CA2999401A1 - Light-emitting device, integrated light-emitting device, and light-emitting module - Google Patents
Light-emitting device, integrated light-emitting device, and light-emitting module Download PDFInfo
- Publication number
- CA2999401A1 CA2999401A1 CA2999401A CA2999401A CA2999401A1 CA 2999401 A1 CA2999401 A1 CA 2999401A1 CA 2999401 A CA2999401 A CA 2999401A CA 2999401 A CA2999401 A CA 2999401A CA 2999401 A1 CA2999401 A1 CA 2999401A1
- Authority
- CA
- Canada
- Prior art keywords
- light
- emitting device
- emitting
- emitting element
- encapsulant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
- H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
- Planar Illumination Modules (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015200445 | 2015-10-08 | ||
| JP2015-200445 | 2015-10-08 | ||
| JP2016-197968 | 2016-10-06 | ||
| JP2016197968A JP6506899B2 (ja) | 2015-10-08 | 2016-10-06 | 発光装置、集積型発光装置および発光モジュール |
| PCT/JP2016/004528 WO2017061127A1 (en) | 2015-10-08 | 2016-10-07 | Light-emitting device, integrated light-emitting device, and light-emitting module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2999401A1 true CA2999401A1 (en) | 2017-04-13 |
Family
ID=58538425
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA2999401A Pending CA2999401A1 (en) | 2015-10-08 | 2016-10-07 | Light-emitting device, integrated light-emitting device, and light-emitting module |
Country Status (8)
| Country | Link |
|---|---|
| JP (3) | JP6506899B2 (ja) |
| KR (1) | KR102632427B1 (ja) |
| CN (2) | CN113437202A (ja) |
| AU (1) | AU2016238924B2 (ja) |
| BR (1) | BR112018006931B1 (ja) |
| CA (1) | CA2999401A1 (ja) |
| RU (1) | RU2717381C2 (ja) |
| TW (2) | TWI712181B (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11201269B2 (en) | 2017-07-21 | 2021-12-14 | Nichia Corporation | Backlight including light emitting module and light reflective members |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7082273B2 (ja) * | 2017-07-21 | 2022-06-08 | 日亜化学工業株式会社 | 発光装置、集積型発光装置および発光モジュール |
| CN109390327B (zh) * | 2017-08-02 | 2020-10-30 | 吴裕朝 | 发光装置、应用其的背光模组、光源模组及其制备方法 |
| JP2019046789A (ja) * | 2017-08-31 | 2019-03-22 | 日亜化学工業株式会社 | 発光装置 |
| KR102631105B1 (ko) | 2017-08-31 | 2024-01-30 | 니치아 카가쿠 고교 가부시키가이샤 | 발광 장치 |
| JP7082272B2 (ja) * | 2017-09-27 | 2022-06-08 | 日亜化学工業株式会社 | 発光装置 |
| JP7174216B2 (ja) * | 2017-10-23 | 2022-11-17 | 日亜化学工業株式会社 | 発光モジュールおよび集積型発光モジュール |
| TWI793203B (zh) * | 2017-10-26 | 2023-02-21 | 晶元光電股份有限公司 | 發光裝置 |
| JP6870592B2 (ja) | 2017-11-24 | 2021-05-12 | 豊田合成株式会社 | 発光装置 |
| JP7177331B2 (ja) | 2018-06-29 | 2022-11-24 | 日亜化学工業株式会社 | 発光装置 |
| JP7180552B2 (ja) * | 2019-06-21 | 2022-11-30 | 豊田合成株式会社 | 発光装置の製造管理方法 |
| JP7226131B2 (ja) | 2019-06-25 | 2023-02-21 | 豊田合成株式会社 | 発光装置及びその製造方法 |
| CN112485803A (zh) * | 2019-08-21 | 2021-03-12 | Oppo广东移动通信有限公司 | 激光发射装置及制作方法、飞行时间测量装置 |
| JP7143967B1 (ja) * | 2020-10-20 | 2022-09-29 | 大日本印刷株式会社 | 面発光装置、表示装置、面発光装置用封止部材シートおよび面発光装置の製造方法 |
| CN116779744A (zh) * | 2023-06-30 | 2023-09-19 | 淮安澳洋顺昌光电技术有限公司 | 一种芯片级led封装元件 |
Family Cites Families (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6155699A (en) * | 1999-03-15 | 2000-12-05 | Agilent Technologies, Inc. | Efficient phosphor-conversion led structure |
| JP2001257381A (ja) * | 2000-03-13 | 2001-09-21 | Sharp Corp | 発光ダイオードおよびその製造方法並びに照明装置 |
| US6345903B1 (en) * | 2000-09-01 | 2002-02-12 | Citizen Electronics Co., Ltd. | Surface-mount type emitting diode and method of manufacturing same |
| US7023022B2 (en) * | 2000-11-16 | 2006-04-04 | Emcore Corporation | Microelectronic package having improved light extraction |
| JP2002280614A (ja) * | 2001-03-14 | 2002-09-27 | Citizen Electronics Co Ltd | 発光ダイオード |
| RU2207663C2 (ru) * | 2001-07-17 | 2003-06-27 | Ооо Нпц Оэп "Оптэл" | Светодиод |
| JP2004253436A (ja) * | 2003-02-18 | 2004-09-09 | Citizen Electronics Co Ltd | 発光ダイオード |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11201269B2 (en) | 2017-07-21 | 2021-12-14 | Nichia Corporation | Backlight including light emitting module and light reflective members |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2018139303A (ja) | 2018-09-06 |
| AU2016238924A1 (en) | 2017-04-27 |
| JP7175099B2 (ja) | 2022-11-18 |
| RU2018112372A3 (ja) | 2019-12-05 |
| JP2017073549A (ja) | 2017-04-13 |
| BR112018006931A2 (pt) | 2018-10-16 |
| JP2021170688A (ja) | 2021-10-28 |
| CN113437202A (zh) | 2021-09-24 |
| CN106571421B (zh) | 2021-07-09 |
| BR112018006931B1 (pt) | 2022-11-29 |
| KR102632427B1 (ko) | 2024-01-31 |
| RU2018112372A (ru) | 2019-10-07 |
| TW201724554A (zh) | 2017-07-01 |
| AU2016238924B2 (en) | 2021-06-10 |
| TWI799754B (zh) | 2023-04-21 |
| TWI712181B (zh) | 2020-12-01 |
| TW202112181A (zh) | 2021-03-16 |
| JP7252483B2 (ja) | 2023-04-05 |
| JP6506899B2 (ja) | 2019-04-24 |
| KR20170044032A (ko) | 2017-04-24 |
| RU2717381C2 (ru) | 2020-03-23 |
| CN106571421A (zh) | 2017-04-19 |
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