CA2937552C - Integrated device comprising stacked dies on redistribution layers - Google Patents

Integrated device comprising stacked dies on redistribution layers Download PDF

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Publication number
CA2937552C
CA2937552C CA2937552A CA2937552A CA2937552C CA 2937552 C CA2937552 C CA 2937552C CA 2937552 A CA2937552 A CA 2937552A CA 2937552 A CA2937552 A CA 2937552A CA 2937552 C CA2937552 C CA 2937552C
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Canada
Prior art keywords
die
interconnects
wafer level
implementations
layer
Prior art date
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Active
Application number
CA2937552A
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English (en)
French (fr)
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CA2937552A1 (en
Inventor
Urmi Ray
Shiqun Gu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qualcomm Inc
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Qualcomm Inc
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Publication date
Application filed by Qualcomm Inc filed Critical Qualcomm Inc
Publication of CA2937552A1 publication Critical patent/CA2937552A1/en
Application granted granted Critical
Publication of CA2937552C publication Critical patent/CA2937552C/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H10W70/614—
    • H10W20/20—
    • H10W70/09—
    • H10W72/0198—
    • H10W72/072—
    • H10W72/20—
    • H10W72/851—
    • H10W72/90—
    • H10W74/019—
    • H10W90/00—
    • H10W90/701—
    • H10W70/095—
    • H10W70/099—
    • H10W72/07207—
    • H10W72/241—
    • H10W72/252—
    • H10W72/29—
    • H10W72/874—
    • H10W72/9413—
    • H10W72/9415—
    • H10W72/944—
    • H10W74/142—
    • H10W90/10—
    • H10W90/20—
    • H10W90/297—
    • H10W90/722—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CA2937552A 2014-02-14 2015-02-12 Integrated device comprising stacked dies on redistribution layers Active CA2937552C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/181,371 US9583460B2 (en) 2014-02-14 2014-02-14 Integrated device comprising stacked dies on redistribution layers
US14/181,371 2014-02-14
PCT/US2015/015639 WO2015123426A2 (en) 2014-02-14 2015-02-12 Integrated device comprising stacked dies on redistribution layers

Publications (2)

Publication Number Publication Date
CA2937552A1 CA2937552A1 (en) 2015-08-20
CA2937552C true CA2937552C (en) 2019-09-10

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CA2937552A Active CA2937552C (en) 2014-02-14 2015-02-12 Integrated device comprising stacked dies on redistribution layers

Country Status (9)

Country Link
US (1) US9583460B2 (enExample)
EP (1) EP3105789B1 (enExample)
JP (2) JP6309643B2 (enExample)
KR (1) KR101872510B1 (enExample)
CN (2) CN106133897B (enExample)
BR (1) BR112016018580B1 (enExample)
CA (1) CA2937552C (enExample)
ES (1) ES2910956T3 (enExample)
WO (1) WO2015123426A2 (enExample)

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Also Published As

Publication number Publication date
CN110060974A (zh) 2019-07-26
CN110060974B (zh) 2023-02-17
EP3105789B1 (en) 2022-03-23
US20150235988A1 (en) 2015-08-20
WO2015123426A2 (en) 2015-08-20
ES2910956T3 (es) 2022-05-17
WO2015123426A3 (en) 2015-10-08
CA2937552A1 (en) 2015-08-20
EP3105789A2 (en) 2016-12-21
BR112016018580B1 (pt) 2022-09-20
BR112016018580A2 (enExample) 2017-08-08
US9583460B2 (en) 2017-02-28
JP6309643B2 (ja) 2018-04-11
KR20160122769A (ko) 2016-10-24
JP2017506001A (ja) 2017-02-23
CN106133897B (zh) 2019-07-23
JP2018082205A (ja) 2018-05-24
CN106133897A (zh) 2016-11-16
KR101872510B1 (ko) 2018-06-28

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