JP6309643B2 - 再分配層上に積層ダイを備える集積デバイス - Google Patents
再分配層上に積層ダイを備える集積デバイス Download PDFInfo
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- JP6309643B2 JP6309643B2 JP2016550864A JP2016550864A JP6309643B2 JP 6309643 B2 JP6309643 B2 JP 6309643B2 JP 2016550864 A JP2016550864 A JP 2016550864A JP 2016550864 A JP2016550864 A JP 2016550864A JP 6309643 B2 JP6309643 B2 JP 6309643B2
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Description
本出願は、内容全体が参照により本明細書に組み込まれる、2014年2月14日に米国特許商標庁に出願された、米国非仮特許出願第14/181,371号の優先権および恩典を主張する。
いくつかの新規の特徴が集積デバイス(たとえば、集積パッケージ、ウェハレベル集積パッケージデバイス)に関連し、その集積デバイスは、集積デバイスのための基部として構成される誘電体層と、誘電体層内のいくつかの再分配金属層と、誘電体層の第1の表面に結合される第1のダイと、第1のダイに結合される第2のダイとを含む。いくつかの実施態様では、誘電体層はいくつかの誘電体層を含む。いくつかの実施態様では、第1のダイは、第1の組のインターコネクトを通して再分配金属層に結合される。いくつかの実施態様では、第2のダイは1組のインターコネクトおよび1組のハンダボールを通して第1のダイに結合される。いくつかの実施態様では、第1のダイはいくつかの基板貫通ビア(TSV)を含む。いくつかの実施態様では、第2のダイは第1の組のインターコネクト、TSV、第2の組のインターコネクトおよび1組のハンダボールを通して、再分配金属層に結合される。いくつかの実施態様では、集積デバイスはさらに、第1のダイおよび第2のダイを封入する封入材を含む。いくつかの実施態様では、集積デバイスはさらに、誘電体層の第1の表面に結合される第3のダイを含む。いくつかの実施態様では、第1のダイはプロセッサであり、第2のダイはメモリダイである。
図2は、積層ダイを含む集積デバイス(たとえば、半導体デバイス、集積パッケージ、ウェハレベル集積パッケージデバイス)の側面図の一例を概念的に示す。具体的には、図2は、集積デバイス200(たとえば、集積パッケージ)を示しており、集積デバイス200は、誘電体層202と、第1の組のハンダボール204(たとえば、204a〜204d)と、第1のダイ206と、第2のダイ208と、第3のダイ210と、封入材220とを含む。異なる実施態様は、封入材220のために異なる材料を使用することができる。たとえば、封入材220は、少なくともモールド、エポキシおよび/またはポリマー充填材のうちの1つを含むことができる。ダイ(たとえば、第1のダイ206、第2のダイ208、第3のダイ210)は、メモリダイおよび/またはプロセッサのような、異なるタイプのダイを表す場合がある。ダイはさらに、図3〜図4を参照しながら以下に詳細に説明される。
いくつかの実施態様では、積層ダイを含む集積デバイス(たとえば、集積パッケージ、ウェハレベル集積パッケージデバイス)を配設することは、いくつかのプロセスを含む。図7A〜図7Cは、集積デバイスを配設する(たとえば、製造する、作製する)ための例示的なシーケンスを示す。いくつかの実施態様では、図7A〜図7Cのシーケンスを用いて、図2、および/または図5〜図6の集積デバイスまたは本開示において説明される他の集積デバイスを配設/製造/作製することができる。
図8は、集積デバイス(たとえば、集積パッケージ)を配設する(たとえば、製造する、作製する)ための例示的な方法を示す。いくつかの実施態様では、図8の方法を用いて、図2、および/または図5〜図6の集積デバイスまたは本開示において説明される他の集積デバイス(たとえば、ダイパッケージ)を配設/製造/作製することができる。
いくつかの実施態様では、積層ダイを含む集積デバイス(たとえば、集積パッケージ、ウェハレベル集積パッケージデバイス)を配設することは、いくつかのプロセスを含む。図9A〜図9Cは、集積デバイスを配設する(たとえば、製造する、作製する)ための例示的なシーケンスを示す。いくつかの実施態様では、図9A〜図9Cのシーケンスを用いて、図2、および/または図5〜図6の集積デバイスまたは本開示において説明される他の集積デバイスを配設/製造/作製することができる。
図10は、集積デバイス(たとえば、集積パッケージ)を配設する(たとえば、製造する、作製する)ための例示的な方法を示す。いくつかの実施態様では、図10の方法を用いて、図2、および/または図5〜図6の集積デバイスまたは本開示において説明される他の集積デバイス(たとえば、ダイパッケージ)を配設/製造/作製することができる。
いくつかの実施態様では、再分配層を含む集積デバイスを配設する(たとえば、製造する、作製する)ことはいくつかのプロセスを含む。図11A〜図11Cは、いくつかの再分配層を含む集積デバイスを配設するための例示的なシーケンスを示す。いくつかの実施態様では、図11A〜図11Cのシーケンスを用いて、図2〜図6の集積デバイスおよび/または本開示において説明される他の集積デバイス(たとえば、ダイ、集積デバイス)を配設/製造/作製することができる。
図12は、上記の半導体デバイス、集積回路、ダイ、インターポーザ、またはパッケージのうちのいずれかと一体に構成することができる種々の電子デバイスを示す。たとえば、モバイル電話1202、ラップトップコンピュータ1204、および定置端末1206が、本明細書において説明されたような集積回路(IC)1200を含むことができる。IC1200は、たとえば、本明細書において説明される集積回路、ダイ、またはパッケージのいずれかとすることができる。図12に示されるデバイス1202、1204、1206は例示にすぎない。限定はしないが、モバイルデバイス、ハンドヘルドパーソナル通信システム(PCS)ユニット、携帯情報端末などのポータブルデータユニット、GPS対応デバイス、ナビゲーションデバイス、セットトップボックス、音楽プレーヤ、ビデオプレーヤ、エンターテイメントユニット、メータ読取り機器などの定置データユニット、通信デバイス、スマートフォン、タブレットコンピュータ、またはデータもしくはコンピュータ命令の記憶もしくは取出しを行う任意の他のデバイス、またはそれらの任意の組合せを含む他の電子デバイスが、IC1200を採用することもできる。
102 基板
106 第1のダイ
108 第2のダイ
116 第1の組のハンダボール
118 第2の組のハンダボール
120 第3の組のハンダボール
200 集積デバイス
202 誘電体層
204 第1の組のハンダボール
204a ハンダボール
204b ハンダボール
204c ハンダボール
204d ハンダボール
206 第1のダイ
208 第2のダイ
210 第3のダイ
212 第3の組のインターコネクト
214 1組のハンダボール
216 第1の組のインターコネクト
218 第2の組のインターコネクト
219 基板貫通ビア(TSV)
220 封入材
230 第1の組の再分配インターコネクト
232 第1のアンダーバンプ(UBM)層
240 第2の組の再分配インターコネクト
242 第1のアンダーバンプ(UBM)層
250 第3の組の再分配インターコネクト
252 第3のアンダーバンプ(UBM)層
260 第4の組の再分配インターコネクト
262 第4のアンダーバンプ(UBM)層
300 ダイ
301 基板
302 下位金属層および誘電体層
311 インターコネクト
312 インターコネクト
313 インターコネクト
314 インターコネクト
315 インターコネクト
316 インターコネクト
320 封入材
400 ダイ
401 基板
402 下位金属層および誘電体層
411 インターコネクト
412 インターコネクト
413 インターコネクト
414 インターコネクト
415 インターコネクト
416 インターコネクト
420 封入材
421 第1の基板貫通ビア(TSV)
422 第2のTSV
423 第3のTSV
424 第4のTSV
500 集積デバイス
502 誘電体層
504 第1の組のハンダボール
504a ハンダボール
504b ハンダボール
504c ハンダボール
204d ハンダボール
506 第1のダイ
508 第2のダイ
510 第3のダイ
512 第3の組のインターコネクト
514 1組のハンダボール
516 第1の組のインターコネクト
518 第2の組のインターコネクト
519 1組の基板貫通ビア(TSV)
520 封入材
530 第1の組の再分配インターコネクト
532 第1のアンダーバンプ(UBM)層
540 第2の組の再分配インターコネクト
542 第1のアンダーバンプ(UBM)層
550 第3の組の再分配インターコネクト
552 第3のアンダーバンプ(UBM)層
560 第4の組の再分配インターコネクト
562 第4のアンダーバンプ(UBM)層
600 集積デバイス
602 誘電体層
604 第1の組のハンダボール
604a ハンダボール
604b ハンダボール
604c ハンダボール
604d ハンダボール
606 第1のダイ
608 第2のダイ
610 第3のダイ
611 第4のダイ
612 第3の組のインターコネクト
614 1組のハンダボール
616 第1の組のインターコネクト
618 第2の組のインターコネクト
620 封入材
622 第4の組のインターコネクト
624 1組のハンダボール
629 1組の基板貫通ビア(TSV)
630 第1の組の再分配インターコネクト
632 第1のアンダーバンプ(UBM)層
640 第2の組の再分配インターコネクト
642 第1のアンダーバンプ(UBM)層
650 第3の組の再分配インターコネクト
652 第3のアンダーバンプ(UBM)層
660 第4の組の再分配インターコネクト
662 第4のアンダーバンプ(UBM)層
700 キャリア
701 接着層
706 第1のダイ
708 第3のダイ
710 第2のダイ
712 第2の組のインターコネクト
714 1組のハンダボール
716 第1の組のインターコネクト
718 第3の組のインターコネクト
719 1組の基板貫通ビア(TSV)
720 封入層
730 第1の誘電体層
731 再分配インターコネクト
732 再分配インターコネクト
733 再分配インターコネクト
734 再分配インターコネクト
740 第2の誘電体層
741 再分配インターコネクト
742 再分配インターコネクト
743 再分配インターコネクト
744 再分配インターコネクト
750 第3の誘電体層
751 再分配インターコネクト
752 再分配インターコネクト
753 再分配インターコネクト
754 再分配インターコネクト
760 1組の誘電体層
761 第1のアンダーバンプメタライゼーション(UBM)層
762 第2のUBM層
763 第3のUBM層
764 第4のUBM層
771 第1のハンダボール
772 第2のハンダボール
773 第3のハンダボール
774 第4のハンダボール
900 キャリア
901 接着層
906 第1のダイ
908 第2のダイ
910 第3のダイ
912 第3の組のインターコネクト
914 1組のハンダボール
916 第1の組のインターコネクト
918 第2の組のインターコネクト
919 1組の基板貫通ビア(TSV)
920 封入層
930 第1の誘電体層
931 再分配インターコネクト
932 再分配インターコネクト
933 再分配インターコネクト
934 再分配インターコネクト
940 第2の誘電体層
941 再分配インターコネクト
942 再分配インターコネクト
943 再分配インターコネクト
944 再分配インターコネクト
950 第3の誘電体層
951 再分配インターコネクト
952 再分配インターコネクト
953 再分配インターコネクト
954 再分配インターコネクト
960 1組の誘電体層
961 第1のアンダーバンプメタライゼーション(UBM)層
962 第2のUBM層
963 第3のUBM層
964 第4のUBM層
971 第1のハンダボール
972 第2のハンダボール
973 第3のハンダボール
974 第4のハンダボール
1102 基部部分
1104 パッド
1106 パッシベーション層
1108 第1の絶縁層
1109 空洞
1110 第1の金属再分配層
1111 空洞
1113 空洞
1114 第2の絶縁層
1116 第3の絶縁層
1117 空洞
1120 第2の金属再分配層
1125 パッド
1129 パッド
1130 第1の金属層
1132 第2の金属層
1140 金属層
1142 金属層
1150 金属層
1152 金属層
1170 アンダーバンプメタライゼーション(UBM)層
1180 ハンダボール
1200 IC
1202 モバイル電話
1204 ラップトップコンピュータ
1206 定置端末
Claims (12)
- 集積デバイスであって、
前記集積デバイスのための基部として構成される誘電体層と、
前記誘電体層内にある複数の再分配金属層と、
前記誘電体層の第1の表面に結合される第1のウェハレベルダイであって、前記第1のウェハレベルダイは少なくとも1つの基板貫通ビア(TSV)を備え、前記第1のウェハレベルダイが第1の組のインターコネクトを介して前記複数の再分配金属層に結合され、前記第1の組のインターコネクトが金属ピラーを含む、第1のウェハレベルダイと、
前記第1のウェハレベルダイに結合される第2のウェハレベルダイであって、前記第1の組のインターコネクト、前記第1のウェハレベルダイの前記少なくとも1つの基板貫通ビア、第2の組のインターコネクト、および1組のハンダボールを介して前記複数の再分配金属層にさらに結合される、第2のウェハレベルダイと、
第3の組のインターコネクトを介して誘電体層の前記第1の表面に結合される第3のウェハレベルダイであって、第3の組のインターコネクトが金属ピラーであり、前記第3の組のインターコネクトが、前記第1の組のインターコネクトよりも垂直に長い、第3のウェハレベルダイと、を備え、
前記第3のウェハレベルダイおよび前記第3の組のインターコネクトを合わせた高さが、前記第1のウェハレベルダイおよび前記第2のウェハレベルダイを合わせた高さと同様である、集積デバイス。 - 前記誘電体層はいくつかの誘電体層を含む、請求項1に記載の集積デバイス。
- 前記第2のウェハレベルダイは前記第2の組のインターコネクトおよび前記1組のハンダボールを通して前記第1のウェハレベルダイに垂直に結合される、請求項1に記載の集積デバイス。
- 前記第1のウェハレベルダイおよび前記第2のウェハレベルダイを封入する封入層をさらに備える、請求項1に記載の集積デバイス。
- 前記第1のウェハレベルダイはプロセッサであり、前記第2のウェハレベルダイはメモリダイである、請求項1に記載の集積デバイス。
- 前記集積デバイスは、音楽プレーヤ、ビデオプレーヤ、エンターテイメントユニット、ナビゲーションデバイス、通信デバイス、モバイルデバイス、モバイルフォン、スマートフォン、携帯情報端末、定置端末、タブレットコンピュータ、および/またはラップトップコンピュータのうちの少なくとも1つに組み込まれる、請求項1に記載の集積デバイス。
- 集積デバイスのための基部として構成される誘電体層と、
前記誘電体層内の再分配インターコネクト手段と、
前記誘電体層の第1の表面に結合される第1のウェハレベルダイであって、前記第1のウェハレベルダイは少なくとも1つの基板貫通ビア(TSV)を備え、前記第1のウェハレベルダイが第1の組のインターコネクトを介して前記再分配インターコネクト手段に結合され、前記第1の組のインターコネクトが金属ピラーを含む、第1のウェハレベルダイと、
前記第1のウェハレベルダイに結合される第2のウェハレベルダイであって、前記第1の組のインターコネクト、前記第1のウェハレベルダイの前記少なくとも1つの基板貫通ビア、第2の組のインターコネクト、および1組のハンダボールを介して前記再分配インターコネクト手段にさらに結合される、第2のウェハレベルダイと、
第3の組のインターコネクトを介して誘電体層の前記第1の表面に結合される第3のウェハレベルダイであって、第3の組のインターコネクトが金属ピラーであり、前記第3の組のインターコネクトが、前記第1の組のインターコネクトよりも垂直に長い、第3のウェハレベルダイと、を備え、
前記第3のウェハレベルダイおよび前記第3の組のインターコネクトを合わせた高さが、前記第1のウェハレベルダイおよび前記第2のウェハレベルダイを合わせた高さと同様である、装置。 - 前記誘電体層はいくつかの誘電体層を含む、請求項7に記載の装置。
- 前記第2のウェハレベルダイは前記第2の組のインターコネクトおよび前記1組のハンダボールを通して前記第1のウェハレベルダイに垂直に結合される、請求項7に記載の装置。
- 前記第1のウェハレベルダイおよび前記第2のウェハレベルダイを封入する封入手段をさらに備える、請求項7に記載の装置。
- 音楽プレーヤ、ビデオプレーヤ、エンターテイメントユニット、ナビゲーションデバイス、通信デバイス、モバイルデバイス、モバイルフォン、スマートフォン、携帯情報端末、定置端末、タブレットコンピュータ、および/またはラップトップコンピュータのうちの少なくとも1つに組み込まれる、請求項7に記載の装置。
- 前記第1のウェハレベルダイはプロセッサであり、前記第2のウェハレベルダイはメモリダイである、請求項7に記載の装置。
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