GB0323533D0 - Mould socket of integrated circuit - Google Patents
Mould socket of integrated circuitInfo
- Publication number
- GB0323533D0 GB0323533D0 GBGB0323533.0A GB0323533A GB0323533D0 GB 0323533 D0 GB0323533 D0 GB 0323533D0 GB 0323533 A GB0323533 A GB 0323533A GB 0323533 D0 GB0323533 D0 GB 0323533D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- integrated circuit
- mould socket
- mould
- socket
- integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0323533A GB2406973B (en) | 2003-10-08 | 2003-10-08 | Modular socket of integrated circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0323533A GB2406973B (en) | 2003-10-08 | 2003-10-08 | Modular socket of integrated circuit |
Publications (3)
Publication Number | Publication Date |
---|---|
GB0323533D0 true GB0323533D0 (en) | 2003-11-12 |
GB2406973A GB2406973A (en) | 2005-04-13 |
GB2406973B GB2406973B (en) | 2006-03-29 |
Family
ID=29433484
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0323533A Expired - Fee Related GB2406973B (en) | 2003-10-08 | 2003-10-08 | Modular socket of integrated circuit |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2406973B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112601135A (en) * | 2020-12-09 | 2021-04-02 | 西安羚控电子科技有限公司 | Floating connecting device |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105973548B (en) * | 2016-05-07 | 2019-04-16 | 上海大学 | Testing vapor transmission fixture based on active metal electric method |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0567255B1 (en) * | 1992-04-24 | 1999-01-20 | Altera Corporation | Surface mount chip carrier |
US6483328B1 (en) * | 1995-11-09 | 2002-11-19 | Formfactor, Inc. | Probe card for probing wafers with raised contact elements |
JP4367730B2 (en) * | 1999-06-25 | 2009-11-18 | 株式会社エンプラス | IC socket and spring means of the IC socket |
TW432752B (en) * | 1999-07-15 | 2001-05-01 | Urex Prec Inc | Modular integrated circuit socket |
US6383005B2 (en) * | 1999-12-07 | 2002-05-07 | Urex Precision, Inc. | Integrated circuit socket with contact pad |
-
2003
- 2003-10-08 GB GB0323533A patent/GB2406973B/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112601135A (en) * | 2020-12-09 | 2021-04-02 | 西安羚控电子科技有限公司 | Floating connecting device |
CN112601135B (en) * | 2020-12-09 | 2022-12-09 | 西安羚控电子科技有限公司 | Floating connecting device |
Also Published As
Publication number | Publication date |
---|---|
GB2406973B (en) | 2006-03-29 |
GB2406973A (en) | 2005-04-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20071008 |