CA2532959C - Failure analysis methods and systems - Google Patents

Failure analysis methods and systems Download PDF

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Publication number
CA2532959C
CA2532959C CA2532959A CA2532959A CA2532959C CA 2532959 C CA2532959 C CA 2532959C CA 2532959 A CA2532959 A CA 2532959A CA 2532959 A CA2532959 A CA 2532959A CA 2532959 C CA2532959 C CA 2532959C
Authority
CA
Canada
Prior art keywords
laser beam
integrated circuit
laser
encapsulated
onto
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CA2532959A
Other languages
English (en)
French (fr)
Other versions
CA2532959A1 (en
Inventor
Gregory B. Anderson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Control Laser Corp
Original Assignee
Control Laser Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=34102724&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CA2532959(C) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Control Laser Corp filed Critical Control Laser Corp
Publication of CA2532959A1 publication Critical patent/CA2532959A1/en
Application granted granted Critical
Publication of CA2532959C publication Critical patent/CA2532959C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least two axial directions, e.g. in a plane
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2898—Sample preparation, e.g. removing encapsulation, etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic materials
    • B23K2103/42—Plastics other than composite materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Laser Beam Processing (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
CA2532959A 2003-07-15 2004-07-15 Failure analysis methods and systems Expired - Fee Related CA2532959C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US48787003P 2003-07-15 2003-07-15
US60/487,870 2003-07-15
PCT/US2004/023232 WO2005010945A2 (en) 2003-07-15 2004-07-15 Failure analysis methods and systems

Publications (2)

Publication Number Publication Date
CA2532959A1 CA2532959A1 (en) 2005-02-03
CA2532959C true CA2532959C (en) 2014-09-16

Family

ID=34102724

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2532959A Expired - Fee Related CA2532959C (en) 2003-07-15 2004-07-15 Failure analysis methods and systems

Country Status (7)

Country Link
US (1) US7271012B2 (https=)
EP (1) EP1652221A4 (https=)
JP (2) JP4843488B2 (https=)
KR (1) KR101161886B1 (https=)
CN (1) CN100418195C (https=)
CA (1) CA2532959C (https=)
WO (1) WO2005010945A2 (https=)

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US7705267B2 (en) * 2005-06-30 2010-04-27 Jon Heyl Semiconductor failure analysis tool
JP4958507B2 (ja) * 2006-09-15 2012-06-20 株式会社キーエンス レーザ加工装置
US20110089152A1 (en) * 2009-10-16 2011-04-21 Control Systemation, Inc. Method and system for exposing delicate structures of a device encapsulated in a mold compound
CN102658423A (zh) * 2010-07-30 2012-09-12 高洪波 智能化视觉定位+激光束同轴高精度实时激光加工系统
US20130153552A1 (en) * 2011-12-14 2013-06-20 Gwangju Institute Of Science And Technology Scribing apparatus and method for having analysis function of material distribution
JP5574354B2 (ja) * 2012-03-09 2014-08-20 株式会社トヨコー 塗膜除去方法及びレーザー塗膜除去装置
CN104275552A (zh) * 2013-07-10 2015-01-14 苏州矽微电子科技有限公司 激光器去除集成电路塑封膜的用途
US10923689B2 (en) 2018-01-25 2021-02-16 OLEDWorks LLC Method for mask-free OLED deposition and manufacture
US11342256B2 (en) 2019-01-24 2022-05-24 Applied Materials, Inc. Method of fine redistribution interconnect formation for advanced packaging applications
IT201900006736A1 (it) 2019-05-10 2020-11-10 Applied Materials Inc Procedimenti di fabbricazione di package
IT201900006740A1 (it) 2019-05-10 2020-11-10 Applied Materials Inc Procedimenti di strutturazione di substrati
US11931855B2 (en) 2019-06-17 2024-03-19 Applied Materials, Inc. Planarization methods for packaging substrates
US20210107094A1 (en) * 2019-10-14 2021-04-15 Haesung Ds Co., Ltd. Apparatus for and method of polishing surface of substrate
US11069537B2 (en) * 2019-10-18 2021-07-20 Hamilton Sundstrand Corporation Method for delidding a hermetically sealed circuit package
US11862546B2 (en) 2019-11-27 2024-01-02 Applied Materials, Inc. Package core assembly and fabrication methods
EP4094289A1 (en) 2020-01-24 2022-11-30 3M Innovative Properties Company Electrical connections to embedded electronic components
US11257790B2 (en) 2020-03-10 2022-02-22 Applied Materials, Inc. High connectivity device stacking
US11454884B2 (en) 2020-04-15 2022-09-27 Applied Materials, Inc. Fluoropolymer stamp fabrication method
US11400545B2 (en) 2020-05-11 2022-08-02 Applied Materials, Inc. Laser ablation for package fabrication
US11232951B1 (en) 2020-07-14 2022-01-25 Applied Materials, Inc. Method and apparatus for laser drilling blind vias
US11676832B2 (en) 2020-07-24 2023-06-13 Applied Materials, Inc. Laser ablation system for package fabrication
US11521937B2 (en) 2020-11-16 2022-12-06 Applied Materials, Inc. Package structures with built-in EMI shielding
US11404318B2 (en) 2020-11-20 2022-08-02 Applied Materials, Inc. Methods of forming through-silicon vias in substrates for advanced packaging
WO2022186767A1 (en) * 2021-03-03 2022-09-09 Lim Meng Keong An integrated x-ray imaging and laser ablating system for precision micromachining
US11705365B2 (en) 2021-05-18 2023-07-18 Applied Materials, Inc. Methods of micro-via formation for advanced packaging
US12183684B2 (en) 2021-10-26 2024-12-31 Applied Materials, Inc. Semiconductor device packaging methods
US12487417B2 (en) 2022-10-04 2025-12-02 Applied Materials, Inc. Photonic glass layer substrate with embedded optical structures for communicating with an electro optical integrated circuit
US12345934B2 (en) 2022-10-04 2025-07-01 Applied Materials, Inc. Methods for fabrication of optical structures on photonic glass layer substrates

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Also Published As

Publication number Publication date
JP2010142878A (ja) 2010-07-01
WO2005010945A3 (en) 2006-01-05
KR20060054309A (ko) 2006-05-22
JP2007534930A (ja) 2007-11-29
EP1652221A2 (en) 2006-05-03
WO2005010945A2 (en) 2005-02-03
US20050064682A1 (en) 2005-03-24
KR101161886B1 (ko) 2012-07-11
JP4843488B2 (ja) 2011-12-21
CN1836314A (zh) 2006-09-20
US7271012B2 (en) 2007-09-18
CA2532959A1 (en) 2005-02-03
EP1652221A4 (en) 2007-10-17
CN100418195C (zh) 2008-09-10

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Effective date: 20170717