CA2469520A1 - Method for laser machining a workpiece with laser spot enlargement - Google Patents
Method for laser machining a workpiece with laser spot enlargement Download PDFInfo
- Publication number
- CA2469520A1 CA2469520A1 CA002469520A CA2469520A CA2469520A1 CA 2469520 A1 CA2469520 A1 CA 2469520A1 CA 002469520 A CA002469520 A CA 002469520A CA 2469520 A CA2469520 A CA 2469520A CA 2469520 A1 CA2469520 A1 CA 2469520A1
- Authority
- CA
- Canada
- Prior art keywords
- laser
- positioning system
- primary
- fast
- accelerations
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000000034 method Methods 0.000 title claims description 39
- 238000003754 machining Methods 0.000 title claims description 15
- 230000001133 acceleration Effects 0.000 claims description 20
- 238000005553 drilling Methods 0.000 claims description 13
- 238000013519 translation Methods 0.000 claims description 11
- 238000009966 trimming Methods 0.000 claims description 4
- 230000037361 pathway Effects 0.000 claims 4
- 238000012545 processing Methods 0.000 description 12
- 239000000463 material Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 6
- 238000005459 micromachining Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 230000004044 response Effects 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 238000005094 computer simulation Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 238000005086 pumping Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000013077 target material Substances 0.000 description 2
- 238000002679 ablation Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 229910052743 krypton Inorganic materials 0.000 description 1
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- ZBSCCQXBYNSKPV-UHFFFAOYSA-N oxolead;oxomagnesium;2,4,5-trioxa-1$l^{5},3$l^{5}-diniobabicyclo[1.1.1]pentane 1,3-dioxide Chemical compound [Mg]=O.[Pb]=O.[Pb]=O.[Pb]=O.O1[Nb]2(=O)O[Nb]1(=O)O2 ZBSCCQXBYNSKPV-UHFFFAOYSA-N 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/12—Copper or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
- Mechanical Optical Scanning Systems (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US34861302P | 2002-01-11 | 2002-01-11 | |
US60/348,613 | 2002-01-11 | ||
PCT/US2003/000686 WO2003059568A1 (en) | 2002-01-11 | 2003-01-10 | Method for laser machining a workpiece with laser spot enlargement |
Publications (1)
Publication Number | Publication Date |
---|---|
CA2469520A1 true CA2469520A1 (en) | 2003-07-24 |
Family
ID=23368777
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002469520A Abandoned CA2469520A1 (en) | 2002-01-11 | 2003-01-10 | Method for laser machining a workpiece with laser spot enlargement |
Country Status (9)
Country | Link |
---|---|
JP (1) | JP4340745B2 (zh) |
KR (1) | KR100982677B1 (zh) |
CN (1) | CN1299873C (zh) |
AU (1) | AU2003214818A1 (zh) |
CA (1) | CA2469520A1 (zh) |
DE (1) | DE10392185T5 (zh) |
GB (1) | GB2397545B (zh) |
TW (1) | TW564196B (zh) |
WO (1) | WO2003059568A1 (zh) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004059721A1 (de) * | 2004-12-11 | 2006-05-04 | Carl Baasel Lasertechnik Gmbh & Co. Kg | Bewässerungsschlauch und Verfahren zu seiner Herstellung |
CN100462181C (zh) * | 2006-10-30 | 2009-02-18 | 西安交通大学 | 飞秒激光真三维微纳加工中心 |
US7663269B2 (en) * | 2006-12-13 | 2010-02-16 | A-Tech Corporation | High bandwidth linear actuator for steering mirror applications |
DE102007012815B4 (de) * | 2007-03-16 | 2024-06-06 | Dmg Mori Ultrasonic Lasertec Gmbh | Verfahren und Vorrichtung zur Bildung eines Gesenks |
US20090312859A1 (en) * | 2008-06-16 | 2009-12-17 | Electro Scientific Industries, Inc. | Modifying entry angles associated with circular tooling actions to improve throughput in part machining |
TWI523720B (zh) | 2009-05-28 | 2016-03-01 | 伊雷克托科學工業股份有限公司 | 應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法 |
DE102009044316B4 (de) | 2009-10-22 | 2015-04-30 | Ewag Ag | Verfahren zur Herstellung einer Fläche und/oder einer Kante an einem Rohling sowie Laserbearbeitungsvorrichtung zur Durchführung des Verfahrens |
US8338745B2 (en) * | 2009-12-07 | 2012-12-25 | Panasonic Corporation | Apparatus and methods for drilling holes with no taper or reverse taper |
CN105834583B (zh) * | 2010-10-22 | 2019-04-19 | 伊雷克托科学工业股份有限公司 | 用于光束抖动和刮削的镭射加工系统和方法 |
CN102069298A (zh) * | 2010-12-20 | 2011-05-25 | 珠海市铭语自动化设备有限公司 | 一种板材激光切割系统及其切割加工方法 |
CN102566590B (zh) * | 2011-03-14 | 2014-03-26 | 北京国科世纪激光技术有限公司 | 光学元件智能调整系统及方法 |
CN103100797B (zh) * | 2013-01-23 | 2015-09-09 | 刘茂珍 | 基于自适应光学的激光微细加工设备和方法 |
WO2014126020A1 (ja) * | 2013-02-13 | 2014-08-21 | 住友化学株式会社 | レーザー光照射装置及び光学部材貼合体の製造装置 |
GB2511064A (en) | 2013-02-21 | 2014-08-27 | M Solv Ltd | Method of forming electrode structure for capacitive touch sensor |
GB2514084B (en) | 2013-02-21 | 2016-07-27 | M-Solv Ltd | Method of forming an electrode structure for capacitive touch sensor |
JP2016516584A (ja) * | 2013-03-15 | 2016-06-09 | エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド | テーパ制御のためのビーム角度とワークピース移動の連係方法 |
IT201600070259A1 (it) * | 2016-07-06 | 2018-01-06 | Adige Spa | Procedimento di lavorazione laser di un materiale metallico con controllo della posizione dell'asse ottico del laser rispetto ad un flusso di gas di assistenza, nonché macchina e programma per elaboratore per l'attuazione di un tale procedimento. |
CN107876981B (zh) * | 2017-11-20 | 2019-08-20 | 张家港初恒激光科技有限公司 | 一种改进型的激光焊接加工工作站 |
CN109579690A (zh) * | 2018-12-04 | 2019-04-05 | 天津津航技术物理研究所 | 一种用于快反镜稳像系统的高精度角位移检测装置 |
CN112122776A (zh) * | 2020-09-23 | 2020-12-25 | 苏州科韵激光科技有限公司 | 基于高速旋转反射镜的非线性形状加工系统及方法 |
KR102497645B1 (ko) * | 2021-06-23 | 2023-02-08 | 인하대학교 산학협력단 | 금형 표면 레이저 가공하는 방법 |
EP4137263A1 (de) * | 2021-08-20 | 2023-02-22 | Bystronic Laser AG | Halterung für ein transmissives optisches element, laserbearbeitungvorrichtung mit einer solchen halterung und verfahren zum verstellen der position eines transmissiven optischen elements unter verwendung einer solchen halterung |
CN113897608A (zh) * | 2021-10-23 | 2022-01-07 | 河南省锅炉压力容器安全检测研究院 | 一种用于阀门密封面的激光表面强化加工设备 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54116356A (en) * | 1978-03-03 | 1979-09-10 | Hitachi Ltd | Welding method by laser |
FR2577052B1 (fr) * | 1985-02-05 | 1988-09-09 | Bertin & Cie | Procede et dispositif de deplacement du point d'impact d'un faisceau laser sur une piece |
PL169904B1 (pl) * | 1991-01-17 | 1996-09-30 | United Distillers Plc | Sposób i urzadzenie do znakowania poruszajacych sie wyrobów PL PL PL |
JPH05209731A (ja) * | 1992-01-31 | 1993-08-20 | Fanuc Ltd | レーザロボットの光軸調整方法 |
JP3060813B2 (ja) | 1993-12-28 | 2000-07-10 | トヨタ自動車株式会社 | レーザ加工装置 |
JPH0885866A (ja) * | 1994-09-16 | 1996-04-02 | Sumitomo Metal Mining Co Ltd | Ito焼結体の製造方法 |
US5847960A (en) * | 1995-03-20 | 1998-12-08 | Electro Scientific Industries, Inc. | Multi-tool positioning system |
US5751585A (en) * | 1995-03-20 | 1998-05-12 | Electro Scientific Industries, Inc. | High speed, high accuracy multi-stage tool positioning system |
US6407363B2 (en) * | 2000-03-30 | 2002-06-18 | Electro Scientific Industries, Inc. | Laser system and method for single press micromachining of multilayer workpieces |
-
2003
- 2003-01-10 TW TW092100478A patent/TW564196B/zh not_active IP Right Cessation
- 2003-01-10 JP JP2003559716A patent/JP4340745B2/ja not_active Expired - Lifetime
- 2003-01-10 GB GB0412827A patent/GB2397545B/en not_active Expired - Fee Related
- 2003-01-10 KR KR1020047010540A patent/KR100982677B1/ko active IP Right Grant
- 2003-01-10 DE DE10392185T patent/DE10392185T5/de not_active Ceased
- 2003-01-10 CA CA002469520A patent/CA2469520A1/en not_active Abandoned
- 2003-01-10 CN CNB038019914A patent/CN1299873C/zh not_active Expired - Lifetime
- 2003-01-10 WO PCT/US2003/000686 patent/WO2003059568A1/en active Application Filing
- 2003-01-10 AU AU2003214818A patent/AU2003214818A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
DE10392185T5 (de) | 2004-12-02 |
CN1299873C (zh) | 2007-02-14 |
CN1612793A (zh) | 2005-05-04 |
AU2003214818A1 (en) | 2003-07-30 |
JP4340745B2 (ja) | 2009-10-07 |
KR100982677B1 (ko) | 2010-09-17 |
GB0412827D0 (en) | 2004-07-14 |
KR20040073542A (ko) | 2004-08-19 |
TW200301718A (en) | 2003-07-16 |
TW564196B (en) | 2003-12-01 |
WO2003059568A1 (en) | 2003-07-24 |
GB2397545A (en) | 2004-07-28 |
JP2005532908A (ja) | 2005-11-04 |
GB2397545B (en) | 2005-05-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6706998B2 (en) | Simulated laser spot enlargement | |
CA2469520A1 (en) | Method for laser machining a workpiece with laser spot enlargement | |
US6407363B2 (en) | Laser system and method for single press micromachining of multilayer workpieces | |
JP2005532908A5 (zh) | ||
JP7404316B2 (ja) | レーザ処理装置、ワークピースをレーザ処理する方法及び関連する構成 | |
JP4820071B2 (ja) | マルチビーム微細加工システムおよびその方法 | |
US6720524B1 (en) | Method and apparatus for laser drilling | |
TWI774721B (zh) | 用於延長雷射處理設備中的光學器件生命期的方法和系統 | |
US20140263212A1 (en) | Coordination of beam angle and workpiece movement for taper control | |
CN111496393A (zh) | 一种锥度可控的微群孔高效激光加工方法 | |
JP3769942B2 (ja) | レーザー加工方法及び装置、並びに非導電性透明基板の回路形成方法及び装置 | |
JP2023534234A (ja) | ブラインドビアをレーザ穿孔するための方法および装置 | |
KR20190025721A (ko) | 작업물을 레이저 가공하는 레이저 가공 장치 및 방법 | |
WO2011148492A1 (ja) | レーザ加工方法およびレーザ加工機 | |
JP2002346775A (ja) | レーザ加工装置及び方法 | |
Herbst et al. | High-peak power solid state laser for micromachining of hard materials | |
JP3524855B2 (ja) | レーザ照射装置及びレーザ加工方法 | |
JP2002096188A (ja) | レーザ加工装置及びレーザ加工方法 | |
JP2000271774A (ja) | レーザ穴あけ加工装置用のデスミア方法及びデスミア装置 | |
JP2003285178A (ja) | レーザ加工装置及び加工方法 | |
JP2006102788A (ja) | レーザ加工装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FZDE | Discontinued |