CA2543518A1 - Method of forming microstructures on a substrate and a microstructured assembly used for same - Google Patents
Method of forming microstructures on a substrate and a microstructured assembly used for same Download PDFInfo
- Publication number
- CA2543518A1 CA2543518A1 CA002543518A CA2543518A CA2543518A1 CA 2543518 A1 CA2543518 A1 CA 2543518A1 CA 002543518 A CA002543518 A CA 002543518A CA 2543518 A CA2543518 A CA 2543518A CA 2543518 A1 CA2543518 A1 CA 2543518A1
- Authority
- CA
- Canada
- Prior art keywords
- ribs
- mold
- substrate
- curable material
- rib
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 110
- 238000000034 method Methods 0.000 title claims abstract description 46
- 239000000463 material Substances 0.000 claims description 108
- 230000007547 defect Effects 0.000 claims description 26
- 238000010304 firing Methods 0.000 claims description 7
- 229910010293 ceramic material Inorganic materials 0.000 claims description 2
- 238000005096 rolling process Methods 0.000 claims 1
- 230000004888 barrier function Effects 0.000 abstract description 14
- 230000000712 assembly Effects 0.000 abstract description 6
- 238000000429 assembly Methods 0.000 abstract description 6
- 239000000919 ceramic Substances 0.000 description 30
- 239000011521 glass Substances 0.000 description 20
- 238000000576 coating method Methods 0.000 description 15
- 239000011248 coating agent Substances 0.000 description 14
- 238000000465 moulding Methods 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 13
- 229910052751 metal Inorganic materials 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- 230000005855 radiation Effects 0.000 description 11
- 238000011068 loading method Methods 0.000 description 10
- 239000000203 mixture Substances 0.000 description 10
- 239000002245 particle Substances 0.000 description 10
- 239000011230 binding agent Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 229920002457 flexible plastic Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 229920002799 BoPET Polymers 0.000 description 6
- 238000001723 curing Methods 0.000 description 6
- 238000000386 microscopy Methods 0.000 description 6
- 239000002002 slurry Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 239000011261 inert gas Substances 0.000 description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 238000005245 sintering Methods 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 3
- HWSSEYVMGDIFMH-UHFFFAOYSA-N 2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOC(=O)C(C)=C HWSSEYVMGDIFMH-UHFFFAOYSA-N 0.000 description 3
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000003999 initiator Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000000399 optical microscopy Methods 0.000 description 3
- 239000004094 surface-active agent Substances 0.000 description 3
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 2
- XVZXOLOFWKSDSR-UHFFFAOYSA-N Cc1cc(C)c([C]=O)c(C)c1 Chemical group Cc1cc(C)c([C]=O)c(C)c1 XVZXOLOFWKSDSR-UHFFFAOYSA-N 0.000 description 2
- 206010073306 Exposure to radiation Diseases 0.000 description 2
- 229920001091 Poly(octyl cyanoacrylate) Polymers 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 150000001340 alkali metals Chemical class 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 description 2
- -1 e.g. Substances 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- DNORZUSMZSZZKU-UHFFFAOYSA-N ethyl 2-[5-(4-chlorophenyl)pentyl]oxirane-2-carboxylate Chemical compound C=1C=C(Cl)C=CC=1CCCCCC1(C(=O)OCC)CO1 DNORZUSMZSZZKU-UHFFFAOYSA-N 0.000 description 2
- 229920005570 flexible polymer Polymers 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 229920005862 polyol Polymers 0.000 description 2
- 150000003077 polyols Chemical class 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- YCLAMANSVUJYPT-UHFFFAOYSA-L aluminum chloride hydroxide hydrate Chemical compound O.[OH-].[Al+3].[Cl-] YCLAMANSVUJYPT-UHFFFAOYSA-L 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000001962 electrophoresis Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000007765 extrusion coating Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 238000003847 radiation curing Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/006—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character
- C03C17/008—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character comprising a mixture of materials covered by two or more of the groups C03C17/02, C03C17/06, C03C17/22 and C03C17/28
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
- B29C33/424—Moulding surfaces provided with means for marking or patterning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
- H01J11/10—AC-PDPs with at least one main electrode being out of contact with the plasma
- H01J11/12—AC-PDPs with at least one main electrode being out of contact with the plasma with main electrodes provided on both sides of the discharge space
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
- H01J11/20—Constructional details
- H01J11/34—Vessels, containers or parts thereof, e.g. substrates
- H01J11/36—Spacers, barriers, ribs, partitions or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
- H01J9/241—Manufacture or joining of vessels, leading-in conductors or bases the vessel being for a flat panel display
- H01J9/242—Spacers between faceplate and backplate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/10—Moulds or cores; Details thereof or accessories therefor with incorporated venting means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3475—Displays, monitors, TV-sets, computer screens
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/10—Deposition methods
- C03C2218/11—Deposition methods from solutions or suspensions
- C03C2218/119—Deposition methods from solutions or suspensions by printing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
- C09K2323/02—Alignment layer characterised by chemical composition
- C09K2323/021—Inorganic, e.g. glass or silicon oxide
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2211/00—Plasma display panels with alternate current induction of the discharge, e.g. AC-PDPs
- H01J2211/20—Constructional details
- H01J2211/34—Vessels, containers or parts thereof, e.g. substrates
- H01J2211/36—Spacers, barriers, ribs, partitions or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2211/00—Plasma display panels with alternate current induction of the discharge, e.g. AC-PDPs
- H01J2211/20—Constructional details
- H01J2211/34—Vessels, containers or parts thereof, e.g. substrates
- H01J2211/36—Spacers, barriers, ribs, partitions or the like
- H01J2211/361—Spacers, barriers, ribs, partitions or the like characterized by the shape
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24628—Nonplanar uniform thickness material
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Composite Materials (AREA)
- Life Sciences & Earth Sciences (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Gas-Filled Discharge Tubes (AREA)
- Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
- Surface Treatment Of Glass (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/698,200 | 2003-10-31 | ||
| US10/698,200 US7288013B2 (en) | 2003-10-31 | 2003-10-31 | Method of forming microstructures on a substrate and a microstructured assembly used for same |
| PCT/US2004/033170 WO2005042427A2 (en) | 2003-10-31 | 2004-10-08 | Method of forming microstructures on a substrate and a microstructured assembly used for same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2543518A1 true CA2543518A1 (en) | 2005-05-12 |
Family
ID=34550565
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002543518A Abandoned CA2543518A1 (en) | 2003-10-31 | 2004-10-08 | Method of forming microstructures on a substrate and a microstructured assembly used for same |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US7288013B2 (enExample) |
| EP (1) | EP1685074A2 (enExample) |
| JP (1) | JP2007513467A (enExample) |
| KR (1) | KR20060096069A (enExample) |
| CN (1) | CN100521038C (enExample) |
| CA (1) | CA2543518A1 (enExample) |
| TW (1) | TW200519415A (enExample) |
| WO (1) | WO2005042427A2 (enExample) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6761607B2 (en) * | 2000-01-11 | 2004-07-13 | 3M Innovative Properties Company | Apparatus, mold and method for producing substrate for plasma display panel |
| US7288013B2 (en) * | 2003-10-31 | 2007-10-30 | 3M Innovative Properties Company | Method of forming microstructures on a substrate and a microstructured assembly used for same |
| JP2005288933A (ja) * | 2004-04-01 | 2005-10-20 | Three M Innovative Properties Co | 可とう性成形型及びその製造方法 |
| JP4647258B2 (ja) * | 2004-07-29 | 2011-03-09 | 株式会社日立製作所 | 成形材料転写方法、基板構体 |
| KR20070055506A (ko) * | 2004-08-26 | 2007-05-30 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 롤러 상에 제공되는 분리형 몰드로 미세 구조물을 형성하는방법 |
| KR20070057855A (ko) * | 2004-08-26 | 2007-06-07 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 다중 분리형 몰드로 미세 구조물을 형성하는 방법 |
| KR20070056116A (ko) * | 2004-08-26 | 2007-05-31 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 형판을 이용하여 미세구조를 형성하는 방법 |
| JP2006147584A (ja) * | 2004-11-23 | 2006-06-08 | Lg Electronics Inc | プラズマディスプレイパネル |
| US20070018363A1 (en) * | 2005-07-20 | 2007-01-25 | 3M Innovative Properties Company | Methods of aligning mold and articles |
| US20070018348A1 (en) * | 2005-07-20 | 2007-01-25 | 3M Innovative Properties Company | Aligned mold comprising support |
| TWI265543B (en) * | 2005-11-22 | 2006-11-01 | Marketech Int Corp | The manufacturing method of the shadow mask of an opposed discharge plasma display panel |
| JP2007147829A (ja) * | 2005-11-25 | 2007-06-14 | Brother Ind Ltd | 電気泳動表示媒体における隔壁及び基板の製造方法、及び、電気泳動表示媒体 |
| US20070126158A1 (en) * | 2005-12-01 | 2007-06-07 | 3M Innovative Properties Company | Method of cleaning polymeric mold |
| KR100761137B1 (ko) * | 2006-01-05 | 2007-09-21 | 엘지전자 주식회사 | 플라즈마 디스플레이 패널 |
| KR20090043518A (ko) * | 2006-08-14 | 2009-05-06 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 표면 개질된 비-주조 영역을 갖는 몰드 |
| JP2008085323A (ja) * | 2006-08-31 | 2008-04-10 | National Institute Of Advanced Industrial & Technology | 太陽電池用透明電極基板 |
| US20080093776A1 (en) * | 2006-10-05 | 2008-04-24 | 3M Innovative Properties Company | Method of molding ultraviolet cured microstructures and molds |
| KR20100026454A (ko) * | 2008-08-29 | 2010-03-10 | 삼성전기주식회사 | 세라믹 그린시트의 제조방법 및 이를 이용한 다층 세라믹 회로기판의 제조 방법 |
| WO2010030032A1 (ja) * | 2008-09-12 | 2010-03-18 | 日本碍子株式会社 | 立体形成部製造方法 |
| WO2011068884A2 (en) * | 2009-12-01 | 2011-06-09 | University Of Massachusetts | A system for producing patterned silicon carbide structures |
| TW201341211A (zh) * | 2012-04-12 | 2013-10-16 | Inhon Internat Co Ltd | 轉印膜的製作方法 |
| KR20150028960A (ko) * | 2012-09-06 | 2015-03-17 | 에베 그룹 에. 탈너 게엠베하 | 구조 스탬프 및 구조 스탬프를 엠보싱하기 위한 장치 및 방법 |
| US8936461B2 (en) * | 2013-03-14 | 2015-01-20 | Dominic Palazzolo | Transfer device and method of using |
| DE102013107909B4 (de) * | 2013-07-24 | 2015-04-09 | Schott Ag | Verfahren und Anlage zum Einprägen einer Struktur auf einem mit einem Lack beschichteten Substrat |
| DE102014113854A1 (de) * | 2014-09-24 | 2016-03-24 | Ev Group E. Thallner Gmbh | Verfahren zur Herstellung eines optischen Glaselements |
| WO2021106557A1 (ja) * | 2019-11-28 | 2021-06-03 | 京セラ株式会社 | ミラー |
| CN118056500A (zh) * | 2022-11-18 | 2024-05-21 | 思摩尔国际控股有限公司 | 一种多孔有序基体材料及其制备方法和应用 |
Family Cites Families (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5352478A (en) | 1982-02-10 | 1994-10-04 | Dai Nippon Insatsu Kabushiki Kaisha | Plasma display panel and method of manufacturing same |
| JP2774279B2 (ja) | 1988-05-12 | 1998-07-09 | 大日本印刷株式会社 | レンズシートの製造方法 |
| US5183597A (en) | 1989-02-10 | 1993-02-02 | Minnesota Mining And Manufacturing Company | Method of molding microstructure bearing composite plastic articles |
| US5175030A (en) | 1989-02-10 | 1992-12-29 | Minnesota Mining And Manufacturing Company | Microstructure-bearing composite plastic articles and method of making |
| DE69019010T2 (de) | 1989-02-10 | 1996-01-18 | Dainippon Printing Co Ltd | Plasma-Anzeigetafel und Herstellungsverfahren derselben. |
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| US6352763B1 (en) | 1998-12-23 | 2002-03-05 | 3M Innovative Properties Company | Curable slurry for forming ceramic microstructures on a substrate using a mold |
| KR100721730B1 (ko) | 1999-09-13 | 2007-06-04 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 플라즈마 디스플레이 패널용 기판의 제조 방법과 그것을위한 몰드 |
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| US6761607B2 (en) | 2000-01-11 | 2004-07-13 | 3M Innovative Properties Company | Apparatus, mold and method for producing substrate for plasma display panel |
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| US7033534B2 (en) | 2001-10-09 | 2006-04-25 | 3M Innovative Properties Company | Method for forming microstructures on a substrate using a mold |
| JP4326190B2 (ja) | 2002-07-10 | 2009-09-02 | スリーエム イノベイティブ プロパティズ カンパニー | 可とう性成形型及びその製造方法 |
| JP3986386B2 (ja) | 2002-07-17 | 2007-10-03 | スリーエム イノベイティブ プロパティズ カンパニー | 微細構造体の製造方法 |
| JP4179853B2 (ja) | 2002-11-13 | 2008-11-12 | スリーエム イノベイティブ プロパティズ カンパニー | 可とう性成形型及び微細構造体の製造方法 |
| US20060225463A1 (en) * | 2003-07-31 | 2006-10-12 | Takaki Sugimoto | Master mold for duplicating fine structure and production method thereof |
| JP2005066836A (ja) * | 2003-08-22 | 2005-03-17 | Three M Innovative Properties Co | 可とう性成形型及びその製造方法ならびに微細構造体の製造方法 |
| US7288013B2 (en) * | 2003-10-31 | 2007-10-30 | 3M Innovative Properties Company | Method of forming microstructures on a substrate and a microstructured assembly used for same |
| JP2005288933A (ja) * | 2004-04-01 | 2005-10-20 | Three M Innovative Properties Co | 可とう性成形型及びその製造方法 |
-
2003
- 2003-10-31 US US10/698,200 patent/US7288013B2/en not_active Expired - Fee Related
-
2004
- 2004-10-08 JP JP2006538030A patent/JP2007513467A/ja active Pending
- 2004-10-08 KR KR1020067008238A patent/KR20060096069A/ko not_active Ceased
- 2004-10-08 CN CNB2004800322279A patent/CN100521038C/zh not_active Expired - Fee Related
- 2004-10-08 EP EP04816912A patent/EP1685074A2/en not_active Withdrawn
- 2004-10-08 WO PCT/US2004/033170 patent/WO2005042427A2/en not_active Ceased
- 2004-10-08 CA CA002543518A patent/CA2543518A1/en not_active Abandoned
- 2004-10-29 TW TW093133059A patent/TW200519415A/zh unknown
-
2007
- 2007-08-29 US US11/846,784 patent/US20110039040A9/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| JP2007513467A (ja) | 2007-05-24 |
| EP1685074A2 (en) | 2006-08-02 |
| US7288013B2 (en) | 2007-10-30 |
| US20050093202A1 (en) | 2005-05-05 |
| US20110039040A9 (en) | 2011-02-17 |
| WO2005042427A2 (en) | 2005-05-12 |
| KR20060096069A (ko) | 2006-09-05 |
| TW200519415A (en) | 2005-06-16 |
| CN100521038C (zh) | 2009-07-29 |
| US20090061116A1 (en) | 2009-03-05 |
| CN1875448A (zh) | 2006-12-06 |
| WO2005042427A3 (en) | 2005-07-07 |
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