CA2495095A1 - Polyamide molding compositions and electrical and electronic components molded therefrom having improved heat stability - Google Patents
Polyamide molding compositions and electrical and electronic components molded therefrom having improved heat stability Download PDFInfo
- Publication number
- CA2495095A1 CA2495095A1 CA002495095A CA2495095A CA2495095A1 CA 2495095 A1 CA2495095 A1 CA 2495095A1 CA 002495095 A CA002495095 A CA 002495095A CA 2495095 A CA2495095 A CA 2495095A CA 2495095 A1 CA2495095 A1 CA 2495095A1
- Authority
- CA
- Canada
- Prior art keywords
- terephthalic acid
- acid
- diaminodecane
- diaminododecane
- terephthalic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 229920002647 polyamide Polymers 0.000 title claims abstract description 36
- 239000004952 Polyamide Substances 0.000 title claims abstract description 35
- 239000000203 mixture Substances 0.000 title claims abstract description 34
- 238000000465 moulding Methods 0.000 title claims abstract description 10
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims abstract description 186
- -1 aliphatic diamine Chemical class 0.000 claims abstract description 25
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000011256 inorganic filler Substances 0.000 claims abstract description 7
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 7
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims description 58
- YQLZOAVZWJBZSY-UHFFFAOYSA-N decane-1,10-diamine Chemical compound NCCCCCCCCCCN YQLZOAVZWJBZSY-UHFFFAOYSA-N 0.000 claims description 49
- QFTYSVGGYOXFRQ-UHFFFAOYSA-N dodecane-1,12-diamine Chemical compound NCCCCCCCCCCCCN QFTYSVGGYOXFRQ-UHFFFAOYSA-N 0.000 claims description 48
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 claims description 42
- 239000001361 adipic acid Substances 0.000 claims description 30
- 235000011037 adipic acid Nutrition 0.000 claims description 29
- 239000003063 flame retardant Substances 0.000 claims description 16
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 claims description 14
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 claims description 14
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 claims description 14
- QFGCFKJIPBRJGM-UHFFFAOYSA-N 12-[(2-methylpropan-2-yl)oxy]-12-oxododecanoic acid Chemical compound CC(C)(C)OC(=O)CCCCCCCCCCC(O)=O QFGCFKJIPBRJGM-UHFFFAOYSA-N 0.000 claims description 13
- 239000003365 glass fiber Substances 0.000 claims description 9
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical class NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 claims description 8
- 150000003951 lactams Chemical class 0.000 claims description 8
- 238000002844 melting Methods 0.000 claims description 8
- GUOSQNAUYHMCRU-UHFFFAOYSA-N 11-Aminoundecanoic acid Chemical compound NCCCCCCCCCCC(O)=O GUOSQNAUYHMCRU-UHFFFAOYSA-N 0.000 claims description 7
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 claims description 7
- 239000011521 glass Substances 0.000 claims description 7
- 239000012744 reinforcing agent Substances 0.000 claims description 7
- 239000004793 Polystyrene Substances 0.000 claims description 6
- LJCFOYOSGPHIOO-UHFFFAOYSA-N antimony pentoxide Chemical compound O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 claims description 6
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 claims description 6
- 229920001577 copolymer Polymers 0.000 claims description 6
- MGPUUXGHLCLLKJ-UHFFFAOYSA-N dodecanedioic acid;terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1.OC(=O)CCCCCCCCCCC(O)=O MGPUUXGHLCLLKJ-UHFFFAOYSA-N 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 229920002223 polystyrene Polymers 0.000 claims description 6
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims description 5
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052794 bromium Inorganic materials 0.000 claims description 5
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 4
- 125000003118 aryl group Chemical group 0.000 claims description 4
- 229910052801 chlorine Inorganic materials 0.000 claims description 4
- 239000000460 chlorine Substances 0.000 claims description 4
- 150000004985 diamines Chemical class 0.000 claims description 4
- CYLVUSZHVURAOY-UHFFFAOYSA-N 2,2-dibromoethenylbenzene Chemical compound BrC(Br)=CC1=CC=CC=C1 CYLVUSZHVURAOY-UHFFFAOYSA-N 0.000 claims description 3
- 239000005995 Aluminium silicate Substances 0.000 claims description 3
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 3
- 125000001931 aliphatic group Chemical group 0.000 claims description 3
- 235000012211 aluminium silicate Nutrition 0.000 claims description 3
- 239000011324 bead Substances 0.000 claims description 3
- 239000004917 carbon fiber Substances 0.000 claims description 3
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 3
- 239000010445 mica Substances 0.000 claims description 3
- 229910052618 mica group Inorganic materials 0.000 claims description 3
- 239000000454 talc Substances 0.000 claims description 3
- 229910052623 talc Inorganic materials 0.000 claims description 3
- NSBGJRFJIJFMGW-UHFFFAOYSA-N trisodium;stiborate Chemical compound [Na+].[Na+].[Na+].[O-][Sb]([O-])([O-])=O NSBGJRFJIJFMGW-UHFFFAOYSA-N 0.000 claims description 3
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 claims description 3
- 239000010456 wollastonite Substances 0.000 claims description 3
- 229910052882 wollastonite Inorganic materials 0.000 claims description 3
- 239000012796 inorganic flame retardant Substances 0.000 abstract 1
- 239000000178 monomer Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 10
- 239000004615 ingredient Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 230000001143 conditioned effect Effects 0.000 description 3
- 239000000314 lubricant Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000010128 melt processing Methods 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000004609 Impact Modifier Substances 0.000 description 2
- 239000006057 Non-nutritive feed additive Substances 0.000 description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- TVIDDXQYHWJXFK-UHFFFAOYSA-N dodecanedioic acid Chemical compound OC(=O)CCCCCCCCCCC(O)=O TVIDDXQYHWJXFK-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 239000012760 heat stabilizer Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- JZUHIOJYCPIVLQ-UHFFFAOYSA-N 2-methylpentane-1,5-diamine Chemical compound NCC(C)CCCN JZUHIOJYCPIVLQ-UHFFFAOYSA-N 0.000 description 1
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 1
- 229910021538 borax Inorganic materials 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 150000001733 carboxylic acid esters Chemical class 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- FAVDVUWGQXXIIV-UHFFFAOYSA-N decane-1,10-diamine;terephthalic acid Chemical compound NCCCCCCCCCCN.OC(=O)C1=CC=C(C(O)=O)C=C1 FAVDVUWGQXXIIV-UHFFFAOYSA-N 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 150000005690 diesters Chemical class 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 229920005648 ethylene methacrylic acid copolymer Polymers 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- XTBMQKZEIICCCS-UHFFFAOYSA-N hexane-1,5-diamine Chemical compound CC(N)CCCCN XTBMQKZEIICCCS-UHFFFAOYSA-N 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 1
- 239000004328 sodium tetraborate Substances 0.000 description 1
- 235000010339 sodium tetraborate Nutrition 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- WGKLIJDVPACLGG-UHFFFAOYSA-N trizinc diborate hydrate Chemical compound O.[Zn++].[Zn++].[Zn++].[O-]B([O-])[O-].[O-]B([O-])[O-] WGKLIJDVPACLGG-UHFFFAOYSA-N 0.000 description 1
- 239000003039 volatile agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/02—Halogenated hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/016—Flame-proofing or flame-retarding additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/18—Homopolymers or copolymers of aromatic monomers containing elements other than carbon and hydrogen
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polyamides (AREA)
- Connector Housings Or Holding Contact Members (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US40235502P | 2002-08-09 | 2002-08-09 | |
| US60/402,355 | 2002-08-09 | ||
| PCT/US2003/025024 WO2004015010A1 (en) | 2002-08-09 | 2003-08-08 | Polyamide molding compositions and electrical and electronic components molded therefrom having improved heat stability |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2495095A1 true CA2495095A1 (en) | 2004-02-19 |
Family
ID=31715840
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002495095A Abandoned CA2495095A1 (en) | 2002-08-09 | 2003-08-08 | Polyamide molding compositions and electrical and electronic components molded therefrom having improved heat stability |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20040077769A1 (enExample) |
| EP (1) | EP1539885A1 (enExample) |
| JP (1) | JP2005535754A (enExample) |
| CN (1) | CN100349977C (enExample) |
| AU (1) | AU2003259730A1 (enExample) |
| CA (1) | CA2495095A1 (enExample) |
| WO (1) | WO2004015010A1 (enExample) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060293497A1 (en) | 2005-06-10 | 2006-12-28 | Martens Marvin M | Articles of manufacture made from polyamide resins and suitable for incorporation into LED reflector applications |
| US20060293435A1 (en) * | 2005-06-10 | 2006-12-28 | Marens Marvin M | Light-emitting diode assembly housing comprising high temperature polyamide compositions |
| DE502008000140D1 (de) * | 2007-05-03 | 2009-11-26 | Ems Patent Ag | Teilaromatische Polyamidformmassen und deren Verwendungen |
| FR2934864B1 (fr) * | 2008-08-08 | 2012-05-25 | Arkema France | Polyamide semi-aromatique a terminaison de chaine |
| FR2934865B1 (fr) * | 2008-08-08 | 2010-08-27 | Arkema France | Copolyamide semi-aromatique et son procede de preparation |
| KR20110133041A (ko) * | 2009-03-11 | 2011-12-09 | 이 아이 듀폰 디 네모아 앤드 캄파니 | 내염성 폴리아미드 조성물 |
| EP2325260B1 (de) | 2009-11-23 | 2016-04-27 | Ems-Patent Ag | Teilaromatische Formmassen und deren Verwendungen |
| WO2011074536A1 (ja) * | 2009-12-14 | 2011-06-23 | 東洋紡績株式会社 | 共重合ポリアミド |
| FR2954773B1 (fr) * | 2009-12-24 | 2013-01-04 | Arkema France | Polyamide semi-aromatique, son procede de preparation, composition comprenant un tel polyamide et leurs utilisations |
| JP5668387B2 (ja) * | 2010-09-21 | 2015-02-12 | 東洋紡株式会社 | 中空成形体用強化ポリアミド樹脂組成物およびそれを用いた中空成形体 |
| JP5648426B2 (ja) * | 2010-11-01 | 2015-01-07 | 東洋紡株式会社 | ポリアミド樹脂組成物およびポリアミド樹脂発泡成形体 |
| CN102796257B (zh) * | 2012-01-06 | 2014-04-30 | 东莞市信诺橡塑工业有限公司 | 一种长碳链半芳香族聚酰胺及其合成方法 |
| JP6146063B2 (ja) * | 2013-03-08 | 2017-06-14 | 東洋紡株式会社 | 圧縮成形用炭素長繊維強化ポリアミド複合材料 |
| CN103254422B (zh) * | 2013-05-20 | 2016-04-27 | 金发科技股份有限公司 | 一种聚酰胺树脂及由其组成的聚酰胺组合物 |
| EP2821426A1 (en) * | 2013-07-03 | 2015-01-07 | Universita' Degli Studi Di Milano | Polymers with complex macromolecular architecture having flame-retardant properties |
| CN106633858B (zh) * | 2017-01-10 | 2019-01-04 | 江门市德众泰工程塑胶科技有限公司 | 一种聚酰胺树脂复合材料及其制备方法和应用 |
| FR3094010B1 (fr) * | 2019-03-21 | 2021-10-08 | Arkema France | Compositions de copolyamides comprenant des fibres de renforts et presentant une stabilité de module élevée et leurs utilisations |
| EP4021959B1 (en) | 2019-08-27 | 2023-10-11 | Solvay Specialty Polymers USA, LLC. | Polyamides and corresponding polymer compositions, articles and methods for making and using |
| CN114907563B (zh) * | 2021-02-10 | 2023-11-17 | 上海凯赛生物技术股份有限公司 | 阻燃改性pa56/5t材料及其制备方法和应用 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1338392C (en) * | 1987-04-20 | 1996-06-11 | Mitsui Chemicals, Incorporated | Fire-retardant polyamide composition having good heat resistance |
| US5256718A (en) * | 1990-02-14 | 1993-10-26 | Mitsui Petrochemical Industries, Ltd. | Flame retardant polyamide thermoplastic resin composition |
| US6350802B2 (en) * | 1998-03-18 | 2002-02-26 | E. I. Du Pont De Nemours And Company | Thermally stable flame retardant polyamides |
| CN1200044C (zh) * | 2000-08-09 | 2005-05-04 | 三井化学株式会社 | 阻燃性聚酰胺组合物、颗粒和成形体及其用途 |
| AU2001295061A1 (en) * | 2000-09-22 | 2002-04-02 | E.I. Du Pont De Nemours And Company | Improved flame-retardant polyamide compositions |
| JP2002146184A (ja) * | 2000-11-07 | 2002-05-22 | Mitsui Chemicals Inc | 難燃性ポリアミド組成物およびその用途 |
-
2003
- 2003-08-08 CA CA002495095A patent/CA2495095A1/en not_active Abandoned
- 2003-08-08 AU AU2003259730A patent/AU2003259730A1/en not_active Abandoned
- 2003-08-08 WO PCT/US2003/025024 patent/WO2004015010A1/en not_active Ceased
- 2003-08-08 JP JP2004527972A patent/JP2005535754A/ja active Pending
- 2003-08-08 US US10/637,782 patent/US20040077769A1/en not_active Abandoned
- 2003-08-08 EP EP03785134A patent/EP1539885A1/en not_active Withdrawn
- 2003-08-08 CN CNB038194465A patent/CN100349977C/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| AU2003259730A1 (en) | 2004-02-25 |
| JP2005535754A (ja) | 2005-11-24 |
| CN1675307A (zh) | 2005-09-28 |
| WO2004015010A1 (en) | 2004-02-19 |
| CN100349977C (zh) | 2007-11-21 |
| US20040077769A1 (en) | 2004-04-22 |
| EP1539885A1 (en) | 2005-06-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request | ||
| FZDE | Dead |