WO2014126020A1 - レーザー光照射装置及び光学部材貼合体の製造装置 - Google Patents
レーザー光照射装置及び光学部材貼合体の製造装置 Download PDFInfo
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- WO2014126020A1 WO2014126020A1 PCT/JP2014/052932 JP2014052932W WO2014126020A1 WO 2014126020 A1 WO2014126020 A1 WO 2014126020A1 JP 2014052932 W JP2014052932 W JP 2014052932W WO 2014126020 A1 WO2014126020 A1 WO 2014126020A1
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- WIPO (PCT)
- Prior art keywords
- laser beam
- bonding
- laser
- scanner
- optical member
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0927—Systems for changing the beam intensity distribution, e.g. Gaussian to top-hat
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0938—Using specific optical elements
- G02B27/0988—Diaphragms, spatial filters, masks for removing or filtering a part of the beam
Definitions
- the present invention relates to a laser beam irradiation apparatus and an apparatus for manufacturing an optical member bonded body.
- An aspect of the present invention has been made in view of such circumstances, and is capable of suppressing the occurrence of defects such as cracks and chips on the cut surface of an object, and a laser capable of suppressing a reduction in cut quality. It aims at providing the manufacturing apparatus of a light irradiation apparatus and an optical member bonding body.
- a laser beam irradiation apparatus includes a table having a holding surface that holds an object, a laser beam oscillator that oscillates laser light, and a plane parallel to the holding surface.
- a scanner that scans the laser light two-dimensionally, a moving device that relatively moves the table and the scanner, and a control device that controls the scanner and the moving device. By relatively moving the scanner and the table along the laser processing line while deflecting the laser light by the scanner, the laser light is irradiated on the laser processing line in a plurality of times. Overlapping part is formed.
- control device may relatively move the scanner and the table along the laser processing line while rotating the laser beam by the scanner.
- the scanner may deflect the laser light toward a surplus portion outside the laser processing line.
- control device causes the scanner and the table to move along the laser processing line while causing the laser beam to vibrate linearly along the laser processing line. You may move relatively.
- a condensing lens that condenses the laser light emitted from the scanner toward the holding surface may be further included.
- the manufacturing apparatus of the optical member bonding body which concerns on another aspect of this invention is a manufacturing apparatus of the optical member bonding body formed by bonding an optical member to an optical display component, Comprising: A bonding apparatus that forms a bonding sheet by bonding an optical member sheet that is larger than the display area to the optical display component, a facing portion of the optical member sheet that faces the display region, and a surplus portion outside the facing portion.
- the optical member including the optical member that overlaps the optical display component and the optical display component from the bonding sheet by cutting out the optical member having a size corresponding to the display area from the optical member sheet.
- a cutting device for cutting out the coalescence wherein the cutting device is constituted by any one of the laser light irradiation devices from (1) to (5), and the laser light irradiation device The optical member sheet is cut as an object by the irradiated laser beam.
- the aspect of the present invention it is possible to suppress the occurrence of defects such as cracks and chips on the cut surface of the object, and it is possible to suppress the deterioration of the cut quality.
- FIG. 6 it is the figure which paid its attention to one pulse of a laser beam. It is a figure for demonstrating the effect
- FIG. 1 It is a schematic diagram which shows the manufacturing apparatus of the optical member bonding body which concerns on one Embodiment of this invention. It is a top view of a liquid crystal panel. It is AA sectional drawing of FIG. It is sectional drawing of an optical sheet. It is a figure which shows operation
- FIG. 1 is a perspective view showing an example of a laser beam irradiation apparatus 100 used as an object cutting apparatus.
- the first direction parallel to the holding surface that holds the object is defined as the X direction
- the direction orthogonal to the X direction in the plane of the holding surface is orthogonal to the Y direction, the X direction, and the Y direction.
- the direction is the Z direction.
- a laser beam irradiation apparatus 100 includes a table 101, a laser beam oscillator 102, an acoustooptic device 103 that constitutes an EBS 130 (Electrical Beam Shaping: see FIG. 2), and an IOR 104 (Imaging Opticals Rail).
- EBS 130 Electro Beam Shaping: see FIG. 2
- IOR 104 Imaging Opticals Rail
- a scanner 105, a moving device 106, and a control device 107 that performs overall control of these devices.
- the table 101 has a holding surface 101s for holding the object 110.
- the table 101 is rectangular when viewed from the normal direction of the holding surface 101s.
- the holding surface 101s is a rectangular first holding surface 101s1 having a length in the first direction (X direction), and a second holding member that is disposed adjacent to the first holding surface 101s1 and has the same shape as the first holding surface 101s1.
- the laser beam oscillator 102 is a member that oscillates the laser beam L.
- a CO 2 laser beam oscillator carbon dioxide laser beam oscillator
- a UV laser beam oscillator a UV laser beam oscillator
- a semiconductor laser beam oscillator a YAG laser beam oscillator
- an excimer laser beam oscillator etc.
- a specific configuration is not particularly limited.
- a CO 2 laser light oscillator is more preferable because it can oscillate laser light at a high output suitable for cutting an optical member such as a polarizing film.
- FIG. 2 is a diagram illustrating the configuration of the EBS 130.
- the EBS 130 includes an acoustooptic element 103 disposed on the optical path of the laser beam oscillated from the laser beam oscillator 102, a drive driver 131 electrically connected to the acoustooptic element 103, And a control device 107 (corresponding to a laser control unit 171 described later) for controlling the timing at which the laser light passes through the acoustooptic device 103.
- the EBS 130 shields the laser light until the output of the laser light is stabilized.
- Acousto-optic element 103 is an optical element for shielding laser light oscillated from laser light oscillator 102.
- the acoustooptic element 103 is obtained by bonding a piezoelectric element to an acoustooptic medium made of single crystal or glass such as tellurium dioxide (TeO 2 ) or lead molybdate (PbMoO 4 ).
- TeO 2 tellurium dioxide
- PbMoO 4 lead molybdate
- the acousto-optic element 103 is used as a constituent member of the EBS 130, but the present invention is not limited to this.
- Other optical elements may be used as long as the laser light oscillated from the laser light oscillator 102 can be shielded.
- the drive driver 131 supplies an electrical signal (control signal) for generating an ultrasonic wave to the acoustooptic device 103 based on the control of the control device 107, and adjusts the shielding time of the laser beam by the acoustooptic device 103.
- the control device 107 controls the timing at which the laser light passes through the acousto-optic device 103 so that, for example, the rising and falling portions of the laser light oscillated from the laser light oscillator 102 are removed.
- the timing control by the control device 107 is not limited to this.
- the control device 107 may control the timing at which the laser light passes through the acousto-optic element 103 so that the rising portion of the laser light oscillated from the laser light oscillator 102 is selectively removed.
- the width (time) of the falling portion of the laser light oscillated from the laser light oscillator 102 is sufficiently shorter than the width (time) of the rising portion of the laser light, the falling portion of the laser light is removed.
- the profit to do is small. Therefore, in such a case, only the rising portion of the laser beam oscillated from the laser beam oscillator 102 may be selectively removed.
- the EBS 130 emits the laser light oscillated from the laser light oscillator 102 in a state where the output is stable based on the control of the control device 107.
- the IOR 104 removes the skirt portion that does not contribute to the cutting of the object 110 in the intensity distribution of the laser light.
- FIG. 3 is a perspective view showing the internal configuration of the IOR 104.
- the IOR 104 includes a first condenser lens 141 that condenses the laser light emitted from the EBS 130, a first holding frame 142 that holds the first condenser lens 141, and a first condenser lens.
- a diaphragm member 143 that squeezes the laser light condensed by the lens 141, a holding member 144 that holds the diaphragm member 143, a collimator lens 145 that collimates the laser light squeezed by the diaphragm member 143, and a collimator lens 145 are held. It has the 2nd holding frame 146 and the moving mechanism 147 which moves the 1st holding frame 142, the holding member 144, and the 2nd holding frame 146 relatively.
- FIG. 4 is a side sectional view showing an arrangement configuration of the first condenser lens 141, the diaphragm member 143, and the collimator lens 145.
- the aperture member 143 is formed with a pinhole 143h for condensing the laser beam condensed by the first condenser lens 141.
- the centers of the first condenser lens 141, the pinhole 143h, and the collimator lens 145 are arranged at positions that overlap the optical axis CL of the laser light emitted from the EBS 130.
- the diaphragm member 143 is preferably disposed in the vicinity of the rear focal point of the first condenser lens 141.
- “near the rear focal point of the first condenser lens 141” means that the arrangement position of the diaphragm member 143 is slightly different from the rear focal point of the first condenser lens 141 so that the arrangement position is slightly different. It means that it may be allowed.
- the distance K 1 from the center of the first condenser lens 141 to the rear focal point of the first condenser lens 141 and the distance K 2 from the center of the first condenser lens 141 to the center of the pinhole 143 h of the aperture member 143 is slightly different from the rear focal point of the first condenser lens 141 so that the arrangement position is slightly different. It means that it may be allowed.
- the distance K 1 from the center of the first condenser lens 141 to the rear focal point of the first condenser lens 141 and the distance K 2 from the center of the first condenser lens 141 to the center of the pinhole 143 h of the aperture member 143 is slightly different from the rear focal point of the first conden
- the ratio K 1 / K 2 is in the range of 0.9 / 1 to 1.1 / 1, it can be said that the diaphragm member 143 is disposed in the vicinity of the rear focal point of the first condenser lens 141. . If it is such a range, the laser beam condensed by the 1st condensing lens 141 can be narrowed down effectively.
- the diaphragm member 143 is preferably disposed in the vicinity of the rear focal point of the first condenser lens 141, but the position of the diaphragm member 143 is not necessarily limited to this position.
- the arrangement position of the aperture member 143 may be on the optical path between the first condenser lens 141 and the collimator lens 145, and is not limited to the vicinity of the rear focal point of the first condenser lens 141.
- the moving mechanism 147 moves the first holding frame 142, the holding member 144, and the second holding frame 146 in a direction parallel to the traveling direction of the laser light, and the slider mechanism 148. Holding base 149 for holding.
- the first holding frame 142 and the holding member 144 are moved by moving the first holding frame 142 and the second holding frame 146 in a direction parallel to the traveling direction of the laser beam in a state where the holding member 144 is arranged at a fixed position. And the mutual positioning of the 2nd holding frame 146 is performed. Specifically, the diaphragm member 143 is disposed at the position of the front focal point of the collimating lens 145 and at the position of the rear focal point of the first condenser lens 141.
- the scanner 105 scans the laser beam two-dimensionally in a plane parallel to the holding surface 101s (in the XY plane). That is, the scanner 105 moves the laser light relative to the table 101 independently in the X direction and the Y direction. Thereby, it is possible to accurately irradiate the laser beam to an arbitrary position of the object 110 held on the table 101.
- the scanner 105 includes a first irradiation position adjustment device 151 and a second irradiation position adjustment device 154.
- the first irradiation position adjusting device 151 and the second irradiation position adjusting device 154 constitute a scanning element that two-dimensionally scans the laser light emitted from the IOR 104 within a plane parallel to the holding surface 101s.
- a galvano scanner is used as the first irradiation position adjustment device 151 and the second irradiation position adjustment device 154.
- the scanning element is not limited to a galvano scanner, and a gimbal can be used.
- the first irradiation position adjusting device 151 includes a mirror 152 and an actuator 153 that adjusts the installation angle of the mirror 152.
- the actuator 153 has a rotation axis parallel to the Z direction. The actuator 153 rotates the mirror 152 around the Z axis based on the control of the control device 107.
- the second irradiation position adjusting device 154 includes a mirror 155 and an actuator 156 that adjusts the installation angle of the mirror 155.
- the actuator 156 has a rotation axis parallel to the Y direction. The actuator 156 rotates the mirror 155 around the Y axis based on the control of the control device 107.
- a second condenser lens 108 that condenses the laser light passing through the scanner 105 toward the holding surface 101s is disposed.
- an f ⁇ lens is used as the second condenser lens 108.
- the laser beam emitted in parallel to the second condenser lens 108 from the mirror 155 can be condensed in parallel to the object 110.
- the second condenser lens 108 may not be disposed on the optical path between the scanner 105 and the table 101.
- the laser beam L oscillated from the laser beam oscillator 102 is applied to the object 110 held on the table 101 via the acoustooptic device 103, the IOR 104, the mirror 152, the mirror 155, and the second condenser lens. .
- the first irradiation position adjustment device 151 and the second irradiation position adjustment device 154 are configured to control the laser light emitted from the laser light oscillator 102 toward the object 110 held on the table 101 based on the control of the control device 107. Adjust the irradiation position.
- a laser beam processing region 105s (hereinafter referred to as a scan region) controlled by the scanner 105 is rectangular when viewed from the normal direction of the holding surface 101s.
- the area of the scan region 105s is smaller than the areas of the first holding surface 101s1 and the second holding surface 101s2.
- the moving device 106 relatively moves the table 101 and the scanner 105.
- the moving device 106 moves the table 101 in a first direction (X direction) parallel to the holding surface 101s, and the first slider mechanism 161 is parallel to the holding surface 101s and orthogonal to the first direction.
- a second slider mechanism 162 that moves in a second direction (Y direction) (hereinafter, these may be collectively referred to as slider mechanisms 161 and 162).
- the moving device 106 operates the linear motor built in each of the first slider mechanism 161 and the second slider mechanism 162 to move the table 101 in each direction of XY.
- the linear motor pulse-driven in the slider mechanisms 161 and 162 can finely control the rotation angle of the output shaft by the pulse signal supplied to the linear motor. Accordingly, the position of the table 101 supported by the slider mechanisms 161 and 162 in each of the XY directions can be controlled with high accuracy. Note that the position control of the table 101 is not limited to the position control using a pulse motor, and can be realized by feedback control using a servo motor or any other control method.
- the control device 107 includes a laser control unit 171 that controls the laser light oscillator 102 and the acoustooptic device 103 (drive driver 131), a scanner control unit 172 that controls the scanner 105, and a slider control unit 173 that controls the moving device 106. And having.
- the laser controller 171 turns on / off the laser beam oscillator 102, the output of the laser beam oscillated from the laser beam oscillator 102, and the laser beam L oscillated from the laser beam oscillator 102 is acousto-optic.
- the timing of passing through the element 103 and the drive driver 131 are controlled.
- the scanner control unit 172 controls driving of the actuator 153 of the first irradiation position adjustment device 151 and the actuator 156 of the second irradiation position adjustment device 154.
- the slider control unit 173 controls the operation of the linear motor built in each of the first slider mechanism 161 and the second slider mechanism 162.
- FIG. 5 is a diagram illustrating a configuration of a control system of the laser light irradiation apparatus 100.
- an input device 109 capable of inputting an input signal is connected to the control device 107.
- the input device 109 includes an input device such as a keyboard and a mouse, or a communication device that can input data from an external device.
- the control device 107 may include a display device such as a liquid crystal display that indicates the operation status of each unit of the laser light irradiation device 100, or may be connected to the display device.
- the control device 107 corrects each coordinate value in real time so that the laser light is emitted at coordinates that match the machining data, that is, the laser light draws a desired locus on the object 110 (see FIG. 1).
- the moving device 106 and the scanner 105 are controlled.
- the scanning of the laser light is mainly performed by the moving device 106, and an area where the irradiation position of the laser light cannot be accurately controlled by the moving device 106 is adjusted by the scanner 105.
- FIGS. 6A to 6D are diagrams for explaining the operation of the EBS 130.
- FIG. FIG. 6A shows a control signal for laser light oscillated from the laser light oscillator 102.
- FIG. 6B shows the output characteristics of the laser light itself oscillated from the laser light oscillator 102, that is, the output characteristics of the laser light before the laser light oscillated from the laser light oscillator 102 passes through the acoustooptic device 103. Is shown.
- FIG. 6C shows a control signal for the acousto-optic element 103.
- FIG. 6D shows the output characteristics of the laser light after the laser light oscillated from the laser light oscillator 102 passes through the acoustooptic device 103. In each of FIGS.
- FIGS. 7A to 7D are diagrams focusing on one pulse of laser light in FIGS. 6A to 6D.
- the “control signal for laser light oscillated from the laser light oscillator 102” is referred to as “control signal for laser light”.
- “Output characteristics of laser light before the laser light oscillated from the laser light oscillator 102 passes through the acousto-optic element 103” is referred to as “output characteristics of laser light before passing through the acousto-optic element 103”.
- Output characteristics of laser light after the laser light oscillated from the laser light oscillator 102 passes through the acousto-optic element 103 is referred to as “output characteristics of laser light after passing through the acousto-optic element 103”.
- the pulse Ps1 of the laser light control signal is a rectangular pulse.
- the laser light control signal is a so-called clock pulse that generates a plurality of pulses Ps1 by periodically switching the ON / OFF signal to the laser light oscillator 102.
- the peak portion of the pulse Ps1 is in a state where an ON signal is sent to the laser light oscillator 102, that is, in an ON state where laser light is oscillated from the laser light oscillator 102. It is.
- the valley portion of the pulse Ps1 is a state where an OFF signal is sent to the laser beam oscillator 102, that is, an OFF state where no laser beam is oscillated from the laser beam oscillator 102.
- one collective pulse PL1 is formed by arranging three pulses Ps1 at short intervals.
- the three collective pulses PL1 are arranged at intervals longer than the arrangement interval of the three pulses Ps1. For example, the interval between two adjacent pulses Ps1 is 1 millisecond, and the interval between two adjacent collective pulses PL1 is 10 milliseconds.
- one collective pulse PL1 is formed by arranging three pulses Ps1 at short intervals, but the present invention is not limited to this.
- one collective pulse may be formed by arranging a plurality of two or four or more pulses at short intervals.
- the configuration is not limited to the plurality of pulses being periodically formed, and one pulse may be formed with a long width. That is, a configuration in which laser light having a certain intensity from an ON signal to an OFF signal to the laser light oscillator is oscillated for a predetermined time may be employed.
- the pulse Ps2 of the output characteristic of the laser light before passing through the acoustooptic device 103 is a waveform pulse having a rising portion G1 and a falling portion G2.
- the rising portion G1 means a portion of the pulse Ps2 in the period from when the intensity of the laser beam reaches zero to an intensity that contributes to the cutting of the object.
- the falling portion G2 means a portion in the period from the intensity at which the intensity of the laser light contributes to the cutting of the object to zero, among the pulses Ps2 of the output characteristics of the laser light.
- the intensity that contributes to the cutting of the object differs depending on the material and thickness of the object, and the output value of the laser beam. As an example, as shown in FIG. 7B, 50% of the peak intensity (100%) of the laser beam. % Strength.
- the width of the rising portion G1 of the pulse Ps2 is longer than the width of the falling portion G2. That is, the time of the rising portion G1 of the laser light oscillated from the laser light oscillator 102 is longer than the time of the falling portion G2 of the laser light.
- the width of the rising portion G1 is 45 microseconds
- the width of the falling portion G2 is 25 microseconds.
- the present invention is not limited to this.
- the present invention can be applied even when the width of the rising portion G1 of the pulse Ps2 is shorter than the width of the falling portion G2. is there.
- one set pulse PL2 is formed by arranging the three pulses Ps2 at positions corresponding to the three pulses Ps1 shown in FIG. 6 (a).
- the three collective pulses PL2 are arranged at positions corresponding to the three collective pulses PL1 shown in FIG.
- the control signal pulse Ps3 of the acoustooptic device 103 is a rectangular pulse.
- the control signal for the acousto-optic element 103 is periodically switched so that the timing at which the laser light passes through the acousto-optic element 103 is periodically switched. This is a so-called clock pulse that generates a plurality of pulses Ps3.
- the peak portion of the pulse Ps3 is in a state where laser light is transmitted, that is, a light transmitting state where laser light is transmitted.
- the valley portion of the pulse Ps3 is in a state where laser light is not passed, that is, in a light shielding state where the laser light is shielded.
- each pulse Ps3 is arranged so as to overlap both the rising portion G1 and the falling portion G2 of each pulse Ps2 shown in FIG. 6B.
- the width of the valley portion V1 on the front side of the pulse Ps3 is larger than the width of the rising portion G1 of the pulse Ps2, and the rear side of the pulse Ps3.
- the width of the valley portion V2 is substantially equal to the width of the falling portion of the pulse Ps2.
- the width of the valley portion V1 on the front side of the pulse Ps3 is 45 microseconds
- the width of the valley portion V2 on the rear side of the pulse Ps3 is 25 microseconds.
- the EBS 130 has a switch function having a quick response characteristic.
- the rising portion G1 and the falling portion G2 of the laser beam can be removed, and the portion of the laser beam output characteristic pulse Ps2 in which the intensity of the laser beam contributes to the cutting of the object can be selectively extracted.
- the pulse Ps4 of the output characteristic of the laser light after passing through the acoustooptic device 103 does not have a rising portion G1 and a falling portion G2, and is sharp. It becomes a pulse protruding to
- the width of the front valley portion V1 of the pulse Ps3 is larger than the width of the rising portion G1 of the pulse Ps2, and the width of the rear valley portion V2 of the pulse Ps3 is the rising edge of the pulse Ps2.
- the present invention is not limited to this.
- the width of the valley portion V1 on the front side of the pulse Ps3 is made substantially equal to the width of the rising portion G1 of the pulse Ps2, or the width of the valley portion V2 on the rear side of the pulse Ps3 is made larger than the width of the falling portion of the pulse Ps2. It can be appropriately adjusted as necessary, for example, by increasing the size.
- FIG. 8 is a diagram for explaining the operation of the IOR 104.
- the diagram on the left side of FIG. 8 is a diagram showing the intensity distribution of the laser light before passing through the pinhole 143h.
- the upper left diagram in FIG. 8 is a plan view
- the left middle diagram in FIG. 8 is a perspective view
- the lower left diagram in FIG. 8 is a diagram in which the horizontal axis indicates the position and the vertical axis indicates the strength.
- the diagram on the right side of FIG. 8 is a diagram showing the intensity distribution of the laser light after passing through the pinhole 143h.
- the upper right diagram in FIG. 8 is a plan view
- the middle diagram on the right in FIG. 8 is a perspective view
- the lower right diagram in FIG. 8 is a diagram showing the horizontal axis as the position and the vertical axis as the strength.
- the intensity distribution of the laser light before passing through the pinhole 143h is a high intensity distribution at the center of the beam and a low intensity distribution at the outer periphery of the beam.
- the intensity distribution of the laser light after passing through the pinhole 143h is removed from the tail part of the laser light intensity distribution that does not contribute to the cutting of the polarizing plate. By doing so, the intensity distribution of the laser light becomes an ideal Gaussian distribution.
- the half width of the intensity distribution of the laser light after passing through the pinhole 143h is narrower than the half width of the intensity distribution of the laser light before passing through the pinhole 143h.
- the control device 107 performs control to move the scanner 105 and the table 101 along the laser processing line WCL (see FIG. 9) while rotating the laser light emitted from the IOR 104 by the scanner 105.
- FIG. 9 is a diagram showing a laser processing line.
- the laser processing line WCL has a rectangular frame shape in plan view
- the object 110 having a rectangular shape in plan view is displayed on four sides of the object 110.
- a case where laser processing is performed in a rectangular frame shape in the clockwise direction will be described.
- a rectangular portion inside the laser processing line WCL after the object 110 is laser processed is a used portion AR1 used for a product or the like.
- the rectangular frame-shaped part outside the laser processing line WCL is a surplus part AR2 that is not used.
- FIG. 10 is a diagram illustrating a moving locus of laser light when the object is cut using the laser light irradiation apparatus according to the comparative example.
- the laser beam irradiation apparatus according to the comparative example is a laser beam irradiation apparatus that relatively moves the scanner and the table as they are along the laser processing line WCL, that is, a laser beam movement locus UrX (hereinafter, laser beam movement locus).
- UrX hereinafter, laser beam movement locus
- FIG. 11 is a diagram illustrating a movement locus of laser light when the object is cut using the laser light irradiation apparatus according to the present embodiment.
- FIG. 11 is a diagram illustrating a movement locus of laser light when the object is cut using the laser light irradiation apparatus according to the present embodiment.
- the symbol Ur is a laser beam movement locus
- the symbol Us is a locus obtained by projecting a movement locus caused by the relative movement of the scanner 105 and the table 101 onto an object (hereinafter also referred to as a relative movement locus).
- the reference symbol Up represents an overlapping portion (hereinafter sometimes referred to as an overlapping portion) between the laser beam movement locus Ur and the relative movement locus Us.
- 10 and 11 are enlarged views of a portion K surrounded by a broken line of the laser processing line WCL in FIG.
- the laser beam movement trajectory UrX is linear.
- the output of the laser beam is increased or the cutting speed is decreased in order to reliably cut the object, defects such as cracks and chips may occur on the cut surface of the object.
- the laser beam movement locus Ur vibrates in a direction orthogonal to the laser processing line WCL, A plurality of overlapping portions Up that are irradiated with the light being superimposed a plurality of times are formed along the laser processing line WCL.
- the laser beam movement locus Ur has a spiral shape having an elliptical loop portion.
- the loop portion of the laser beam movement locus Ur has a long axis in a direction orthogonal to the laser processing line WCL, and the width Uw in the long axis direction is about 100 ⁇ m.
- the end of the laser beam movement locus Ur in the long axis direction overlaps a part of the relative movement locus Us.
- the overlapping portion Up is a portion where the laser beam is substantially irradiated twice.
- the overlapping portion Up is arranged with a predetermined interval along the laser processing line WCL.
- portions where the laser light is irradiated only once and portions where the laser light is irradiated twice are superimposed (superimposed portion Up) are alternately arranged.
- the overlapping portion Up is formed in a perforated shape along the laser processing line WCL.
- the laser light irradiation area according to the present embodiment extends toward the surplus portion AR2.
- the relative movement locus Us is disposed along the outermost line of the use portion AR1.
- the laser beam movement trajectory Ur is arranged at an interval in the surplus portion AR2.
- the overlapped portion Up is irradiated with laser light substantially a plurality of times (for example, twice in the present embodiment). Therefore, the output of the laser beam can be made smaller than the output when the object is cut by one laser irradiation (hereinafter, sometimes referred to as a cutting output).
- the output of the laser light may be any output that can cut the object by two laser irradiations.
- the laser beam output is set to 60% of the cutting output.
- the arrangement interval of the overlapping portions Up is sufficiently small, the object can be reliably cut with such an output.
- the control device 107 relatively moves the scanner 105 and the table 101 along the laser processing line WCL while deflecting the laser beam by the scanner 105. Is formed on the laser processing line WCL to form an overlapped portion Up on which the laser beam is superimposed and irradiated a plurality of times. Therefore, it can suppress that defects, such as a crack of a cut surface of the target object 110, and a chip
- the scanner 105 deflects the laser light toward the surplus portion AR2 outside the laser processing line WCL. Therefore, the above-described effects can be obtained without affecting the used portion AR1 used as a product or the like.
- the surplus portion AR2 of the object 110 is thin in a wide range. Therefore, the surplus part AR2 of the object 110 can be easily peeled from the use part AR2.
- the loop portion of the laser beam movement locus Ur has an elliptical shape having a short axis in a direction parallel to the laser processing line WCL. Therefore, the overlapping portions Up can be concentrated along the laser processing line WCL by controlling the short axis length of the ellipse to be short. Therefore, the arrangement interval of the overlapping portions Up can be easily reduced, and the object 110 can be cut more reliably.
- the second condenser lens 108 is disposed on the optical path between the scanner 105 and the table 101, the laser light passing through the scanner 105 can be condensed in parallel to the object 110. Therefore, the object 110 can be cut with high accuracy.
- the scanning of the laser beam is mainly performed by the moving device 106, and an area where the irradiation position of the laser beam cannot be accurately controlled by the moving device 106 is adjusted by the scanner 105. Therefore, the irradiation position of the laser beam can be accurately controlled in a wide range as compared with the case where the laser beam is scanned only by the moving device 106 or the scanner 105 alone.
- control device 107 performs control to move the scanner 105 and the table 101 along the laser processing line WCL while rotating the laser light emitted from the IOR 104 by the scanner 105.
- the control device 107 moves the scanner 105 and the table 101 along the laser processing line WCL while deflecting the laser light emitted from the IOR 104 by the scanner 105, so that the laser light is emitted a plurality of times on the laser processing line WCL.
- Various configurations can be employed as long as they form a superimposed portion that is irradiated in a superimposed manner.
- the laser beam movement locus Ur has a spiral shape having an elliptical loop portion, but is not limited thereto.
- the laser beam movement locus various shapes can be appropriately employed.
- FIG. 12 is a diagram showing a first modification of the laser beam movement locus according to the present embodiment.
- the overlapping portions Up1 can be densely arranged along the laser processing line WCL by controlling the diameter of the circle to be short. Therefore, the object 110 can be cut more reliably.
- FIG. 13 is a view showing a second modification of the laser beam movement locus according to the present embodiment.
- the laser beam movement locus Ur2 is shown separated from the relative movement locus Us. However, actually, the laser beam movement locus Ur2 overlaps a part of the relative movement locus Us.
- the loop portion of the laser beam movement locus Ur2 according to the present modification has a rectangular shape.
- the overlapped portion Up2 is not a point but a line, so that the object can be cut more reliably.
- FIG. 14 is a diagram showing a third modification of the laser beam movement locus according to the present embodiment.
- the laser beam movement locus Ur3 is separated from the relative movement locus Us and divided into two straight lines. However, actually, the laser beam movement locus Ur3 overlaps a part of the relative movement locus Us.
- the control device 107 performs control to move the scanner 105 and the table 101 along the laser processing line WCL while rotating the laser light emitted from the IOR 104 by the scanner 105.
- the control device according to this modification performs control to move the scanner 105 and the table 101 along the laser processing line WCL while linearly vibrating the laser light emitted from the IOR 104 by the scanner 105.
- the laser beam movement locus Ur3 according to this modification is linear.
- the laser beam movement locus Ur3 vibrates up and down (reciprocates).
- the laser light irradiation area according to the present embodiment is linear along the laser processing line WCL.
- the relative movement trajectory Us is arranged along the outermost line of the use portion AR1.
- the laser beam movement trajectory Ur3 is arranged at an interval along the outermost line of the use portion AR1.
- the overlapped portion Up3 is not a point but a line, and the overlapped portion Up3 is irradiated with the laser beam substantially three times. It can be cut reliably.
- the film bonding system 1 which is a manufacturing apparatus of the optical member bonding body which concerns on one Embodiment of this invention is demonstrated with reference to drawings.
- the film bonding system 1 which concerns on this embodiment is comprised by the laser beam irradiation apparatus 100 which the cutting device mentioned above.
- FIG. 15 is a diagram illustrating a schematic configuration of the film bonding system 1 of the present embodiment.
- the film bonding system 1 bonds a film-shaped optical member such as a polarizing film, an antireflection film, and a light diffusion film to a panel-shaped optical display component such as a liquid crystal panel or an organic EL panel.
- the transport direction of the liquid crystal panel which is an optical display component
- the direction orthogonal to the X direction (the width direction of the liquid crystal panel) in the plane of the liquid crystal panel is the Y direction, the X direction, and the Y direction.
- the direction orthogonal to the Z direction is taken as the Z direction.
- the film bonding system 1 of this embodiment is provided as one process of the manufacturing line of liquid crystal panel P. As shown in FIG. Each part of the film bonding system 1 is comprehensively controlled by the control part 40 as an electronic control apparatus.
- FIG. 16 is a plan view of the liquid crystal panel P viewed from the thickness direction of the liquid crystal layer P3.
- the liquid crystal panel P includes a first substrate P1 that has a rectangular shape in plan view, a second substrate P2 that has a relatively small rectangular shape that is disposed to face the first substrate P1, a first substrate P1, and a second substrate. And a liquid crystal layer P3 sealed between the substrate P2.
- the liquid crystal panel P has a rectangular shape that follows the outer shape of the first substrate P1 in a plan view, and a region that fits inside the outer periphery of the liquid crystal layer P3 in a plan view is a display region P4.
- FIG. 17 is a cross-sectional view taken along the line AA in FIG.
- a first optical member cut out from each of a long belt-like first optical sheet F1 and second optical sheet F2 (see FIG. 15, hereinafter may be collectively referred to as an optical sheet FX).
- F11 and the second optical member F12 (hereinafter may be collectively referred to as an optical member F1X) are appropriately bonded.
- the first optical member F11 and the second optical member F12 as polarizing films are bonded to both the backlight side and the display surface side of the liquid crystal panel P, respectively.
- a frame portion G having a predetermined width for arranging a sealant or the like for joining the first and second substrates of the liquid crystal panel P is provided outside the display area P4.
- the 1st optical member F11 and the 2nd optical member F12 are the 1st sheet piece F1m and 2nd sheet piece F2m (henceforth a sheet piece FXm and an optical member sheet
- FIG. 18 is a partial cross-sectional view of the optical sheet FX bonded to the liquid crystal panel P.
- the optical sheet FX includes a film-like optical member main body F1a, an adhesive layer F2a provided on one surface (the upper surface in FIG. 18) of the optical member main body F1a, and one optical member main body F1a via the adhesive layer F2a.
- the optical member main body F1a functions as a polarizing plate, and is bonded over the entire display area P4 of the liquid crystal panel P and its peripheral area. For convenience of illustration, hatching of each layer in FIG. 18 is omitted.
- the optical member body F1a is bonded to the liquid crystal panel P via the adhesive layer F2a in a state where the separator F3a is separated while leaving the adhesive layer F2a on one surface thereof.
- excluding the separator F3a from the optical sheet FX is called the bonding sheet
- the separator F3a protects the adhesive layer F2a and the optical member body F1a before being separated from the adhesive layer F2a.
- the surface protective film F4a is bonded to the liquid crystal panel P together with the optical member body F1a.
- the surface protective film F4a is disposed on the side opposite to the liquid crystal panel P with respect to the optical member body F1a to protect the optical member body F1a.
- the surface protective film F4a is separated from the optical member main body F1a at a predetermined timing.
- the optical sheet FX may be configured not to include the surface protective film F4a, or the surface protective film F4a may be configured not to be separated from the optical member body F1a.
- the optical member body F1a is bonded to the sheet-like polarizer F6, the first film F7 bonded to one surface of the polarizer F6 with an adhesive or the like, and the other surface of the polarizer F6 with an adhesive or the like. And a second film F8.
- the first film F7 and the second film F8 are protective films that protect the polarizer F6, for example.
- the optical member body F1a may have a single-layer structure composed of a single optical layer, or may have a stacked structure in which a plurality of optical layers are stacked on each other.
- the optical layer may be a retardation film, a brightness enhancement film, or the like.
- At least one of the first film F7 and the second film F8 may be subjected to a surface treatment capable of obtaining an effect such as a hard coat treatment for protecting the outermost surface of the liquid crystal display element or an antiglare treatment.
- the optical member body F1a may not include at least one of the first film F7 and the second film F8.
- the separator F3a may be bonded to one surface of the optical member main body F1a via the adhesive layer F2a.
- the film laminating system 1 of the present embodiment has a structure in which the liquid crystal panel P on the right side in the drawing in the conveyance direction upstream side (+ X direction side) to the left side in the drawing in the liquid crystal panel P in the conveyance direction ( X-direction side), and a drive type roller conveyor 5 that conveys the liquid crystal panel P in a horizontal state is provided.
- the roller conveyor 5 is divided into an upstream conveyor 6 and a downstream conveyor 7 with a reversing device 15 described later as a boundary.
- the liquid crystal panel P On the upstream conveyor 6, the liquid crystal panel P is transported so that the short side of the display area P ⁇ b> 4 is along the transport direction.
- the downstream conveyor 7 On the downstream conveyor 7, the liquid crystal panel P is transported with the long side of the display area P ⁇ b> 4 along the transport direction.
- a sheet piece FXm (corresponding to the optical member F1X) of the bonding sheet F5 cut out to a predetermined length from the belt-shaped optical sheet FX is bonded.
- the upstream conveyor 6 includes an independent free roller conveyor 24 on the downstream side in the first suction device 11 described later.
- the downstream conveyor 7 includes an independent free roller conveyor 24 on the downstream side in the second suction device 20 described later.
- the film bonding system 1 of this embodiment is the 1st adsorption
- the dust device 16, the 2nd bonding apparatus 17, the 2nd detection apparatus 42, the 2nd cutting device 32, and the control part 40 are provided.
- the first suction device 11 sucks and transports the liquid crystal panel P to the upstream conveyor 6 and performs alignment (positioning) of the liquid crystal panel P.
- the first suction device 11 includes a panel holding unit 11a, an alignment camera 11b, and a rail R.
- the panel holding unit 11a holds the liquid crystal panel P in contact with the downstream stopper S by the upstream conveyor 6 so as to be movable in the vertical direction and the horizontal direction, and aligns the liquid crystal panel P.
- the panel holding part 11a sucks and holds the upper surface of the liquid crystal panel P in contact with the stopper S by vacuum suction.
- the panel holding part 11a moves on the rail R in a state where the liquid crystal panel P is sucked and held, and transports the liquid crystal panel P.
- the panel holding unit 11 a releases the suction holding and delivers the liquid crystal panel P to the free roller conveyor 24.
- the panel holding unit 11a holds the liquid crystal panel P in contact with the stopper S, and images the alignment mark, tip shape, and the like of the liquid crystal panel P in the raised state.
- Image data obtained by the alignment camera 11b is transmitted to the control unit 40.
- the panel holding unit 11a is operated to align the liquid crystal panel P with the free roller conveyor 24 as a transport destination.
- the liquid crystal panel P is transported to the free roller conveyor 24 in consideration of the shift in the transport direction with respect to the free roller conveyor 24, the direction orthogonal to the transport direction, and the turning direction about the vertical axis of the liquid crystal panel P.
- the liquid crystal panel P conveyed on the rail R by the panel holding unit 11a is nipped by the pressure roll 23 together with the sheet piece FXm while being adsorbed by the adsorption pad 26.
- the 1st dust collector 12 is provided in the conveyance upstream of the liquid crystal panel P of the pinching roll 23 which is the bonding position of the 1st bonding apparatus 13.
- FIG. The first dust collector 12 removes static electricity and collects dust in order to remove dust around the liquid crystal panel P before being introduced to the bonding position, particularly dust on the lower surface side.
- the 1st bonding apparatus 13 is provided in the panel conveyance downstream rather than the 1st adsorption
- FIG. The 1st bonding apparatus 13 bonds the bonding sheet
- the 1st bonding apparatus 13 is provided with the conveying apparatus 22 and the pinching roll 23.
- FIG. 1st bonding apparatus 13 is provided with the conveying apparatus 22 and the pinching roll 23.
- the conveying device 22 conveys the optical sheet FX along the longitudinal direction while unwinding the optical sheet FX from the original roll R1 around which the optical sheet FX is wound.
- the conveying apparatus 22 conveys the bonding sheet
- the conveyance device 22 includes a roll holding portion 22a, a plurality of guide rollers 22b, a cutting device 22c, a knife edge 22d, and a winding portion 22e.
- the roll holding unit 22a holds the original roll R1 around which the belt-shaped optical sheet FX is wound and feeds the optical sheet FX along the longitudinal direction thereof.
- the plurality of guide rollers 22b wind the optical sheet FX so as to guide the optical sheet FX unwound from the original roll R1 along a predetermined conveyance path.
- the cutting device 22c performs a half cut on the optical sheet FX on the conveyance path.
- the knife edge 22d supplies the bonding sheet F5 to the bonding position while separating the bonding sheet F5 from the separator F3a by winding the optical sheet FX subjected to the half cut at an acute angle.
- the winding unit 22e holds a separator roll R2 that winds the separator F3a that has become independent through the knife edge 22d.
- the roll holding unit 22a positioned at the start point of the transport device 22 and the winding unit 22e positioned at the end point of the transport device 22 are driven in synchronization with each other, for example.
- the winding unit 22e winds the separator F3a having passed through the knife edge 22d while the roll holding unit 22a feeds the optical sheet FX in the transport direction.
- the upstream side in the transport direction of the optical sheet FX (separator F3a) in the transport device 22 is referred to as a sheet transport upstream side
- the downstream side in the transport direction is referred to as a sheet transport downstream side.
- Each guide roller 22b changes the traveling direction of the optical sheet FX being conveyed along the conveyance path, and at least a part of the plurality of guide rollers 22b is movable so as to adjust the tension of the optical sheet FX being conveyed.
- a dancer roller (not shown) may be disposed between the roll holding unit 22a and the cutting device 22c.
- the dancer roller absorbs the feeding amount of the optical sheet FX conveyed from the roll holding unit 22a while the optical sheet FX is cut by the cutting device 22c.
- FIG. 19 is a diagram illustrating the operation of the cutting device 22c of the present embodiment.
- the cutting device 22c applies a part in the thickness direction of the optical sheet FX over the entire width in the width direction orthogonal to the longitudinal direction of the optical sheet FX. Make a half-cut to cut.
- the cutting device 22c of the present embodiment is provided so as to be able to advance and retreat from the side opposite to the separator F3a with respect to the optical sheet FX toward the optical sheet FX.
- the cutting device 22c adjusts the advancing / retreating position of the cutting blade so that the optical sheet FX (separator F3a) is not broken by the tension acting during conveyance of the optical sheet FX (so that a predetermined thickness remains in the separator F3a), Half-cut to the vicinity of the interface between the adhesive layer F2a and the separator F3a.
- the optical member main body F1a and the surface protection film F4a are cut in the thickness direction, thereby forming cut lines L1 and L2 extending over the entire width in the width direction of the optical sheet FX.
- the cut lines L1 and L2 are formed so as to be aligned in the longitudinal direction of the belt-shaped optical sheet FX.
- the plurality of cut lines L1 and L2 are formed at equal intervals in the longitudinal direction of the optical sheet FX.
- the optical sheet FX is divided into a plurality of sections in the longitudinal direction by a plurality of cut lines L1, L2.
- a section sandwiched between a pair of cutting lines L1 and L2 adjacent in the longitudinal direction in the optical sheet FX is a sheet piece FXm in the bonding sheet F5.
- the sheet piece FXm is a sheet piece of the optical sheet FX having a size that protrudes outside the liquid crystal panel P.
- the knife edge 22d is disposed below the upstream conveyor 6 and extends at least over its entire width in the width direction of the optical sheet FX.
- the knife edge 22d is wound so as to be in sliding contact with the separator F3a side of the optical sheet FX after the half cut.
- the knife edge 22d is seen from the width direction of the optical sheet FX above the first surface, and the first surface arranged in an inclined position when viewed from the width direction of the optical sheet FX (width direction of the upstream conveyor 6). It has the 2nd surface arrange
- the knife edge 22d winds the 1st optical sheet F1 to an acute angle at the front-end
- the first optical sheet F1 separates the sheet piece (first sheet piece F1m) of the bonding sheet F5 from the separator F3a when folded at an acute angle at the tip of the knife edge 22d.
- the tip end of the knife edge 22d is arranged close to the panel conveyance downstream side of the pinching roll 23.
- the first sheet piece F1m separated from the separator F3a by the knife edge 22d is introduced between the pair of bonding rollers 23a of the pinching roll 23 while overlapping the lower surface of the liquid crystal panel P in a state of being sucked by the first suction device 11. Is done.
- the first sheet piece F1m is a sheet piece of the first optical sheet F1 having a size that protrudes outside the liquid crystal panel P.
- the separator F3a separated from the bonding sheet F5 is directed to the winding portion 22e by the knife edge 22d.
- the winding unit 22e winds and collects the separator F3a separated from the bonding sheet F5.
- the pinching roll 23 bonds the first sheet piece F1m separated from the first optical sheet F1 by the conveying device 22 to the lower surface of the liquid crystal panel P conveyed by the upstream conveyor 6.
- the pinching roll 23 is equivalent to the bonding apparatus as described in a claim.
- the pinching roll 23 has a pair of bonding rollers 23a and 23a arranged in parallel with each other in the axial direction (the upper bonding roller 23a moves up and down).
- a predetermined gap is formed between the pair of bonding rollers 23 a and 23 a, and the inside of this gap is the bonding position of the first bonding apparatus 13.
- liquid crystal panel P and the first sheet piece F1m are overlapped and introduced. These liquid crystal panel P and the 1st sheet piece F1m are sent out to the panel conveyance downstream of the upstream conveyor 6, being clamped by each bonding roller 23a.
- 1st optical member bonding body PA1 is formed by the 1st sheet piece F1m being bonded by the pinching roll 23 to the surface at the side of the backlight of liquid crystal panel P. As shown in FIG.
- the 1st detection apparatus 41 is provided in the panel conveyance downstream rather than the 1st bonding apparatus 13.
- FIG. The 1st detection apparatus 41 detects the edge of the bonding surface (henceforth a 1st bonding surface) of liquid crystal panel P and the 1st sheet piece F1m.
- FIG. 20 is a plan view showing a step of detecting the edge ED of the first bonding surface SA1.
- the first detection device 41 detects the edge ED of the first bonding surface SA ⁇ b> 1 in the four inspection areas CA installed on the transport path of the upstream conveyor 6.
- region CA is arrange
- the edge ED is detected for each liquid crystal panel P conveyed on the line.
- the data of the edge ED detected by the first detection device 41 is stored in a storage unit (not shown).
- region CA may be arrange
- FIG. 21 is a schematic diagram of the first detection device 41.
- the configuration of the first detection device 41 is shown upside down with the side on which the first sheet piece F1m of the first optical member bonding body PA1 is bonded as the upper side.
- the first detection device 41 has an illumination light source 44 that illuminates the edge ED and the first bonding surface SA1 rather than the edge ED with respect to the normal direction of the first bonding surface SA1.
- the image pickup device 43 is disposed at a position inclined inward and picks up an image of the edge ED from the side where the first sheet piece F1m of the first optical member bonding body PA1 is bonded.
- the illumination light source 44 and the imaging device 43 are respectively arranged in the four inspection areas CA (positions corresponding to the four corners of the first bonding surface SA1) shown in FIG.
- An angle ⁇ between the normal line of the first bonding surface SA1 and the normal line of the image pickup surface 43a of the image pickup device 43 (hereinafter referred to as an inclination angle ⁇ of the image pickup device 43) is divided into panels within the image pickup field of the image pickup device 43. It is preferable to set so that time lag, burrs and the like do not enter. For example, when the end surface of the second substrate P2 is shifted outward from the end surface of the first substrate P1, the inclination angle ⁇ of the imaging device 43 is such that the edge of the second substrate P2 enters the imaging field of the imaging device 43. Set to not.
- the inclination angle ⁇ of the imaging device 43 is set to match the distance H (hereinafter referred to as the height H of the imaging device 43) between the first bonding surface SA1 and the center of the imaging surface 43a of the imaging device 43. It is preferred that For example, when the height H of the imaging device 43 is 50 mm or more and 100 mm or less, the inclination angle ⁇ of the imaging device 43 is preferably set to an angle in the range of 5 ° or more and 20 ° or less. However, when the deviation amount is empirically known, the height H of the imaging device 43 and the inclination angle ⁇ of the imaging device 43 can be obtained based on the deviation amount. In the present embodiment, the height H of the imaging device 43 is set to 78 mm, and the inclination angle ⁇ of the imaging device 43 is set to 10 °.
- the illumination light source 44 and the imaging device 43 are fixedly arranged in each inspection area CA.
- the illumination light source 44 and the imaging device 43 may be arrange
- the illumination light source 44 and the imaging device 43 should each be provided one each. Thereby, the illumination light source 44 and the imaging device 43 can be moved to a position where the edge ED of the first bonding surface SA1 can be easily imaged.
- the illumination light source 44 is arrange
- the illumination light source 44 is arrange
- the optical axis of the illumination light source 44 and the normal line of the imaging surface 43a of the imaging device 43 are parallel.
- the illumination light source may be arrange
- optical axis of the illumination light source 44 and the normal line of the image pickup surface 43a of the image pickup device 43 may slightly cross each other.
- the cutting position of the first sheet piece F1m is adjusted based on the detection result of the edge ED of the first bonding surface SA1.
- the control part 40 acquires the data of the edge ED of 1st bonding surface SA1 memorize
- the cutting position of the first sheet piece F1m is determined so as not to protrude beyond the outer side.
- the first cutting device 31 cuts the first sheet piece F1m at the cutting position determined by the control unit 40.
- the first cutting device 31 is provided on the downstream side of the panel conveyance with respect to the first detection device 41.
- the 1st cutting device 31 performs the laser cut along edge ED, and is the 1st sheet piece F1m (1st sheet
- the surplus portion of the piece F1m) is cut off, and an optical member (first optical member F11) having a size corresponding to the first bonding surface SA1 is formed.
- the 1st cutting device 31 is corresponded to the cutting device as described in a claim.
- the size corresponding to the first bonding surface SA1 indicates the size of the outer shape of the first substrate P1. However, it includes a region that is not less than the size of the display region P4 and not more than the size of the outer shape of the liquid crystal panel P, and that avoids a functional part such as an electrical component mounting portion.
- the first optical member F11 is bonded to the surface on the backlight side of the liquid crystal panel P by cutting off the excess portion of the first sheet piece F1m from the first optical member bonding body PA1 by the first cutting device 31.
- Optical member bonding body PA2 is formed.
- the surplus part cut off from the first sheet piece F1m is peeled off and collected from the liquid crystal panel P by a peeling device (not shown).
- the reversing device 15 reverses the front and back of the second optical member bonding body PA2 with the display surface side of the liquid crystal panel P as the upper surface so that the backlight side of the liquid crystal panel P is the upper surface, and the liquid crystal panel for the second bonding device 17 Align P.
- the reversing device 15 has the same alignment function as the panel holding unit 11a of the first suction device 11.
- the reversing device 15 is provided with an alignment camera 15 c similar to the alignment camera 11 b of the first suction device 11.
- the reversing device 15 is positioned in the component width direction of the second optical member bonding body PA2 with respect to the second bonding device 17 based on the inspection data in the optical axis direction stored in the control unit 40 and the imaging data of the alignment camera 15c. Position in the rotational direction. In this state, 2nd optical member bonding body PA2 is introduce
- the second adsorption device 20 has the same configuration as the first adsorption device 11, the same parts are denoted by the same reference numerals and described.
- suction apparatus 20 adsorbs 2nd optical member bonding body PA2, conveys it to the downstream conveyor 7, and performs alignment (positioning) of 2nd optical member bonding body PA2.
- the second suction device 20 includes a panel holding unit 11a, an alignment camera 11b, and a rail R.
- the panel holding part 11a holds the second optical member bonding body PA2 in contact with the downstream stopper S by the downstream conveyor 7 so as to be movable in the vertical direction and the horizontal direction and aligns the second optical member bonding body PA2.
- maintenance part 11a adsorbs and hold
- maintenance part 11a moves on the rail R in the state which adsorbed and hold
- the alignment camera 11b holds the second optical member bonding body PA2 in contact with the stopper S by the panel holding portion 11a, and images the alignment mark, the tip shape, and the like of the second optical member bonding body PA2 in the raised state.
- Imaging data from the alignment camera 11b is transmitted to the control unit 40, and based on this imaging data, the panel holding unit 11a is operated to align the second optical member bonding body PA2 with respect to the free roller conveyor 24 as the transport destination. That is, 2nd optical member bonding body PA2 is in the state which considered the gap in the turning direction around the perpendicular direction of the conveyance direction to the free roller conveyor 24, the direction orthogonal to the conveyance direction, and the 2nd optical member bonding body PA2. It is conveyed to the free roller conveyor 24.
- the second dust collecting device 16 is arranged on the upstream side in the transport direction of the liquid crystal panel P with respect to the pinching roll 23 which is the bonding position of the second bonding device 17.
- the second dust collecting device 16 performs static electricity removal and dust collection in order to remove dust around the second optical member bonding body PA2 before being introduced to the bonding position, particularly dust on the lower surface side.
- the 2nd bonding apparatus 17 is provided in the panel conveyance downstream rather than the 2nd dust collector 16.
- FIG. The 2nd bonding apparatus 17 bonded the bonding sheet F5 (equivalent to 2nd sheet piece F2m) cut into the predetermined size with respect to the lower surface of 2nd optical member bonding body PA2 introduced into the bonding position.
- the 2nd bonding apparatus 17 is provided with the conveying apparatus 22 and the pinching roll 23 similar to the 1st bonding apparatus 13.
- 2nd optical member bonding body PA2 and 2nd sheet piece F2m are overlapped and introduce
- the second sheet piece F2m is a sheet piece of the second optical sheet F2 having a size larger than the display area P4 of the liquid crystal panel P.
- These 2nd optical member bonding body PA2 and the 2nd sheet piece F2m are sent out to the panel conveyance downstream of the downstream conveyor 7, being pinched by each bonding roller 23a.
- it is a 2nd sheet
- the piece F2m By bonding the piece F2m, the third optical member bonding body PA3 is formed.
- the 2nd detection apparatus 42 is provided in the panel conveyance downstream rather than the 2nd bonding apparatus 17.
- FIG. The 2nd detection apparatus 42 detects the edge of the bonding surface (henceforth a 2nd bonding surface) of liquid crystal panel P and the 2nd sheet piece F2m.
- the edge data detected by the second detection device 42 is stored in a storage unit (not shown).
- the cut position of the second sheet piece F2m is adjusted based on the detection result of the edge of the second bonding surface.
- the control part 40 acquires the data of the edge of the 2nd bonding surface memorize
- the cutting position of the second sheet piece F2m is determined so as not to protrude.
- the second cutting device 32 cuts the second sheet piece F2m at the cutting position determined by the control unit 40.
- the second cutting device 32 is provided on the downstream side of the panel conveyance with respect to the second detection device 42.
- the 2nd cutting device 32 is the 2nd sheet piece F2m of the part which protruded from the 3rd optical member bonding body PA3 to the outer side of the 2nd bonding surface by performing a laser cut along the edge of a 2nd bonding surface. (Excess part of 2nd sheet piece F2m) is cut off, and the optical member (2nd optical member F12) of the magnitude
- the second optical member F12 is bonded to the surface on the display surface side of the liquid crystal panel P by cutting off the excess portion of the second sheet piece F2m from the third optical member bonding body PA3 by the second cutting device 32, and
- the first optical member F11 is bonded to the backlight side surface of the liquid crystal panel P to form a fourth optical member bonded body PA4 (optical member bonded body).
- the surplus portion separated from the second sheet piece F2m is peeled off from the liquid crystal panel P by a peeling device (not shown) and collected.
- the 1st cutting device 31 and the 2nd cutting device 32 are comprised by the laser beam irradiation apparatus 100 mentioned above.
- the 1st cutting device 31 and the 2nd cutting device 32 cut
- a bonding inspection device (not shown) is provided on the downstream side of the panel conveyance from the second bonding device 17.
- the bonding inspection apparatus is an inspection (not shown whether the position of the optical member F1X is appropriate (whether the position deviation is within the tolerance range)) by the inspection apparatus (not shown) of the workpiece (liquid crystal panel P) on which the film is bonded. Etc.).
- the work determined that the position of the optical member F1X with respect to the liquid crystal panel P is not appropriate is discharged out of the system by a not-shown discharging means.
- control part 40 as an electronic control apparatus which performs overall control of each part of the film bonding system 1 is comprised including the computer system.
- This computer system includes an arithmetic processing unit such as a CPU and a storage unit such as a memory and a hard disk.
- the control unit 40 of the present embodiment includes an interface capable of executing communication with an external device of the computer system.
- An input device that can input an input signal may be connected to the control unit 40.
- the input device includes an input device such as a keyboard and a mouse, or a communication device that can input data from a device external to the computer system.
- the control unit 40 may include a display device such as a liquid crystal display that indicates the operation status of each unit of the film bonding system 1 or may be connected to the display device.
- the storage unit of the control unit 40 includes a program that causes the arithmetic processing unit to control each unit of the film bonding system 1 to execute processing for causing each unit of the film bonding system 1 to accurately convey the optical sheet F. It is recorded. Various types of information including programs recorded in the storage unit can be read by the arithmetic processing unit of the control unit 40.
- the control unit 40 may include a logic circuit such as an ASIC that executes various processes required for controlling each unit of the film bonding system 1.
- the storage unit is a concept including a semiconductor memory such as a RAM (Random Access Memory) and a ROM (Read Only Memory), and an external storage device such as a hard disk, a CD-ROM reader, and a disk-type storage medium.
- the storage unit functionally includes the first adsorption device 11, the first dust collector 12, the first bonding device 13, the first detection device 41, the first cutting device 31, the reversing device 15, and the second adsorption device 20. , Second dust collector 16, second bonding device 17, second detection device 42, storage area for storing program software in which the control procedure of the operation of second cutting device 32 is described, and other various storage areas are set Is done.
- a plurality of inspection points CP are set in the width direction of the optical sheet FX, and the direction of the optical axis of the optical sheet FX is detected at each inspection point CP.
- the timing for detecting the optical axis may be at the time of manufacturing the original fabric roll R1, or may be until the optical sheet FX is unwound from the original fabric roll R1 and half cut.
- Data in the optical axis direction of the optical sheet FX is stored in a storage device (not shown) in association with the position of the optical sheet FX (position in the longitudinal direction and position in the width direction of the optical sheet FX).
- the control unit 40 acquires the optical axis data (inspection data on the in-plane distribution of the optical axis) of each inspection point CP from the storage device, and partitions the optical sheet FX (cut line CL) into the portion where the sheet piece FXm is cut out. The direction of the average optical axis of the region to be detected is detected.
- an angle (deviation angle) formed between the direction of the optical axis and the edge line EL of the optical sheet FX is detected for each inspection point CP, and the largest of the deviation angles (maximum)
- the direction that forms the average deviation angle ⁇ mid with respect to the edge line EL of the optical sheet FX is detected as the direction of the average optical axis of the optical sheet FX.
- the deviation angle is calculated, for example, with the counterclockwise direction being positive with respect to the edge line EL of the optical sheet FX and the clockwise direction being negative.
- the direction of the average optical axis of the optical sheet FX detected by the above method makes a desired angle with respect to the long side or the short side of the display region P4 of the liquid crystal panel P.
- the bonding position (relative bonding position) of the sheet piece FXm is determined. For example, when the direction of the optical axis of the optical member F1X is set to be 90 ° with respect to the long side or the short side of the display region P4 according to the design specification, the average optical axis of the optical sheet FX is set.
- the sheet piece FXm is bonded to the liquid crystal panel P so that the direction is 90 ° with respect to the long side or the short side of the display region P4.
- the above-described cutting devices 31 and 32 detect the outer peripheral edge of the display area P4 of the liquid crystal panel P by a detection unit such as a camera, and the sheet piece FXm bonded to the liquid crystal panel P is aligned along the outer peripheral edge of the bonding surface. Cut endlessly. The outer peripheral edge of the bonding surface is detected by imaging the edge of the bonding surface. In this embodiment, the laser cutting by each cutting device 31 and 32 is made along the outer periphery of the bonding surface.
- the runout width (tolerance) of the cutting line of the laser processing machine is smaller than that of the cutting blade. Therefore, in this embodiment, compared with the case of cutting the optical sheet FX using the cutting blade, the outer peripheral edge of the bonding surface
- the liquid crystal panel P can be reduced in size and / or the display area P4 can be increased in size. This is effective for application to high-function mobile devices that require expansion of the display screen while the size of the housing is limited, such as smartphones and tablet terminals in recent years.
- the optical sheet FX is cut into a sheet piece that matches the display region P4 of the liquid crystal panel P and then bonded to the liquid crystal panel P, the dimensional tolerances of the sheet piece and the liquid crystal panel P, and the relative bonding positions thereof Dimensional tolerances overlap. Therefore, it becomes difficult to narrow the width of the frame portion G of the liquid crystal panel P (it becomes difficult to enlarge the display area).
- the sheet piece FXm of the optical sheet FX of a size protruding from the optical sheet FX to the outside of the liquid crystal panel P, and pasting the cut sheet piece FXm on the liquid crystal panel P the sheet piece FXm is cut according to the bonding surface. Only the run-out tolerance of the cutting line needs to be considered, and the tolerance of the width of the frame G can be reduced ( ⁇ 0.1 mm or less). Also in this respect, the width of the frame part G of the liquid crystal panel P can be reduced (the display area can be enlarged).
- the force at the time of cutting is not input to the liquid crystal panel P, and the edge of the substrate of the liquid crystal panel P is less likely to be cracked or chipped. Durability is improved. Similarly, since there is no contact with the liquid crystal panel P, there is little damage to the electrical component mounting portion.
- FIG. 23 shows a control for scanning the laser beam in a rectangular shape on the sheet piece FXm when the sheet piece FXm is cut into an optical member F1X having a predetermined size using the laser beam irradiation apparatus 100 shown in FIG. 1 as a cutting device. It is a figure which shows a method.
- symbol Tr denotes a target laser beam movement locus (desired locus; hereinafter, referred to as laser light movement locus).
- Reference numeral Tr ⁇ b> 1 is a trajectory (hereinafter sometimes referred to as a light source movement trajectory) obtained by projecting a movement trajectory due to relative movement between the table 101 and the scanner 105 onto the sheet piece FXm.
- the light source movement locus Tr1 has a shape in which four corners of the laser light movement locus Tr having a rectangular shape are curved.
- Reference sign K1 is a straight section other than the corner, and reference sign K2 is a bent section of the corner.
- Reference numeral Tr2 indicates that the irradiation position of the laser beam is orthogonal to the light source movement trajectory Tr1 by the first irradiation position adjusting device 151 and the second irradiation position adjusting device 154 when the scanner 105 is relatively moving on the light source movement trajectory Tr1. It is a curve (hereinafter, sometimes referred to as an adjustment curve) indicating how much it is shifted (adjusted) in the direction of movement.
- the deviation amount (adjustment amount) of the laser irradiation position is indicated by the distance between the adjustment curve Tr2 and the laser beam movement locus Tr in the direction orthogonal to the light source movement locus Tr1.
- the light source movement locus Tr1 is a substantially rectangular movement locus whose corners are curved.
- the light source movement trajectory Tr1 and the laser beam movement trajectory Tr are substantially the same, and the shapes of both are different only in a narrow corner area. If the light source movement locus Tr1 has a rectangular shape, the moving speed of the scanner 105 is slow at the corners of the rectangle, and the corners may swell or wave due to the heat of the laser light. Therefore, in FIG. 23, the corner of the light source movement locus Tr1 is curved so that the moving speed of the scanner 105 is substantially constant over the entire light source movement locus Tr1.
- the control device 107 sets the irradiation position of the laser beam to the first irradiation position adjusting device 151. And without adjusting by the 2nd irradiation position adjustment apparatus 154, a laser beam is irradiated to the sheet piece FXm from the scanner 105 as it is.
- the scanner 105 is moving in the bending section K2
- the light source movement trajectory Tr1 and the laser light movement trajectory Tr do not coincide with each other, so that the first irradiation position adjusting device 151 and the second irradiation position adjusting device 154 perform laser light.
- the irradiation position of the laser beam is controlled so that the irradiation position of the laser beam is arranged on the laser beam movement locus Tr.
- the first irradiation position adjusting device 151 and the second irradiation position adjusting device 154 move the laser beam irradiation position in the direction N1 perpendicular to the light source movement locus Tr1. Shifted by W1.
- the distance W1 is the same as the distance W2 between the adjustment curve Tr2 and the laser beam movement locus Tr in the direction N1 orthogonal to the light source movement locus Tr1.
- the light source movement trajectory Tr1 is arranged inside the laser light movement trajectory Tr, but the irradiation position of the laser light is outside the laser light movement trajectory Tr by the first irradiation position adjusting device 151 and the second irradiation position adjusting device 154. Therefore, these deviations cancel out, and the irradiation position of the laser beam is arranged on the laser beam movement locus Tr.
- the control device 107 moves the scanner 105 and the table 101 relative to each other along the laser processing line WCL while deflecting the laser light by the scanner 105, thereby causing the laser light on the laser processing line WCL. Forms an overlapped portion Up that is irradiated by being overlapped a plurality of times.
- the control device 107 deflects the laser light toward the outside of the laser light movement locus Tr.
- the scanner 105 deflects the laser light toward the outside of the adjustment curve Tr2.
- the 1st cutting device 31 and the 2nd cutting device 32 are comprised by the laser beam irradiation apparatus mentioned above. Therefore, the sheet pieces F1m and F2m can be cut sharply, and deterioration in cut quality can be suppressed.
- the moving device 106 and the scanner 105 are controlled so as to draw a desired laser beam movement trajectory Tr in the sheet piece FXm.
- the laser beam irradiation section to be adjusted by the first irradiation position adjusting device 151 and the second irradiation position adjusting device 154 is only a narrow bending section K2.
- the laser beam is scanned on the sheet piece FXm by the movement of the table 101 by the moving device 106.
- the scanning of the laser beam is mainly performed by the moving device 106, and only the region where the moving position of the laser beam irradiation position cannot be accurately controlled by the moving device 106 is adjusted by the first irradiation position adjusting device 151 and the second irradiation position adjusting device 154. is doing. Therefore, the irradiation position of the laser beam can be accurately controlled in a wide range as compared with the case where the laser beam is scanned only by the moving device 106 or the scanner 105 alone.
- the imaging direction of the imaging device 43 crosses diagonally with respect to the normal direction of the first bonding surface SA1. That is, the imaging direction of the imaging device 43 is set so that the edge of the second substrate P2 does not enter the imaging field of view of the imaging device 43. Therefore, when the edge ED of the first bonding surface SA1 is detected over the first sheet piece F1m, the edge of the second substrate P2 is not erroneously detected, and the first bonding surface SA1 is not detected. Only the edge ED can be detected. Therefore, the edge ED of the first bonding surface SA1 can be detected with high accuracy.
- the excess part of the sheet pieces F1m and F2m is cut off, whereby the optical member F11 having a size corresponding to the bonding surface.
- F12 can be formed on the surface of the liquid crystal panel P.
- the optical axis direction of the sheet pieces F1m and F2m changes depending on the position of the sheet pieces F1m and F2m by bonding the sheet pieces F1m and F2m of a size protruding outside the liquid crystal panel P to the liquid crystal panel P.
- the liquid crystal panel P can be aligned and bonded in accordance with the direction. Thereby, the precision of the optical axis direction of the optical members F11 and F12 with respect to the liquid crystal panel P can be improved, and the color and contrast of the optical display device can be increased.
- the cutting devices 31 and 32 laser cut the sheet pieces F1m and F2m, so that the force is not exerted on the liquid crystal panel P as compared with the case where the sheet pieces F1m and F2m are cut with a blade, and cracks and chips occur. It becomes difficult, and the stable durability of the liquid crystal panel P can be obtained.
- disconnects a sheet piece as a structure which irradiates a target object with a laser beam and performs a predetermined process
- cutting a sheet penetrating the sheet piece and forming a groove (cut) with a predetermined depth in the sheet piece are also included.
- cutting (cutting off) an end portion of a sheet piece, half cutting, marking processing, and the like are included.
- the drawing locus of the laser beam emitted from the laser beam irradiation device is a rectangular shape (square shape) in plan view
- the present invention is not limited thereto.
- the drawing trajectory of the laser light emitted from the laser light irradiation device may be a triangular shape in plan view, or may be a polygonal shape that is a pentagon or more in plan view.
- a planar-view star shape and planar-view geometric shape may be sufficient.
- the present invention can also be applied to such a drawing trajectory.
- the optical sheet FX is pulled out from the original roll, and a sheet piece FXm of a size that protrudes outside the liquid crystal panel P is bonded to the liquid crystal panel P, and then the liquid crystal panel P is bonded from the sheet piece FXm.
- a sheet-like optical film chip cut out to the outside of the liquid crystal panel P is bonded to the liquid crystal panel without using the roll.
- SYMBOLS 1 Film bonding system (manufacturing apparatus of an optical member bonding body), 23 ... Nipping roll (bonding apparatus), 31 ... 1st cutting device, 32 ... 2nd cutting device, 100 ... Laser beam irradiation apparatus, 101 ... Table, 101s ... Holding surface, 102 ... Laser oscillator, 105 ... Scanner, 106 ... Moving device, 108 ... Condensing lens, P ... Liquid crystal panel (optical display component), P1 ... First substrate, P2 ... Second substrate , FX ... optical sheet, FXm ... sheet piece, F1X ... optical member, PA1 ... first optical member bonding body (sheet piece bonding body), PA4 ... fourth optical member bonding body (optical member bonding body), SA1 ... first. Bonding surface, ED ... edge, WCL ... laser processing line
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Abstract
Description
本願は、2013年2月13日に出願された日本国特願2013-026099号に基づき優先権を主張し、その内容をここに援用する。
(1)本発明の第一の態様に係るレーザー光照射装置は、対象物を保持する保持面を有するテーブルと、レーザー光を発振するレーザー光発振機と、前記保持面と平行な平面内で前記レーザー光を二次元に走査するスキャナーと、前記テーブルと前記スキャナーとを相対的に移動する移動装置と、前記スキャナーと前記移動装置とを制御する制御装置と、を含み、前記制御装置は、前記スキャナーによって前記レーザー光を偏向させつつレーザー加工ラインに沿って前記スキャナーと前記テーブルとを相対的に移動させることにより、前記レーザー加工ライン上に、前記レーザー光が複数回重畳して照射される重畳部分を形成する。
図1は、対象物の切断装置として用いられるレーザー光照射装置100の一例を示す斜視図である。
図2に示すように、EBS130は、レーザー光発振機102から発振されるレーザー光の光路上に配置された音響光学素子103と、音響光学素子103と電気的に接続された駆動ドライバ131と、レーザー光が音響光学素子103を通過するタイミングを制御する制御装置107(後述するレーザー制御部171に相当)と、を有する。
EBS130は、レーザー光の出力が安定するまでレーザー光を遮蔽する。
特に、レーザー光発振機102から発振されるレーザー光の立ち下がり部分の幅(時間)がレーザー光の立ち上がり部分の幅(時間)よりも十分に短い場合には、レーザー光の立ち下がり部分を除去する実益が小さい。そのため、このような場合には、レーザー光発振機102から発振されるレーザー光の立ち上がり部分のみを選択的に除去してもよい。
図3に示すように、IOR104は、EBS130から射出されたレーザー光を集光する第1集光レンズ141と、第1集光レンズ141を保持する第1保持枠142と、第1集光レンズ141によって集光されたレーザー光を絞る絞り部材143と、絞り部材143を保持する保持部材144と、絞り部材143によって絞られたレーザー光を平行化するコリメートレンズ145と、コリメートレンズ145を保持する第2保持枠146と、第1保持枠142、保持部材144及び第2保持枠146を相対的に移動させる移動機構147と、を有する。
スキャナー制御部172は、第1照射位置調整装置151のアクチュエータ153、第2照射位置調整装置154のアクチュエータ156の各々駆動の制御を行う。
スライダ制御部173は、第1スライダ機構161及び第2スライダ機構162の各々が内蔵するリニアモータの作動の制御を行う。
図5に示すように、制御装置107には入力信号を入力可能な入力装置109が接続されている。入力装置109は、キーボード、マウス等の入力機器、あるいは外部の装置からのデータを入力可能な通信装置等を有する。制御装置107は、レーザー光照射装置100の各部の動作状況を示す液晶表示ディスプレイ等の表示装置を含んでいてもよいし、表示装置と接続されていてもよい。
図6(a)は、レーザー光発振機102から発振されるレーザー光の制御信号を示している。
図6(b)は、レーザー光発振機102から発振されたレーザー光そのものの出力特性、即ちレーザー光発振機102から発振されたレーザー光が音響光学素子103を通過する前のレーザー光の出力特性を示している。
図6(c)は、音響光学素子103の制御信号を示している。
図6(d)は、レーザー光発振機102から発振されたレーザー光が音響光学素子103を通過した後のレーザー光の出力特性を示している。
図6(b)、(d)の各々において、横軸は時間、縦軸はレーザー光の強度である。
図7(a)~(d)は、図6(a)~(d)において、レーザー光の1つのパルスに着目した図である。
尚、以下の説明では、「レーザー光発振機102から発振されるレーザー光の制御信号」を「レーザー光の制御信号」と称する。「レーザー光発振機102から発振されたレーザー光が音響光学素子103を通過する前のレーザー光の出力特性」を「音響光学素子103通過前のレーザー光の出力特性」と称する。「レーザー光発振機102から発振されたレーザー光が音響光学素子103を通過した後のレーザー光の出力特性」を「音響光学素子103通過後のレーザー光の出力特性」と称する。
また、複数のパルスが周期的に形成されることに限らず、1つのパルスが長い幅で形成される構成であってもよい。即ち、レーザー光発振機へのON信号からOFF信号まで一定の強度のレーザー光が所定の時間だけ発振される構成であってもよい。
例えば、立ち上がり部分G1の幅は45マイクロ秒であり、立ち下がり部分G2の幅は25マイクロ秒である。
例えば、パルスPs3の前側の谷の部分V1の幅をパルスPs2の立ち上がり部分G1の幅と概ね等しくしたり、パルスPs3の後側の谷の部分V2の幅をパルスPs2の立ち下がり部分の幅よりも大きくしたりする等、必要に応じて適宜調整することができる。
図8の左側の図はピンホール143hを通過する前のレーザー光の強度分布を示す図である。図8の左側上段の図は平面図であり、図8の左側中段の図は斜視図であり、図8の左側下段の図は横軸を位置、縦軸を強度として示す図である。
図8の右側の図はピンホール143hを通過した後のレーザー光の強度分布を示す図である。図8の右側上段の図は平面図であり、図8の右側中段の図は斜視図であり、図8の右側下段の図は横軸を位置、縦軸を強度として示す図である。
本実施形態では、図9に示すように、一例として、レーザー加工ラインWCLが平面視矩形枠状である場合、具体的には、平面視矩形の対象物110を、前記対象物110の4辺に沿って時計回りに矩形枠状にレーザー加工する場合を挙げて説明する。
例えば、対象物110をレーザー加工した後の、レーザー加工ラインWCLよりも内側の矩形部分は、製品等に使用される使用部分AR1である。レーザー加工ラインWCLよりも外側の矩形枠状部分は、使用されない余剰部分AR2である。
ここで、比較例に係るレーザー光照射装置は、レーザー加工ラインWCLに沿ってスキャナーとテーブルとをそのまま相対的に移動させるレーザー光照射装置、即ちレーザー光の移動軌跡UrX(以下、レーザー光移動軌跡ということがある)がレーザー加工ラインWCLに沿った直線状であるレーザー光照射装置である。
図11は、本実施形態に係るレーザー光照射装置を用いて、対象物を切断するときのレーザー光の移動軌跡を示す図である。
図11において、符号Urはレーザー光移動軌跡であり、符号Usはスキャナー105とテーブル101との相対的な移動による移動軌跡を対象物に投影した軌跡(以下、相対移動軌跡ということがある)であり、符号Upはレーザー光移動軌跡Urと相対移動軌跡Usとの重なり部分(以下、重畳部分ということがある)である。
尚、図10及び図11は、図9におけるレーザー加工ラインWCLの破線囲み部分Kの拡大図である。
この場合、対象物を確実に切断するために、レーザー光の出力を大きくしたり切断速度を小さくしたりすると、対象物の切断面に割れや欠け等の欠陥が生じる場合がある。
レーザー加工ラインWCL上には、レーザー光が1回だけ照射される部分とレーザー光が2回重ねて照射される部分(重畳部分Up)とが交互に配置される。重畳部分Upは、レーザー加工ラインWCLに沿ってミシン目状に形成される。
図12は、本実施形態に係るレーザー光移動軌跡の第1変形例を示す図である。
図13は、本実施形態に係るレーザー光移動軌跡の第2変形例を示す図である。
図13では、便宜上、レーザー光移動軌跡Ur2を相対移動軌跡Usと離間して示している。しかし、実際には、レーザー光移動軌跡Ur2は相対移動軌跡Usの一部と重なっている。
図14は、本実施形態に係るレーザー光移動軌跡の第3変形例を示す図である。
図14では、便宜上、レーザー光移動軌跡Ur3を相対移動軌跡Usと離間して2本の直線に分けて示している。しかし、実際には、レーザー光移動軌跡Ur3は相対移動軌跡Usの一部と重なっている。
これに対し、本変形例に係る制御装置は、スキャナー105によってIOR104から射出されたレーザー光を直線的に振動させつつレーザー加工ラインWCLに沿ってスキャナー105とテーブル101とを移動させる制御を行う。
以下、本発明の一実施形態に係る光学部材貼合体の製造装置であるフィルム貼合システム1について図面を参照して説明する。本実施形態に係るフィルム貼合システム1は、切断装置が上述したレーザー光照射装置100によって構成されている。
フィルム貼合システム1は、例えば液晶パネルや有機ELパネルといったパネル状の光学表示部品に、偏光フィルムや反射防止フィルム、光拡散フィルムといったフィルム状の光学部材を貼合するものである。
図15に示すように、本実施形態のフィルム貼合システム1は、図中右側の液晶パネルPの搬送方向上流側(+X方向側)から図中左側の液晶パネルPの搬送方向下流側(-X方向側)に至り、液晶パネルPを水平状態で搬送する駆動式のローラコンベア5を備えている。
ここで、パネル保持部11aによりレールR上を搬送された液晶パネルPは吸着パッド26に吸着された状態でシート片FXmと共に先端部を挟圧ロール23に挟持される。
複数のガイドローラ22bは、原反ロールR1から巻き出した光学シートFXを所定の搬送経路に沿って案内するべく光学シートFXを巻きかける。
切断装置22cは、搬送経路上の光学シートFXにハーフカットを施す。
ナイフエッジ22dは、ハーフカットを施した光学シートFXを鋭角に巻きかけてセパレータF3aから貼合シートF5を分離させつつこの貼合シートF5を貼合位置に供給する。
巻き取り部22eは、ナイフエッジ22dを経て単独となったセパレータF3aを巻き取るセパレータロールR2を保持する。
図19に示すように、切断装置22cは、光学シートFXが所定長さ繰り出された際、光学シートFXの長手方向と直交する幅方向の全幅にわたって、光学シートFXの厚さ方向の一部を切断するハーフカットを行う。本実施形態の切断装置22cは、光学シートFXに対してセパレータF3aとは反対側から光学シートFXに向かって進退可能に設けられている。
第1検出装置41は、例えば図20に示すように、上流側コンベア6の搬送経路上に設置された4箇所の検査領域CAにおいて第1貼合面SA1の端縁EDを検出する。各検査領域CAは、矩形形状を有する第1貼合面SA1の4つの角部に対応する位置に配置されている。端縁EDは、ライン上を搬送される液晶パネルPごとに検出される。第1検出装置41によって検出された端縁EDのデータは、図示しない記憶部に記憶される。
図21においては、便宜上、第1光学部材貼合体PA1の第1シート片F1mが貼合された側を上側とし、第1検出装置41の構成を上下反転して示している。
本実施形態では、貼合面の外周縁に沿って各切断装置31,32によるレーザーカットがなされる。
Claims (6)
- 対象物を保持する保持面を有するテーブルと、
レーザー光を発振するレーザー光発振機と、
前記保持面と平行な平面内で前記レーザー光を二次元に走査するスキャナーと、
前記テーブルと前記スキャナーとを相対的に移動する移動装置と、
前記スキャナーと前記移動装置とを制御する制御装置と、を含み、
前記制御装置は、前記スキャナーによって前記レーザー光を偏向させつつレーザー加工ラインに沿って前記スキャナーと前記テーブルとを相対的に移動させることにより、前記レーザー加工ライン上に、前記レーザー光が複数回重畳して照射される重畳部分を形成するレーザー光照射装置。 - 前記制御装置は、前記スキャナーによって前記レーザー光を回転させつつ前記レーザー加工ラインに沿って前記スキャナーと前記テーブルとを相対的に移動させる
請求項1に記載のレーザー光照射装置。 - 前記スキャナーは、前記レーザー加工ラインよりも外側の余剰部分に向けて前記レーザー光を偏向させる
請求項2に記載のレーザー光照射装置。 - 前記制御装置は、前記スキャナーによって前記レーザー光を前記レーザー加工ラインに沿って直線的に振動させつつ前記レーザー加工ラインに沿って前記スキャナーと前記テーブルとを相対的に移動させる
請求項1に記載のレーザー光照射装置。 - 前記スキャナーから射出されたレーザー光を前記保持面に向けて集光する集光レンズをさらに含む
請求項1に記載のレーザー光照射装置。 - 光学表示部品に光学部材を貼合して形成される光学部材貼合体の製造装置であって、
前記光学表示部品の表示領域よりも大きい光学部材シートを前記光学表示部品に貼り合わせて貼合シートを形成する貼合装置と、
前記光学部材シートにおける前記表示領域との対向部分と前記対向部分の外側の余剰部分とを切り離し、前記光学部材シートから前記表示領域に対応する大きさの前記光学部材を切り出すことで、前記貼合シートから前記光学表示部品及び前記光学表示部品に重なる前記光学部材を含む前記光学部材貼合体を切り出す切断装置と、を含み、
前記切断装置は、請求項1に記載のレーザー光照射装置によって構成され、前記レーザー光照射装置から照射されたレーザー光によって対象物である前記光学部材シートが切断される光学部材貼合体の製造装置。
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