corporation Hermetically sealed semiconductor casing
US4524238A (en) * 1982-12-29 1985-06-18 Olin Corporation Semiconductor packages
US4500605A (en) * 1983-02-17 1985-02-19 Olin Corporation Electrical component forming process
US4577056A (en) * 1984-04-09 1986-03-18 Olin Corporation Hermetically sealed metal package
US4862323A (en) * 1984-04-12 1989-08-29 Olin Corporation Chip carrier
US4542259A (en) * 1984-09-19 1985-09-17 Olin Corporation High density packages
US4853491A (en) * 1984-10-03 1989-08-01 Olin Corporation Chip carrier
US4897508A (en) * 1988-02-10 1990-01-30 Olin Corporation Metal electronic package
US5043222A (en) * 1988-03-17 1991-08-27 Olin Corporation Metal sealing glass composite with matched coefficients of thermal expansion
US4952531A (en) * 1988-03-17 1990-08-28 Olin Corporation Sealing glass for matched sealing of copper and copper alloys
US4967260A (en) * 1988-05-04 1990-10-30 International Electronic Research Corp. Hermetic microminiature packages
US5389223A (en) * 1988-07-23 1995-02-14 Robert Bosch Gmbh Electrochemical measuring sensor
US5047371A (en) * 1988-09-02 1991-09-10 Olin Corporation Glass/ceramic sealing system

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE908414C (de) * 1941-10-05 1954-04-05 Iahirschia Kupfer Und Messingw Verwendung einer Aluminium-Mehrstoff-Bronze
US3259491A (en) * 1963-05-21 1966-07-05 Olin Mathieson Copper base alloys and process for preparing same
US3341369A (en) * 1965-03-03 1967-09-12 Olin Mathieson Copper base alloys and process for preparing same
US3347717A (en) * 1966-10-04 1967-10-17 Olin Mathieson High strength aluminum-bronze alloy
US3366477A (en) * 1967-04-17 1968-01-30 Olin Mathieson Copper base alloys

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3116680A1 (de) * 1981-04-27 1982-11-18 Siemens AG, 1000 Berlin und 8000 München Kontaktwerkstoff aus einer kupferlegierung und verfahren zu seiner herstellung

Also Published As

Publication number Publication date
DE1558628A1 (xx) 1971-01-28
AT281439B (de) 1970-05-25
GB1184118A (en) 1970-03-11
BE704652A (xx) 1968-04-04
US3475227A (en) 1969-10-28
FR1549380A (xx) 1968-12-13
SE346573B (xx) 1972-07-10
DE1558628B2 (de) 1971-01-28
NL6713475A (xx) 1968-04-05

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Legal Events

Date Code Title Description
PL Patent ceased