GB1184118A - Copper Base Alloys and process for preparing same - Google Patents

Copper Base Alloys and process for preparing same

Info

Publication number
GB1184118A
GB1184118A GB43695/67A GB4369567A GB1184118A GB 1184118 A GB1184118 A GB 1184118A GB 43695/67 A GB43695/67 A GB 43695/67A GB 4369567 A GB4369567 A GB 4369567A GB 1184118 A GB1184118 A GB 1184118A
Authority
GB
United Kingdom
Prior art keywords
layer
stratum
elements
oxidation
temperatures
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB43695/67A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olin Corp
Original Assignee
Olin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olin Corp filed Critical Olin Corp
Publication of GB1184118A publication Critical patent/GB1184118A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
    • C23C2/08—Tin or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264—Up to 3 mils
    • Y10T428/265—1 mil or less

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacture Of Alloys Or Alloy Compounds (AREA)
  • Contacts (AREA)
  • Chemical Treatment Of Metals (AREA)

Abstract

1,184,118. Cu alloys and oxidation thereof. OLIN MATHIESON CHEMICAL CORP. Sept. 26, 1967 [Oct, 4, 1966], No.43695/67. Headings C7A and C7U. A Cu-base alloy consisting, apart from impurities, of (1) Cu, (2) 0À01-0À5% (by weight) of P, As, Sb and/or Bi, (3) 2-25% in total of two elements, with the ratio of the first to the second of said elements being 0À03: 1 to 10:1, the first element being Al, Ga, In or Be and the second element being Si, Ge, Sn or Be (for Be as the second element, Al must be the first), (4) optionally 0À05-5% of Co, Ce and/or Fe, and (5) optionally B, Mn, Zn, Cd and Be (if the latter is not already included), is made resistant to oxidation by heating it in an oxidizing environment (e.g. air, oxygen or molten NaNO 3 ) for at least 1 minute at 180‹-850‹C. At temperatures up to 400‹C., a layer 25-5000 Angstroms thick is formed, said layer consisting of an outer stratum rich in copper oxides and an inner stratum rich in oxides of said first element. At temperatures of 400‹ - 850‹ C. a second layer at least 50 Angstroms thick is formed beneath the two-stratum layer, said second layer containing a discrete dispersion of a complex oxide including at least one of the said first and second elements. The outer stratum is generally coloured, provides little or no oxidation resistance and is therefore preferably removed e.g. by dissolution in dilute H 2 SO 4 . If subsequently the inner stratum is removed, as by buffing, etching, pickling or mechanical forming, continued protection is afforded by the second layer.
GB43695/67A 1966-10-04 1967-09-26 Copper Base Alloys and process for preparing same Expired GB1184118A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US58409766A 1966-10-04 1966-10-04

Publications (1)

Publication Number Publication Date
GB1184118A true GB1184118A (en) 1970-03-11

Family

ID=24335919

Family Applications (1)

Application Number Title Priority Date Filing Date
GB43695/67A Expired GB1184118A (en) 1966-10-04 1967-09-26 Copper Base Alloys and process for preparing same

Country Status (9)

Country Link
US (1) US3475227A (en)
AT (1) AT281439B (en)
BE (1) BE704652A (en)
CH (1) CH505903A (en)
DE (1) DE1558628B2 (en)
FR (1) FR1549380A (en)
GB (1) GB1184118A (en)
NL (1) NL6713475A (en)
SE (1) SE346573B (en)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4076560A (en) * 1976-03-15 1978-02-28 Olin Corporation Wrought copper-silicon based alloys with enhanced elasticity and method of producing same
US4071359A (en) * 1976-03-31 1978-01-31 Olin Corporation Copper base alloys
US4025367A (en) * 1976-06-28 1977-05-24 Olin Corporation Process for treating copper alloys to improve thermal stability
US4362262A (en) * 1980-06-09 1982-12-07 Olin Corporation Method of forming a composite material
US4330599A (en) * 1980-06-09 1982-05-18 Olin Corporation Composite material
JPS5935419B2 (en) * 1981-03-25 1984-08-28 住友特殊金属株式会社 shape memory alloy
DE3116680A1 (en) * 1981-04-27 1982-11-18 Siemens AG, 1000 Berlin und 8000 München CONTACT MATERIAL FROM A COPPER ALLOY AND METHOD FOR THE PRODUCTION THEREOF
US4851615A (en) * 1982-04-19 1989-07-25 Olin Corporation Printed circuit board
US5014159A (en) * 1982-04-19 1991-05-07 Olin Corporation Semiconductor package
US4491622A (en) * 1982-04-19 1985-01-01 Olin Corporation Composites of glass-ceramic to metal seals and method of making the same
US4866571A (en) * 1982-06-21 1989-09-12 Olin Corporation Semiconductor package
US4570337A (en) * 1982-04-19 1986-02-18 Olin Corporation Method of assembling a chip carrier
US4500028A (en) * 1982-06-28 1985-02-19 Olin Corporation Method of forming a composite material having improved bond strength
US4656499A (en) * 1982-08-05 1987-04-07 Olin Corporation Hermetically sealed semiconductor casing
US4524238A (en) * 1982-12-29 1985-06-18 Olin Corporation Semiconductor packages
US4500605A (en) * 1983-02-17 1985-02-19 Olin Corporation Electrical component forming process
US4577056A (en) * 1984-04-09 1986-03-18 Olin Corporation Hermetically sealed metal package
US4862323A (en) * 1984-04-12 1989-08-29 Olin Corporation Chip carrier
US4542259A (en) * 1984-09-19 1985-09-17 Olin Corporation High density packages
US4853491A (en) * 1984-10-03 1989-08-01 Olin Corporation Chip carrier
US4897508A (en) * 1988-02-10 1990-01-30 Olin Corporation Metal electronic package
US4952531A (en) * 1988-03-17 1990-08-28 Olin Corporation Sealing glass for matched sealing of copper and copper alloys
US5043222A (en) * 1988-03-17 1991-08-27 Olin Corporation Metal sealing glass composite with matched coefficients of thermal expansion
US4967260A (en) * 1988-05-04 1990-10-30 International Electronic Research Corp. Hermetic microminiature packages
US5389223A (en) * 1988-07-23 1995-02-14 Robert Bosch Gmbh Electrochemical measuring sensor
US5047371A (en) * 1988-09-02 1991-09-10 Olin Corporation Glass/ceramic sealing system

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE908414C (en) * 1941-10-05 1954-04-05 Iahirschia Kupfer Und Messingw Use of an aluminum multi-component bronze
US3259491A (en) * 1963-05-21 1966-07-05 Olin Mathieson Copper base alloys and process for preparing same
US3341369A (en) * 1965-03-03 1967-09-12 Olin Mathieson Copper base alloys and process for preparing same
US3347717A (en) * 1966-10-04 1967-10-17 Olin Mathieson High strength aluminum-bronze alloy
US3366477A (en) * 1967-04-17 1968-01-30 Olin Mathieson Copper base alloys

Also Published As

Publication number Publication date
US3475227A (en) 1969-10-28
BE704652A (en) 1968-04-04
NL6713475A (en) 1968-04-05
CH505903A (en) 1971-04-15
FR1549380A (en) 1968-12-13
AT281439B (en) 1970-05-25
DE1558628B2 (en) 1971-01-28
DE1558628A1 (en) 1971-01-28
SE346573B (en) 1972-07-10

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees