KR101161886B1 - 파손 분석 방법 및 시스템 - Google Patents

파손 분석 방법 및 시스템 Download PDF

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Publication number
KR101161886B1
KR101161886B1 KR1020067000841A KR20067000841A KR101161886B1 KR 101161886 B1 KR101161886 B1 KR 101161886B1 KR 1020067000841 A KR1020067000841 A KR 1020067000841A KR 20067000841 A KR20067000841 A KR 20067000841A KR 101161886 B1 KR101161886 B1 KR 101161886B1
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South Korea
Prior art keywords
laser beam
integrated circuit
laser
pattern
encapsulated
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Expired - Fee Related
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KR1020067000841A
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English (en)
Korean (ko)
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KR20060054309A (ko
Inventor
그레고리 비. 앤더슨
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컨트롤 시스테메이션, 인크.
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Application filed by 컨트롤 시스테메이션, 인크. filed Critical 컨트롤 시스테메이션, 인크.
Publication of KR20060054309A publication Critical patent/KR20060054309A/ko
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Assigned to 컨트롤 레이저 코포레이션 reassignment 컨트롤 레이저 코포레이션 권리의 전부이전등록 Assignors: 컨트롤 시스테메이션, 인크.
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least two axial directions, e.g. in a plane
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2898—Sample preparation, e.g. removing encapsulation, etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic materials
    • B23K2103/42—Plastics other than composite materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Laser Beam Processing (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020067000841A 2003-07-15 2004-07-15 파손 분석 방법 및 시스템 Expired - Fee Related KR101161886B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US48787003P 2003-07-15 2003-07-15
US60/487,870 2003-07-15
PCT/US2004/023232 WO2005010945A2 (en) 2003-07-15 2004-07-15 Failure analysis methods and systems

Publications (2)

Publication Number Publication Date
KR20060054309A KR20060054309A (ko) 2006-05-22
KR101161886B1 true KR101161886B1 (ko) 2012-07-11

Family

ID=34102724

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020067000841A Expired - Fee Related KR101161886B1 (ko) 2003-07-15 2004-07-15 파손 분석 방법 및 시스템

Country Status (7)

Country Link
US (1) US7271012B2 (https=)
EP (1) EP1652221A4 (https=)
JP (2) JP4843488B2 (https=)
KR (1) KR101161886B1 (https=)
CN (1) CN100418195C (https=)
CA (1) CA2532959C (https=)
WO (1) WO2005010945A2 (https=)

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US7705267B2 (en) * 2005-06-30 2010-04-27 Jon Heyl Semiconductor failure analysis tool
JP4958507B2 (ja) * 2006-09-15 2012-06-20 株式会社キーエンス レーザ加工装置
US20110089152A1 (en) * 2009-10-16 2011-04-21 Control Systemation, Inc. Method and system for exposing delicate structures of a device encapsulated in a mold compound
CN102658423A (zh) * 2010-07-30 2012-09-12 高洪波 智能化视觉定位+激光束同轴高精度实时激光加工系统
US20130153552A1 (en) * 2011-12-14 2013-06-20 Gwangju Institute Of Science And Technology Scribing apparatus and method for having analysis function of material distribution
JP5574354B2 (ja) * 2012-03-09 2014-08-20 株式会社トヨコー 塗膜除去方法及びレーザー塗膜除去装置
CN104275552A (zh) * 2013-07-10 2015-01-14 苏州矽微电子科技有限公司 激光器去除集成电路塑封膜的用途
US10923689B2 (en) 2018-01-25 2021-02-16 OLEDWorks LLC Method for mask-free OLED deposition and manufacture
US11342256B2 (en) 2019-01-24 2022-05-24 Applied Materials, Inc. Method of fine redistribution interconnect formation for advanced packaging applications
IT201900006736A1 (it) 2019-05-10 2020-11-10 Applied Materials Inc Procedimenti di fabbricazione di package
IT201900006740A1 (it) 2019-05-10 2020-11-10 Applied Materials Inc Procedimenti di strutturazione di substrati
US11931855B2 (en) 2019-06-17 2024-03-19 Applied Materials, Inc. Planarization methods for packaging substrates
US20210107094A1 (en) * 2019-10-14 2021-04-15 Haesung Ds Co., Ltd. Apparatus for and method of polishing surface of substrate
US11069537B2 (en) * 2019-10-18 2021-07-20 Hamilton Sundstrand Corporation Method for delidding a hermetically sealed circuit package
US11862546B2 (en) 2019-11-27 2024-01-02 Applied Materials, Inc. Package core assembly and fabrication methods
EP4094289A1 (en) 2020-01-24 2022-11-30 3M Innovative Properties Company Electrical connections to embedded electronic components
US11257790B2 (en) 2020-03-10 2022-02-22 Applied Materials, Inc. High connectivity device stacking
US11454884B2 (en) 2020-04-15 2022-09-27 Applied Materials, Inc. Fluoropolymer stamp fabrication method
US11400545B2 (en) 2020-05-11 2022-08-02 Applied Materials, Inc. Laser ablation for package fabrication
US11232951B1 (en) 2020-07-14 2022-01-25 Applied Materials, Inc. Method and apparatus for laser drilling blind vias
US11676832B2 (en) 2020-07-24 2023-06-13 Applied Materials, Inc. Laser ablation system for package fabrication
US11521937B2 (en) 2020-11-16 2022-12-06 Applied Materials, Inc. Package structures with built-in EMI shielding
US11404318B2 (en) 2020-11-20 2022-08-02 Applied Materials, Inc. Methods of forming through-silicon vias in substrates for advanced packaging
WO2022186767A1 (en) * 2021-03-03 2022-09-09 Lim Meng Keong An integrated x-ray imaging and laser ablating system for precision micromachining
US11705365B2 (en) 2021-05-18 2023-07-18 Applied Materials, Inc. Methods of micro-via formation for advanced packaging
US12183684B2 (en) 2021-10-26 2024-12-31 Applied Materials, Inc. Semiconductor device packaging methods
US12487417B2 (en) 2022-10-04 2025-12-02 Applied Materials, Inc. Photonic glass layer substrate with embedded optical structures for communicating with an electro optical integrated circuit
US12345934B2 (en) 2022-10-04 2025-07-01 Applied Materials, Inc. Methods for fabrication of optical structures on photonic glass layer substrates

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Also Published As

Publication number Publication date
JP2010142878A (ja) 2010-07-01
WO2005010945A3 (en) 2006-01-05
KR20060054309A (ko) 2006-05-22
JP2007534930A (ja) 2007-11-29
CA2532959C (en) 2014-09-16
EP1652221A2 (en) 2006-05-03
WO2005010945A2 (en) 2005-02-03
US20050064682A1 (en) 2005-03-24
JP4843488B2 (ja) 2011-12-21
CN1836314A (zh) 2006-09-20
US7271012B2 (en) 2007-09-18
CA2532959A1 (en) 2005-02-03
EP1652221A4 (en) 2007-10-17
CN100418195C (zh) 2008-09-10

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