AU2003259730A1 - Polyamide molding compositions and electrical and electronic components molded therefrom having improved heat stability - Google Patents

Polyamide molding compositions and electrical and electronic components molded therefrom having improved heat stability

Info

Publication number
AU2003259730A1
AU2003259730A1 AU2003259730A AU2003259730A AU2003259730A1 AU 2003259730 A1 AU2003259730 A1 AU 2003259730A1 AU 2003259730 A AU2003259730 A AU 2003259730A AU 2003259730 A AU2003259730 A AU 2003259730A AU 2003259730 A1 AU2003259730 A1 AU 2003259730A1
Authority
AU
Australia
Prior art keywords
electrical
electronic components
heat stability
improved heat
molding compositions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003259730A
Other languages
English (en)
Inventor
Marvin Michael Martens
Kate Redmond
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of AU2003259730A1 publication Critical patent/AU2003259730A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/02—Halogenated hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/016—Flame-proofing or flame-retarding additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/18—Homopolymers or copolymers of aromatic monomers containing elements other than carbon and hydrogen

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyamides (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
AU2003259730A 2002-08-09 2003-08-08 Polyamide molding compositions and electrical and electronic components molded therefrom having improved heat stability Abandoned AU2003259730A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US40235502P 2002-08-09 2002-08-09
US60/402,355 2002-08-09
PCT/US2003/025024 WO2004015010A1 (en) 2002-08-09 2003-08-08 Polyamide molding compositions and electrical and electronic components molded therefrom having improved heat stability

Publications (1)

Publication Number Publication Date
AU2003259730A1 true AU2003259730A1 (en) 2004-02-25

Family

ID=31715840

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003259730A Abandoned AU2003259730A1 (en) 2002-08-09 2003-08-08 Polyamide molding compositions and electrical and electronic components molded therefrom having improved heat stability

Country Status (7)

Country Link
US (1) US20040077769A1 (enExample)
EP (1) EP1539885A1 (enExample)
JP (1) JP2005535754A (enExample)
CN (1) CN100349977C (enExample)
AU (1) AU2003259730A1 (enExample)
CA (1) CA2495095A1 (enExample)
WO (1) WO2004015010A1 (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060293497A1 (en) 2005-06-10 2006-12-28 Martens Marvin M Articles of manufacture made from polyamide resins and suitable for incorporation into LED reflector applications
US20060293435A1 (en) * 2005-06-10 2006-12-28 Marens Marvin M Light-emitting diode assembly housing comprising high temperature polyamide compositions
DE502008000140D1 (de) * 2007-05-03 2009-11-26 Ems Patent Ag Teilaromatische Polyamidformmassen und deren Verwendungen
FR2934864B1 (fr) * 2008-08-08 2012-05-25 Arkema France Polyamide semi-aromatique a terminaison de chaine
FR2934865B1 (fr) * 2008-08-08 2010-08-27 Arkema France Copolyamide semi-aromatique et son procede de preparation
KR20110133041A (ko) * 2009-03-11 2011-12-09 이 아이 듀폰 디 네모아 앤드 캄파니 내염성 폴리아미드 조성물
EP2325260B1 (de) 2009-11-23 2016-04-27 Ems-Patent Ag Teilaromatische Formmassen und deren Verwendungen
WO2011074536A1 (ja) * 2009-12-14 2011-06-23 東洋紡績株式会社 共重合ポリアミド
FR2954773B1 (fr) * 2009-12-24 2013-01-04 Arkema France Polyamide semi-aromatique, son procede de preparation, composition comprenant un tel polyamide et leurs utilisations
JP5668387B2 (ja) * 2010-09-21 2015-02-12 東洋紡株式会社 中空成形体用強化ポリアミド樹脂組成物およびそれを用いた中空成形体
JP5648426B2 (ja) * 2010-11-01 2015-01-07 東洋紡株式会社 ポリアミド樹脂組成物およびポリアミド樹脂発泡成形体
CN102796257B (zh) * 2012-01-06 2014-04-30 东莞市信诺橡塑工业有限公司 一种长碳链半芳香族聚酰胺及其合成方法
JP6146063B2 (ja) * 2013-03-08 2017-06-14 東洋紡株式会社 圧縮成形用炭素長繊維強化ポリアミド複合材料
CN103254422B (zh) * 2013-05-20 2016-04-27 金发科技股份有限公司 一种聚酰胺树脂及由其组成的聚酰胺组合物
EP2821426A1 (en) * 2013-07-03 2015-01-07 Universita' Degli Studi Di Milano Polymers with complex macromolecular architecture having flame-retardant properties
CN106633858B (zh) * 2017-01-10 2019-01-04 江门市德众泰工程塑胶科技有限公司 一种聚酰胺树脂复合材料及其制备方法和应用
FR3094010B1 (fr) * 2019-03-21 2021-10-08 Arkema France Compositions de copolyamides comprenant des fibres de renforts et presentant une stabilité de module élevée et leurs utilisations
EP4021959B1 (en) 2019-08-27 2023-10-11 Solvay Specialty Polymers USA, LLC. Polyamides and corresponding polymer compositions, articles and methods for making and using
CN114907563B (zh) * 2021-02-10 2023-11-17 上海凯赛生物技术股份有限公司 阻燃改性pa56/5t材料及其制备方法和应用

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1338392C (en) * 1987-04-20 1996-06-11 Mitsui Chemicals, Incorporated Fire-retardant polyamide composition having good heat resistance
US5256718A (en) * 1990-02-14 1993-10-26 Mitsui Petrochemical Industries, Ltd. Flame retardant polyamide thermoplastic resin composition
US6350802B2 (en) * 1998-03-18 2002-02-26 E. I. Du Pont De Nemours And Company Thermally stable flame retardant polyamides
CN1200044C (zh) * 2000-08-09 2005-05-04 三井化学株式会社 阻燃性聚酰胺组合物、颗粒和成形体及其用途
AU2001295061A1 (en) * 2000-09-22 2002-04-02 E.I. Du Pont De Nemours And Company Improved flame-retardant polyamide compositions
JP2002146184A (ja) * 2000-11-07 2002-05-22 Mitsui Chemicals Inc 難燃性ポリアミド組成物およびその用途

Also Published As

Publication number Publication date
JP2005535754A (ja) 2005-11-24
CA2495095A1 (en) 2004-02-19
CN1675307A (zh) 2005-09-28
WO2004015010A1 (en) 2004-02-19
CN100349977C (zh) 2007-11-21
US20040077769A1 (en) 2004-04-22
EP1539885A1 (en) 2005-06-15

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase