GB0412827D0 - Method for laser machining a workpiece with laser spot enlargement - Google Patents

Method for laser machining a workpiece with laser spot enlargement

Info

Publication number
GB0412827D0
GB0412827D0 GBGB0412827.8A GB0412827A GB0412827D0 GB 0412827 D0 GB0412827 D0 GB 0412827D0 GB 0412827 A GB0412827 A GB 0412827A GB 0412827 D0 GB0412827 D0 GB 0412827D0
Authority
GB
United Kingdom
Prior art keywords
laser
workpiece
spot enlargement
machining
laser spot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GBGB0412827.8A
Other versions
GB2397545B (en
GB2397545A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Electro Scientific Industries Inc
Original Assignee
Electro Scientific Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Scientific Industries Inc filed Critical Electro Scientific Industries Inc
Publication of GB0412827D0 publication Critical patent/GB0412827D0/en
Publication of GB2397545A publication Critical patent/GB2397545A/en
Application granted granted Critical
Publication of GB2397545B publication Critical patent/GB2397545B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/52—Ceramics

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Optical Scanning Systems (AREA)
GB0412827A 2002-01-11 2003-01-10 Method for laser machining a workpiece with laser spot enlargement Expired - Fee Related GB2397545B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US34861302P 2002-01-11 2002-01-11
PCT/US2003/000686 WO2003059568A1 (en) 2002-01-11 2003-01-10 Method for laser machining a workpiece with laser spot enlargement

Publications (3)

Publication Number Publication Date
GB0412827D0 true GB0412827D0 (en) 2004-07-14
GB2397545A GB2397545A (en) 2004-07-28
GB2397545B GB2397545B (en) 2005-05-11

Family

ID=23368777

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0412827A Expired - Fee Related GB2397545B (en) 2002-01-11 2003-01-10 Method for laser machining a workpiece with laser spot enlargement

Country Status (9)

Country Link
JP (1) JP4340745B2 (en)
KR (1) KR100982677B1 (en)
CN (1) CN1299873C (en)
AU (1) AU2003214818A1 (en)
CA (1) CA2469520A1 (en)
DE (1) DE10392185T5 (en)
GB (1) GB2397545B (en)
TW (1) TW564196B (en)
WO (1) WO2003059568A1 (en)

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DE102004059721A1 (en) * 2004-12-11 2006-05-04 Carl Baasel Lasertechnik Gmbh & Co. Kg Irrigation hose has several longitudinal discharge openings formed by sectional grooves in hose wall whereby flow limiter is arranged at inside portion of hose
CN100462181C (en) * 2006-10-30 2009-02-18 西安交通大学 Femto-second laser ture three-D micro-nano-processing center
US7663269B2 (en) * 2006-12-13 2010-02-16 A-Tech Corporation High bandwidth linear actuator for steering mirror applications
DE102007012815B4 (en) 2007-03-16 2024-06-06 Dmg Mori Ultrasonic Lasertec Gmbh Method and device for forming a die
US20090312859A1 (en) * 2008-06-16 2009-12-17 Electro Scientific Industries, Inc. Modifying entry angles associated with circular tooling actions to improve throughput in part machining
TWI594828B (en) 2009-05-28 2017-08-11 伊雷克托科學工業股份有限公司 Acousto-optic deflector applications in laser processing of features in a workpiece, and related laser processing method
DE102009044316B4 (en) 2009-10-22 2015-04-30 Ewag Ag Method for producing a surface and / or edge on a blank and laser processing device for carrying out the method
US8338745B2 (en) * 2009-12-07 2012-12-25 Panasonic Corporation Apparatus and methods for drilling holes with no taper or reverse taper
KR102143502B1 (en) * 2010-10-22 2020-08-13 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 Laser processing systems and methods for beam dithering and skiving
CN102069298A (en) * 2010-12-20 2011-05-25 珠海市铭语自动化设备有限公司 Laser cutting system for plates and cutting processing method thereof
CN102566590B (en) * 2011-03-14 2014-03-26 北京国科世纪激光技术有限公司 Intelligent adjusting system and method for optical element
CN103100797B (en) * 2013-01-23 2015-09-09 刘茂珍 Based on laser assisted microprocessing equipment and the method for adaptive optics
JP5840322B2 (en) * 2013-02-13 2016-01-06 住友化学株式会社 Laser light irradiation apparatus and optical member bonding body manufacturing apparatus
GB2514084B (en) * 2013-02-21 2016-07-27 M-Solv Ltd Method of forming an electrode structure for capacitive touch sensor
GB2511064A (en) 2013-02-21 2014-08-27 M Solv Ltd Method of forming electrode structure for capacitive touch sensor
CN105163897A (en) * 2013-03-15 2015-12-16 伊雷克托科学工业股份有限公司 Coordination of beam angle and workpiece movement for taper control
IT201600070259A1 (en) * 2016-07-06 2018-01-06 Adige Spa Process of laser processing of a metal material with control of the position of the optical axis of the laser with respect to a flow of assistance gas, as well as a machine and computer program for carrying out such a process.
CN107876981B (en) * 2017-11-20 2019-08-20 张家港初恒激光科技有限公司 A kind of follow-on laser welding machining workstation
CN109579690A (en) * 2018-12-04 2019-04-05 天津津航技术物理研究所 A kind of high-precision angular displacement detecting device for fast anti-mirror image stabilization system
CN112122776A (en) * 2020-09-23 2020-12-25 苏州科韵激光科技有限公司 Nonlinear shape processing system and method based on high-speed rotating reflector
KR102497645B1 (en) * 2021-06-23 2023-02-08 인하대학교 산학협력단 Method of laser machine the mold surface
EP4137263A1 (en) * 2021-08-20 2023-02-22 Bystronic Laser AG Support for a transmissive optical element, laser processing device with such support, and process of adjusting the position of a transmissive optical element using such support
CN113897608A (en) * 2021-10-23 2022-01-07 河南省锅炉压力容器安全检测研究院 Laser surface strengthening processing equipment for valve sealing surface

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54116356A (en) * 1978-03-03 1979-09-10 Hitachi Ltd Welding method by laser
FR2577052B1 (en) * 1985-02-05 1988-09-09 Bertin & Cie METHOD AND DEVICE FOR MOVING THE POINT OF IMPACT OF A LASER BEAM ON A WORKPIECE
CZ141893A3 (en) * 1991-01-17 1993-12-15 United Distillers Plc Process and apparatus for marking a moving object
JPH05209731A (en) * 1992-01-31 1993-08-20 Fanuc Ltd Optical-axis adjusting method for laser robot
JP3060813B2 (en) * 1993-12-28 2000-07-10 トヨタ自動車株式会社 Laser processing equipment
JPH0885866A (en) * 1994-09-16 1996-04-02 Sumitomo Metal Mining Co Ltd Production of ito sintered compact
US5847960A (en) * 1995-03-20 1998-12-08 Electro Scientific Industries, Inc. Multi-tool positioning system
US5751585A (en) 1995-03-20 1998-05-12 Electro Scientific Industries, Inc. High speed, high accuracy multi-stage tool positioning system
WO2001074529A2 (en) * 2000-03-30 2001-10-11 Electro Scientific Industries, Inc. Laser system and method for single pass micromachining of multilayer workpieces

Also Published As

Publication number Publication date
TW564196B (en) 2003-12-01
DE10392185T5 (en) 2004-12-02
TW200301718A (en) 2003-07-16
KR100982677B1 (en) 2010-09-17
KR20040073542A (en) 2004-08-19
GB2397545B (en) 2005-05-11
JP4340745B2 (en) 2009-10-07
CA2469520A1 (en) 2003-07-24
WO2003059568A1 (en) 2003-07-24
CN1612793A (en) 2005-05-04
CN1299873C (en) 2007-02-14
AU2003214818A1 (en) 2003-07-30
GB2397545A (en) 2004-07-28
JP2005532908A (en) 2005-11-04

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20100110